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EP0761914A1 - Clé avec circuit électronique intégré et son procédé de fabrication - Google Patents

Clé avec circuit électronique intégré et son procédé de fabrication Download PDF

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Publication number
EP0761914A1
EP0761914A1 EP96305742A EP96305742A EP0761914A1 EP 0761914 A1 EP0761914 A1 EP 0761914A1 EP 96305742 A EP96305742 A EP 96305742A EP 96305742 A EP96305742 A EP 96305742A EP 0761914 A1 EP0761914 A1 EP 0761914A1
Authority
EP
European Patent Office
Prior art keywords
resin material
electronic circuit
lid portion
insertion opening
key device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP96305742A
Other languages
German (de)
English (en)
Other versions
EP0761914B1 (fr
Inventor
Masao Omura
Keiji Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of EP0761914A1 publication Critical patent/EP0761914A1/fr
Application granted granted Critical
Publication of EP0761914B1 publication Critical patent/EP0761914B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07C—TIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
    • G07C9/00—Individual registration on entry or exit
    • G07C9/00174—Electronically operated locks; Circuits therefor; Nonmechanical keys therefor, e.g. passive or active electrical keys or other data carriers without mechanical keys
    • G07C9/00944—Details of construction or manufacture
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
    • E05B19/00—Keys; Accessories therefor
    • E05B19/04—Construction of the bow or head of the key; Attaching the bow to the shank

Definitions

  • the present invention relates to a key device with a built-in electronic circuit chip, and a method of forming the key device with the built-in electronic circuit chip, which is appropriate for use with a burglar prevention unit of automotive vehicle.
  • the key device disclosed in the above publication includes a grip portion integrated with an electronic circuit.
  • a holder which holds the electronic circuit is placed at a grip portion of a metal key plate.
  • the holder includes an upper holder and a lower holder both made of a resin material.
  • a first molding process to cover the periphery of the electronic circuit, held in the holder, with a resin material is performed with a low molding pressure.
  • a second molding process to form the grip portion of the key device having a desired shape and integrate the electronic circuit with the grip portion is performed with a high molding pressure.
  • the key device of the above publication is formed as described above.
  • the electronic circuit held in the holder can be secured to the grip portion without subjecting the electronic circuit to the high molding pressure.
  • the electronic circuit built in the key device suffers the thermal stress during the first and second molding processes.
  • the resin material heated to a high temperature is contacted to the periphery of the electronic circuit, and the electronic circuit suffers the thermal stress considerably.
  • the method of the above publication has a problem in that the electronic circuit may be damaged by the thermal stress during the process of forming the key device.
  • the electronic circuit When the case of the rigid resin material having the opening for inserting the electronic circuit therein is formed at the grip portion, the electronic circuit may be subjected to mechanical stresses due to the thermal deformation of the case. In order to prevent the electronic circuit from being subjected to the mechanical stresses, it is necessary that the case has the opening whose dimensions are slightly greater than dimensions of the electronic circuit.
  • the electronic circuit included in the opening of the case is easily movable. If the second molding process is performed with no restriction of the electronic circuit included in the opening of the case, the electronic circuit may be separated from the case of the key device during the second molding process.
  • the heated resin material may enter the opening of the case so that the electronic circuit is damaged by the thermal stress due to the heated resin material.
  • the two requirements including the prevention of the separation of the electronic circuit and the prevention of the entering of the heated resin material mentioned above can be met by providing the key device with a lid portion which closes the opening of the case prior to the performance of the second molding process.
  • the case, the electronic circuit and the lid portion have dimensional errors which are permissible when manufacturing the electronic circuit built-in key device.
  • the electronic circuit inserted into the opening of the case and enclosed by the lid portion, from being subjected to the mechanical stresses due to the thermal deformation, it is unavoidable to allow the electronic circuit to be loosely fitted to the opening of the case with a certain degree of play.
  • An object of the present invention is to provide an improved electronic circuit built-in key device in which the above-described problems are eliminated.
  • Another object of the present invention is to provide an electronic circuit built-in key device which provides an integrated structure of a key and an electronic circuit chip covered with a non-rigid resin material and a rigid resin material wherein the grip portion is integrated with the electronic circuit chip without play.
  • Still another object of the present invention is to provide a key device forming method which provides an integrated structure of a key and an electronic circuit chip covered with a non-rigid resin material and a rigid resin material wherein the grip portion is integrated with the electronic circuit chip without play.
  • a key device having a grip portion with a built-in electronic circuit chip, which includes: a first portion of a rigid resin material covering the grip portion, the first portion having an insertion opening in which the electronic circuit chip is inserted; a lid portion of a resin material closing the insertion opening of the first portion such that the lid portion is bonded to the electronic circuit chip, the resin material of the lid portion being resilient and thermoplastic; and a second portion of a non-rigid resin material covering the first portion and the lid portion.
  • a key device forming method which includes the steps of: molding a first portion of a rigid resin material so that a grip portion is covered with the first portion, the first portion including an insertion opening; inserting an electronic circuit chip into the insertion opening of the first portion; attaching a lid portion to close the insertion opening in which the electronic circuit chip is inserted, the lid portion being resilient and thermoplastic; and molding a second portion of a non-rigid resin material so that the first portion and the lid portion are covered with the second portion, the lid portion being heated during the molding of the second portion so that the lid portion is bonded to the electronic circuit chip contained in the insertion opening.
  • the key device and the key device forming method of the present invention can prevent the separation of the electronic circuit chip from the key device during the process of forming the key device, and can prevent the entering of the heated resin material into the periphery of the electronic circuit chip during the process of forming the key device.
  • the device and the method of the present invention provide the integrated structure in which the electronic circuit chip, included in the insertion opening of the first portion of the rigid resin material, is held without play by the lid portion which is resilient and thermoplastic.
  • the present invention to meet all the requirements including: (1) to avoid the separation of the electronic circuit chip from the key device during the process of forming the key device, (2) to avoid the influence of thermal stresses over the electronic circuit during the process of forming the key device, (3) to protect the periphery of the electronic circuit chip with a molded portion of a rigid resin material, (4) to snugly fit the electronic circuit chip into the insertion opening of the molded portion without play, and (5) to prevent the electronic circuit from being subjected to mechanical stresses due to thermal deformation of the molded portion.
  • FIG.1 shows an electronic circuit built-in key device 10 in the preferred embodiment of the prevent invention.
  • the electronic circuit built-in key device in the preferred embodiment will be referred to as the key device 10.
  • the key device 10 includes a key plate 12, a first portion 14 of a rigid resin material, an insertion opening 16, a transponder chip 18, a lid portion 20, and a second portion 22 of a non-rigid resin material.
  • the key plate 12 is made of a metal material.
  • the key plate 12 has a grip portion by which the vehicle operator turns the key device 10.
  • the grip portion is covered with the first portion 14 of the rigid resin material.
  • the first portion 14 has the insertion opening 16, and the transponder chip 18 is inserted into the insertion opening 16.
  • the insertion opening 16 into which the transponder chip 18 is inserted is enclosed by the lid portion 20.
  • the first portion 14 of the rigid resin material is covered with the second portion 22 of the non-rigid resin material.
  • the first portion 14 of the rigid resin material protects the transponder chip 18, contained in the insertion opening 16, against impact.
  • the first portion 14 of the rigid resin material prevents the grip portion of the key plate 12 from being excessively deformed when the grip portion is subjected to torsional torque.
  • the rigid resin material of the first portion 14 is polybutylene terephthalate (PBT).
  • the transponder chip 18 is an electronic circuit chip which contains an electronic circuit serially transmitting a signal indicative of a predetermined identification (ID) code of the vehicle owner.
  • ID a predetermined identification
  • the transponder chip 18 transmits the signal to a burglar prevention unit (not shown) of the vehicle.
  • the burglar prevention unit enables the vehicle to start the operation.
  • the lid portion 20 closes the insertion opening 16 in which the transponder chip 16 is inserted.
  • the lid portion 20 is made of a resin material which is resilient and thermoplastic.
  • the resin material of the lid portion 20 is polyester elastomer having a melting point of 154°C.
  • the second portion 22 of the non-rigid resin material provides the vehicle operator with a soft feeling when the vehicle operator touches the grip portion of the key device 10.
  • the second portion 22 protects the grip portion of the key device 10 against impact.
  • the second portion 22 in the present embodiment must be elastic and flexible, and must have a thickness that is greater than 2 mm.
  • the non-rigid resin material of the second portion 22 is flexible polyvinyl chloride (PVC).
  • FIG.2 is a side view of the key device 10 in FIG.1.
  • FIG.3 is a cross-sectional view of the key device 10 taken along a line III-III shown in FIG.2.
  • the key plate 12 is an L-shaped metal member.
  • the key plate 12 includes a longitudinal blade 12a and a base 12b.
  • the blade 12a is notched or grooved to form a key groove.
  • the base 12b is covered with the first portion 14 of the rigid resin material as shown in FIG.2. Since the key plate 12 is the L-shaped metal member, when the key device 10, inserted in the key cylinder of the vehicle, is turned, the rotational torque applied by the vehicle operator to the grip portion of the key device is effectively transmitted to the key cylinder via the longitudinal blade 12a.
  • the key plate 12 has a through hole 12c which is located at the center of the grip portion of the key device 10.
  • the first portion 14 of the rigid resin material is formed such that the through hole 12c is not closed by the rigid resin material.
  • the first portion 14 has the insertion opening 16 on the side of the key plate 12.
  • the insertion opening 16 has a width "W” and a height "H” which are slightly greater than a width and a height of the transponder chip 18 by a predetermined difference, respectively.
  • the difference between the width W of the opening 16 and the width of the chip 18, and the difference between the height H of the opening 16 and the height of the chip 18 are predetermined such that the transponder chip 18 does not interfere with the first portion 14 when the dimensions of the first portion 14 and the dimensions of the transponder chip 18 vary due to thermal deformation or degradation.
  • the above dimensional differences avoid that excessively great stresses of the first portion 14 exert on the transponder chip 18 in the insertion opening 16.
  • FIG.4 is a cross-sectional view of the key device 10 in which the transponder chip 18 is inserted.
  • the insertion opening 16 has a slanting end surface 16a with which the transponder chip 18 is brought into contact.
  • the transponder chip 18 has a slanting end surface 18a which is contacted with the slanting end surface 16a of the insertion opening 16.
  • the shape of the slanting end surface 16a corresponds to the shape of the slanting end surface 18a.
  • the transponder chip 18 When the transponder chip 18 is pushed inward until the slanting end surface 16a of the insertion opening 16 is reached, the position of the transponder chip 18 relative to the insertion opening 16 is adjusted so that the slanting end surface 18a and the slanting end surface 16a are fitted to each other. When the slanting end surface 18a and the slanting end surface 16a are fitted to each other, the transponder chip 18 is located at the center of the insertion opening 16 in the direction of the width W of the insertion opening 16.
  • FIG.5 is a front view of the lid portion 20.
  • FIG.6 is a cross-sectional view of the lid portion 20 taken along a line VI-VI shown in FIG.5.
  • the lid portion 20 is attached to the insertion opening 16 so that the lid portion 20 is contacted to the transponder chip 18.
  • the lid portion 20 has a width and a height which are slightly greater than the width W and the height H of the insertion opening 16, respectively. Accordingly, when the lid portion 20 is attached to the insertion opening 16, the insertion opening 16 in which the transponder chip 18 is inserted is enclosed by the lid portion 20.
  • the lid portion 20 has a recess 20a which is located in the middle of a side surface of the lid portion 20 contacted to the transponder chip 18.
  • the lid portion 20 has a peripheral edge 20b which is located on the periphery of the recess 20a.
  • the heat capacity of the lid portion 20 is reduced.
  • the temperature of the lid portion 20 having the recess 20a can be increased by a smaller quantity of heat than a quantity of heat needed to increase the temperature of the solid lid portion having no recess.
  • the lid portion 20 is formed with the peripheral edge 20b which surrounds the recess 20a, the resistance of the peripheral edge 20b to deformation is reduced.
  • the peripheral edge 20b of the lid portion 20 is readily deformable to conform with the shape of the transponder chip 18 when the lid portion 20 is contacted to the transponder chip 18.
  • FIG.7 shows the key device 10 in which the grip portion is placed within a mold 24.
  • the mold 24 is used for a second molding process to form the second portion 22 of the non-rigid resin material.
  • the second portion 22 covers the first portion 14 and the lid portion 20 after the second molding process is performed.
  • the heated non-rigid resin material (the PVC) is injected into the mold 24.
  • the first portion 14 of the rigid resin material within the mold 24 be subjected to a high pressure and a high temperature of the heated non-rigid resin material injected in the second molding process.
  • the lid portion 22 is attached to the insertion opening 16 prior to the second molding process of the second portion 22. Accordingly, it is possible for the present embodiment to effectively prevent the transponder chip 18 from being separated from the insertion opening 16 due to the high pressure of the heated non-rigid resin material, although the size of the insertion opening 16 is greater than the size of the transponder chip 18.
  • the lid portion 20 prevents the heated non-rigid resin material from entering the insertion opening 16 in which the transponder chip 18 is inserted. Accordingly, it is possible for the present embodiment to effectively reduce the influence of the thermal stress over the transponder chip 18 during the second molding process.
  • the second molding process of the second portion 22 in the present embodiment is performed with a molding temperature of 170°C.
  • the resin material of the lid portion 20 is resilient and thermoplastic.
  • the polyester elastomer having a melting point of 154°C which is below the molding temperature of the second molding process is used as the resin material of the lid portion 20. Accordingly, the lid portion 20 of the resin material becomes soft during the second molding process of the second portion 22.
  • the mold 24 has a gate 26 through which the heated non-rigid resin material is injected.
  • the gate 26 of the mold 24 is arranged adjacent to the lid portion 20 of the key device 10.
  • the non-rigid resin in the vicinity of the gate 26 which has just been injected to the mold 24 has a highest temperature. The greater the distance of the non-rigid resin from the gate 26 is, the lower the temperature of the non-rigid resin is. Since the gate 26 of the mold 24 is arranged adjacent to the lid portion 20, the non-rigid resin having the highest temperature can be contacted to the lid portion 20. Thus, it is possible that the lid portion 20 is made immediately soft when the non-rigid resin material is injected to the mold 24.
  • the lid portion 20 has the recess 20a and the quantity of the resin material in the lid portion 20 is reduced.
  • the heat capacity of the lid portion 20 is decreased by the reduction of the quantity of the resin material. Therefore, it is possible for the present embodiment to make the lid portion 20 soft enough when the second molding process of the second portion 22 is performed.
  • the lid portion 20 is pushed toward the insertion opening 16 due to the molding pressure during the process of the second molding of the second portion 22. Since the lid portion 20 is pushed against the transponder chip 18 and the lid portion 20 is made sufficiently soft, the lid portion 20 is bonded to the transponder chip 18. At the same time, the peripheral edge 20b is included in an internal space between the transponder chip 18 and a side wall of the insertion opening 16. Accordingly, when the second molding of the second portion 22 is completed, the transponder chip 22 can be snugly fitted to the insertion opening 16 of the first portion 14 without play.
  • the transponder chip 18 is pushed inward until the slanting end surface 16a of the insertion opening 16 is reached, the position of the transponder chip 18 relative to the insertion opening 16 is adjusted so that the slanting end surface 18a and the slanting end surface 16a are fitted to each other.
  • the transponder chip 18 is located at the center of the insertion opening 16 in the direction of the width W thereof.
  • the transponder chip 18 Since the molding pressure during the second molding of the second portion 22 is exerted on the lid portion 20, the transponder chip 18 is fixed at the center of the insertion opening 16 in the direction of the width W thereof, and at the same time there is no interference between the transponder chip 18 and the side wall of the insertion opening 16.
  • the lid portion 20 absorbs the mechanical or thermal deformation of the first portion 14 of the rigid resin material, if occurred, and prevents the transponder chip 18 from being subjected to mechanical stresses due to such deformation of the first portion 14.
  • the mold 24 used for the second molding of the second portion 22 has no insert which is inserted into the through-hole 12c of the key plate 12.
  • the non-rigid resin material, injected to the mold 24, can enter the through-hole 12c as well as the second portion 22.
  • the PBT as the rigid resin material of the first portion 14 and the PVC as the non-rigid resin material of the second portion 22 do not easily adhere to each other. Generally, it is difficult to eliminate the deviation between the first portion 14 and the second portion 22 by covering the periphery of the first portion 14 of the rigid resin with the second portion 22 of the non-rigid resin.
  • the non-rigid resin injected to the mold 24 enters the through-hole 12c when the second molding of the second portion 22 is performed. Since the through-hole 12c passes through the first portion 14 and the key plate 12, it is possible that the non-rigid resin material contained in the through-hole 12c (which is located at the center of the grip portion of the key plate 12) adheres to both the first portion 14 (the PBT) and the second portion 22 (the PVC). Accordingly, it is possible for the present embodiment to prevent the deviation between the first portion 14 and the second portion 22 from becoming excessively great.
  • the polyester elastomer is used as the resin material of the lid portion 20.
  • the lid portion 20 according to the present invention may be made of a resin material which is resilient and thermoplastic enough to avoid the influence of mechanical stresses over the transponder chip 18 in the insertion opening 16 when the first portion 14 is subjected to thermal deformation.
  • the molding temperature of the second portion 22 is higher than the melting point of the resin material of the lid portion 20.
  • the molding temperature of the second portion 22 according to the present invention may be higher than a temperature at which the lid portion 20 readily becomes soft.
  • the molding temperature of the second portion 22 is not necessarily higher than the melting point of the resin material of the lid portion 20.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Lock And Its Accessories (AREA)
  • Manufacture Of Switches (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
EP19960305742 1995-08-23 1996-08-05 Clé avec circuit électronique intégré et son procédé de fabrication Expired - Lifetime EP0761914B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP21501095 1995-08-23
JP215010/95 1995-08-23
JP21501095A JP3149742B2 (ja) 1995-08-23 1995-08-23 電子回路内蔵キーの構造及び成形方法

Publications (2)

Publication Number Publication Date
EP0761914A1 true EP0761914A1 (fr) 1997-03-12
EP0761914B1 EP0761914B1 (fr) 1999-10-20

Family

ID=16665227

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19960305742 Expired - Lifetime EP0761914B1 (fr) 1995-08-23 1996-08-05 Clé avec circuit électronique intégré et son procédé de fabrication

Country Status (3)

Country Link
EP (1) EP0761914B1 (fr)
JP (1) JP3149742B2 (fr)
DE (1) DE69604755T2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0942130A3 (fr) * 1998-03-07 2001-01-03 BKS GmbH Clé pour serrure cylindrique
EP3372758A1 (fr) * 2017-03-08 2018-09-12 Huf Hülsbeck & Fürst GmbH & Co. KG Clé de véhicule automobile

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018203550A1 (de) * 2018-03-08 2019-09-12 Aug. Winkhaus Gmbh & Co. Kg Schlüssel und Verfahren zur Herstellung eines aus Metall gefertigten Schlüssels

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0648589A1 (fr) * 1993-10-19 1995-04-19 TRW SIPEA S.p.A. Procédé de fabrication d'une clé, notamment une clé de contact d'un véhicule, et clé ainsi fabriquée

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0648589A1 (fr) * 1993-10-19 1995-04-19 TRW SIPEA S.p.A. Procédé de fabrication d'une clé, notamment une clé de contact d'un véhicule, et clé ainsi fabriquée

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0942130A3 (fr) * 1998-03-07 2001-01-03 BKS GmbH Clé pour serrure cylindrique
EP3372758A1 (fr) * 2017-03-08 2018-09-12 Huf Hülsbeck & Fürst GmbH & Co. KG Clé de véhicule automobile

Also Published As

Publication number Publication date
EP0761914B1 (fr) 1999-10-20
DE69604755D1 (de) 1999-11-25
JPH0960363A (ja) 1997-03-04
DE69604755T2 (de) 2000-09-07
JP3149742B2 (ja) 2001-03-26

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