EP0737760A1 - Platinum electroplating bath - Google Patents
Platinum electroplating bath Download PDFInfo
- Publication number
- EP0737760A1 EP0737760A1 EP96102799A EP96102799A EP0737760A1 EP 0737760 A1 EP0737760 A1 EP 0737760A1 EP 96102799 A EP96102799 A EP 96102799A EP 96102799 A EP96102799 A EP 96102799A EP 0737760 A1 EP0737760 A1 EP 0737760A1
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- EP
- European Patent Office
- Prior art keywords
- acid
- platinum
- complex
- amine
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims abstract description 61
- 229910052697 platinum Inorganic materials 0.000 title claims abstract description 30
- 238000009713 electroplating Methods 0.000 title abstract 2
- 239000002253 acid Substances 0.000 claims abstract description 15
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 9
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims abstract description 8
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 claims abstract description 8
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003792 electrolyte Substances 0.000 claims abstract description 7
- 238000006243 chemical reaction Methods 0.000 claims abstract description 3
- 239000000080 wetting agent Substances 0.000 claims abstract description 3
- 230000008021 deposition Effects 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 4
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 3
- 238000000151 deposition Methods 0.000 abstract description 7
- -1 amine sulphamate Chemical class 0.000 abstract description 6
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 abstract 1
- 150000004985 diamines Chemical class 0.000 abstract 1
- 235000011149 sulphuric acid Nutrition 0.000 abstract 1
- 239000001117 sulphuric acid Substances 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical class CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 3
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- GKNWQHIXXANPTN-UHFFFAOYSA-N 1,1,2,2,2-pentafluoroethanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)F GKNWQHIXXANPTN-UHFFFAOYSA-N 0.000 description 1
- WLXGQMVCYPUOLM-UHFFFAOYSA-N 1-hydroxyethanesulfonic acid Chemical compound CC(O)S(O)(=O)=O WLXGQMVCYPUOLM-UHFFFAOYSA-N 0.000 description 1
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001447 alkali salts Chemical class 0.000 description 1
- SUMDYPCJJOFFON-UHFFFAOYSA-N beta-hydroxyethanesulfonic acid Natural products OCCS(O)(=O)=O SUMDYPCJJOFFON-UHFFFAOYSA-N 0.000 description 1
- ABDBNWQRPYOPDF-UHFFFAOYSA-N carbonofluoridic acid Chemical class OC(F)=O ABDBNWQRPYOPDF-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- UQSQSQZYBQSBJZ-UHFFFAOYSA-N fluorosulfonic acid Chemical compound OS(F)(=O)=O UQSQSQZYBQSBJZ-UHFFFAOYSA-N 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- OPUAWDUYWRUIIL-UHFFFAOYSA-N methanedisulfonic acid Chemical compound OS(=O)(=O)CS(O)(=O)=O OPUAWDUYWRUIIL-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- HRGDZIGMBDGFTC-UHFFFAOYSA-N platinum(2+) Chemical compound [Pt+2] HRGDZIGMBDGFTC-UHFFFAOYSA-N 0.000 description 1
- NDBYXKQCPYUOMI-UHFFFAOYSA-N platinum(4+) Chemical class [Pt+4] NDBYXKQCPYUOMI-UHFFFAOYSA-N 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
- VYECFMCAAHMRNW-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O.NS(O)(=O)=O VYECFMCAAHMRNW-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
Definitions
- the invention relates to a galvanic platinum bath, in particular for the deposition of thick layers, which contains 5 to 30 g / l of platinum as amine sulfamato complex and has a pH of less than 1.
- Acidic and alkaline baths based on platinum (II) and platinum (IV) compounds are used for the galvanic deposition of platinum.
- the most important bath types contain diamminodinitritoplatinic acid (II) (P salt), sulfatodinitritoplatinic acid (DNS) or hexahydroxoplatinic acid, or their alkali salts.
- the bath types mentioned are mainly only suitable for the deposition of thin platinum layers of a few ⁇ m.
- the deposition of thick layers for technical applications is a general problem with platinum. Either the layers have high internal stresses, become cracked and even burst, or the electrolytes are not sufficiently stable and decompose relatively quickly during the long electrolysis times.
- an acid bath for the electrodeposition of platinum coatings which consists of an aqueous solution of a complex dinitroplatinate (II) compound and has a pH below 2.
- the dinitrosulfamato complex can also be used as a complex platinum compound. According to their own information, these platinum baths only give layers up to 25 ⁇ m thick. Layers over 25 ⁇ m tend to crack and are therefore not suitable for many applications.
- DE-PS 12 56 992 describes a galvanic platinum bath which consists of an aqueous solution of Platinum diamminodinitrite (P salt) and alkali metal salts of sulfamic acid exist and are operated at pH values from 6.5 to 8. Here, too, you get only layer thicknesses of up to about 20 ⁇ m. However, the pH must be kept constant within narrow limits. At pH values below 3, the platinum layer will come off again.
- P salt Platinum diamminodinitrite
- alkali metal salts of sulfamic acid exist and are operated at pH values from 6.5 to 8.
- P salt Platinum diamminodinitrite
- alkali metal salts of sulfamic acid exist and are operated at pH values from 6.5 to 8.
- the pH must be kept constant within narrow limits. At pH values below 3, the platinum layer will come off again.
- the P salt is reacted with a large excess of sulfamic acid, NH 2 SO 3 H, so that a diluted bath with 6-20 g / l platinum and 20 Contains -100 g / l sulfamic acid (amidosulfuric acid).
- this electrolyte is only stable as long as the bath is in operation. Thick layers can only be obtained without cracks with a matt surface.
- the electrolyte contains at most 5 g / l of free amidosulfuric acid (sulfamic acid) and 20 to 400 g / l of a strong acid with a pH value less than 1.
- Sulfuric acid, methanesulfonic acid or perchloric acid is preferably used as the strong acid.
- other mineral acids such as fluorosulfuric acid or fluoroboric acid, alkanesulfonic acids, such as methanedisulfonic acid, ethanesulfonic acid, hydroxyethanesulfonic acid and homologues, or perfluorinated alkanesulfonic acids, such as trifluoromethanesulfonic acid or pentafluoroethanesulfonic acid, and perfluorocarboxylic acids, such as trifluoroacetic acid, can also be used.
- the electrolyte additionally contains 0.01 to 0.2 g / l of a fluorosurfactant as a wetting agent.
- the bath may also contain 0.01-0.2 g / l of a fluorosurfactant to suppress spray. It is operated at a temperature between 60 and 90 ° C and at current densities of 1-4 A / dm 2 .
- the platinum amine sulfamato complex solution proved to be surprisingly stable in the strongly acidic bath without free amidosulfuric acid.
- the bath showed no precipitation even with long electrolysis times.
- sulfamate is rapidly hydrolyzed and does not accumulate in the electrolyte.
- the platinum coatings deposited from these baths are crack-free, shiny and ductile even with layer thicknesses over 100 ⁇ m.
- a galvanic platinum bath is prepared as follows: 80 ml of sulfuric acid (97%) are diluted in approx. 600 ml of water. This solution contains 16 g of platinum in the form of Platinum amine sulfamato complex solution and 0.1 g of a fluorosurfactant added. After filling with water, 1 l of the finished bath is obtained. At a bath temperature of 80 ° C and a current density of 2 A / dm 2 , a part made of silver is coated while rotating. After approx. 13 hours, an approx. 120 ⁇ m thick, shiny platinum layer has deposited evenly. After removing the silver with nitric acid, diluted 1: 1, a stable, crack-free platinum foil is obtained.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
Die Erfindung betrifft ein galvanisches Platinbad, insbesondere zur Abscheidung dicker Schichten, das 5 bis 30 g/l Platin als Amminsulfamato-Komplex enthält und einen pH-Wert von weniger als 1 aufweist.The invention relates to a galvanic platinum bath, in particular for the deposition of thick layers, which contains 5 to 30 g / l of platinum as amine sulfamato complex and has a pH of less than 1.
Für die galvanische Abscheidung von Platin werden saure und alkalische Bäder auf der Basis von Platin(II)- und Platin(IV)-Verbindungen verwendet. Die wichtigsten Badtypen enthalten Diamminodinitritoplatin(II) (P-Salz), Sulfatodinitritoplatinsäure (DNS) oder Hexahydroxoplatinsäure, beziehungsweise deren Alkalisalze. Die genannten Badtypen eignen sich überwiegend nur für die Abscheidung dünner Platinschichten von wenigen µm. Die Abscheidung dicker Schichten für technische Anwendungen ist bei Platin ein generelles Problem. Entweder die Schichten haben hohe innere Spannungen, werden rissig und platzen sogar auf, oder die Elektrolyte sind nicht ausreichend stabil und zersetzen sich bei den langen Elektrolysezeiten relativ rasch.Acidic and alkaline baths based on platinum (II) and platinum (IV) compounds are used for the galvanic deposition of platinum. The most important bath types contain diamminodinitritoplatinic acid (II) (P salt), sulfatodinitritoplatinic acid (DNS) or hexahydroxoplatinic acid, or their alkali salts. The bath types mentioned are mainly only suitable for the deposition of thin platinum layers of a few µm. The deposition of thick layers for technical applications is a general problem with platinum. Either the layers have high internal stresses, become cracked and even burst, or the electrolytes are not sufficiently stable and decompose relatively quickly during the long electrolysis times.
Aus der DE-PS 11 82 924 ist ein saures Bad zum galvanischen Abscheiden von Platinüberzügen bekannt, das aus einer wässrigen Lösung einer komplexen Dinitroplatinat(II)-Verbindung besteht und einen pH-Wert unter 2 aufweist. Als komplexe Platinverbindung kann auch der Dinitrosulfamatokomplex eingesetzt werden. Nach eigenen Angaben erhält man mit diesen Platinbädern nur Schichtdicken bis zu 25 µm. Schichten über 25 µm neigen zum Reißen und sind daher für viele Anwendungen nicht geeignet.From DE-PS 11 82 924 an acid bath for the electrodeposition of platinum coatings is known, which consists of an aqueous solution of a complex dinitroplatinate (II) compound and has a pH below 2. The dinitrosulfamato complex can also be used as a complex platinum compound. According to their own information, these platinum baths only give layers up to 25 µm thick. Layers over 25 µm tend to crack and are therefore not suitable for many applications.
In der DE-PS 12 56 992 wird ein galvanisches Platinbad beschrieben, das aus einer wässrigen Lösung von Platindiamminodinitrit (P-Salz) und Alkalisalzen der Sulfamidsäure besteht und bei pH-Werten von 6,5 bis 8 betrieben wird. Auch hier bekommt man nach eigenen Angaben nur Schichtdicken bis zu etwa 20 µm. Allerdings muß der pH-Wert in engen Grenzen konstant gehalten werden. Bei pH-Werten unterhalb 3 löst sich die Platinschicht wieder ab.DE-PS 12 56 992 describes a galvanic platinum bath which consists of an aqueous solution of Platinum diamminodinitrite (P salt) and alkali metal salts of sulfamic acid exist and are operated at pH values from 6.5 to 8. Here, too, you get only layer thicknesses of up to about 20 µm. However, the pH must be kept constant within narrow limits. At pH values below 3, the platinum layer will come off again.
Nach der DE-AS 11 44 074 wird das P-Salz mit einem hohen Überschuß an Sulfamidsäure, NH2SO3H, umgesetzt, so daß man nach Verdünnen mit Wasser ein gebrauchsfertiges Bad erhält, das 6-20 g/l Platin und 20-100 g/l Sulfamidsäure (Amidoschwefelsäure)enthält. Jedoch ist dieser Elektrolyt nur so lange stabil, wie das Bad in Betrieb ist. Dicke Schichten können rißfrei nur mit matter Oberfläche erhalten werden.According to DE-AS 11 44 074, the P salt is reacted with a large excess of sulfamic acid, NH 2 SO 3 H, so that a diluted bath with 6-20 g / l platinum and 20 Contains -100 g / l sulfamic acid (amidosulfuric acid). However, this electrolyte is only stable as long as the bath is in operation. Thick layers can only be obtained without cracks with a matt surface.
Es war daher Aufgabe der vorliegenden Erfindung, ein galvanisches Platinbad insbesondere zur Abscheidung dicker Schichten zu entwickeln, das 5 bis 30 g/l Platin als Amminsulfamato-Komplex enthält und einen pH-Wert von weniger als 1 aufweist, mit dem auch Schichtdicken über 100 µm rißfrei, glatt und glänzend abgeschieden werden können und das auch bei Nichtbenutzung stabil ist.It was therefore an object of the present invention to develop a galvanic platinum bath, in particular for depositing thick layers, which contains 5 to 30 g / l of platinum as amine sulfamato complex and has a pH of less than 1, with which layer thicknesses of more than 100 μm are also possible can be deposited without cracks, smooth and shiny and that is stable even when not in use.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß der Elektrolyt höchstens 5 g/l freie Amidoschwefelsäure (Sulfamidsäure) und 20 bis 400 g/l einer starken Säure mit einem pH-Wert kleiner 1 enthält.This object is achieved in that the electrolyte contains at most 5 g / l of free amidosulfuric acid (sulfamic acid) and 20 to 400 g / l of a strong acid with a pH value less than 1.
Vorzugsweise wird als starke Säure Schwefelsäure, Methansulfonsäure oder Perchlorsäure eingesetzt. Daneben können auch andere Mineralsäuren, wie Fluorschwefelsäure oder Fluoroborsäure, Alkansulfonsäuren, wie Methandisulfonsäure, Ethansulfonsäure, Hydroxiethansulfonsäure und Homologe, oder perfluorierte Alkansulfonsäuren, wie Trifluormethansulfonsäure oder Pentafluorethansulfonsäure, und Perfluorcarbonsäuren, wie Trifluoressigsäure, eingesetzt werden.Sulfuric acid, methanesulfonic acid or perchloric acid is preferably used as the strong acid. In addition, other mineral acids, such as fluorosulfuric acid or fluoroboric acid, alkanesulfonic acids, such as methanedisulfonic acid, ethanesulfonic acid, hydroxyethanesulfonic acid and homologues, or perfluorinated alkanesulfonic acids, such as trifluoromethanesulfonic acid or pentafluoroethanesulfonic acid, and perfluorocarboxylic acids, such as trifluoroacetic acid, can also be used.
Außerdem ist es von Vorteil, wenn der Elektrolyt zusätzlich 0,01 bis 0,2 g/l eines Fluortensids als Netzmittel enthält.It is also advantageous if the electrolyte additionally contains 0.01 to 0.2 g / l of a fluorosurfactant as a wetting agent.
Bewährt hat es sich, wenn als Amminsulfamato-Komplex das Produkt aus der Umsetzung von 1 Mol P-Salz (Platindiamminodinitrito-Komplex) mit 4 bis 6 Mol Amidoschwefelsäure eingesetzt wird.It has proven useful if the product from the reaction of 1 mol of P salt (platinum diamminodinitrito complex) with 4 to 6 mol of amidosulfuric acid is used as the amine sulfamato complex.
Sehr gute Abscheideergebnisse erhält man, wenn das Platin-P-Salz mit Amidoschwefelsäure in äquivalenten Mengen umgesetzt wird und die resultierende Platinsulfamato-Komplexlösung einer wäßrigen Lösung einer starken Säure zugegeben wird, wobei die Säure z.B. Schwefelsäure, Methansulfonsäure oder Perchlorsäure sein kann. Dabei muß das Bad eine ausreichende Menge der starken Säure enthalten. Bewährt haben sich Mengen von 20 bis 400 g/l.Very good deposition results are obtained when the platinum P salt is reacted with amidosulfuric acid in equivalent amounts and the resulting platinum sulfamato complex solution is added to an aqueous solution of a strong acid, the acid e.g. Can be sulfuric acid, methanesulfonic acid or perchloric acid. The bath must contain a sufficient amount of the strong acid. Quantities of 20 to 400 g / l have proven effective.
Das Bad kann außerdem 0,01-0,2 g/l eines Fluortensids zur Unterdrückung von Sprühnebeln enthalten. Es wird bei Temperatur zwischen 60 und 90° C und bei Stromdichten von 1-4 A/dm2 betrieben.The bath may also contain 0.01-0.2 g / l of a fluorosurfactant to suppress spray. It is operated at a temperature between 60 and 90 ° C and at current densities of 1-4 A / dm 2 .
Die Platinamminsulfamato-Komplexlösung erwies sich in dem stark sauren Bad ohne freie Amidoschwefelsäure als überraschend stabil. Das Bad zeigte auch bei langen Elektrolysezeiten keinerlei Niederschlagsbildung. Bei der Abscheidung des Platins freiwerdendes Sulfamat wird rasch hydrolysiert und reichert sich nicht im Elektrolyten an.The platinum amine sulfamato complex solution proved to be surprisingly stable in the strongly acidic bath without free amidosulfuric acid. The bath showed no precipitation even with long electrolysis times. When the platinum is released, sulfamate is rapidly hydrolyzed and does not accumulate in the electrolyte.
Die aus diesen Bädern abgeschiedenen Platinüberzüge sind rißfrei, glänzend und duktil auch bei Schichtdicken über 100 µm.The platinum coatings deposited from these baths are crack-free, shiny and ductile even with layer thicknesses over 100 µm.
Folgendes Beispiel zeigt die Vorteile des erfindungsgemäßen Bades:
Ein galvanisches Platinbad wird wie folgt bereitet:
80 ml Schwefelsäure (97 %) werden in ca. 600 ml Wasser verdünnt. Dieser Lösung werden 16 g Platin in Form der Platinamminsulfamato-Komplexlösung und 0,1 g eines Fluortensids zugegeben. Nach Auffüllen mit Wasser erhält man 1 l fertiges Bad. Bei einer Badtemperatur von 80° C und einer Stromdichte von 2 A/dm2 wird ein Teil aus Silber bei rotierender Bewegung beschichtet. Nach ca. 13 Stunden hat sich eine ca. 120 µm dicke, glänzende Platinschicht gleichmäßig abgeschieden. Nach Ablösen des Silbers mit Salpetersäure, verdünnt 1:1, erhält man eine stabile, rißfreie Platinfolie.The following example shows the advantages of the bath according to the invention:
A galvanic platinum bath is prepared as follows:
80 ml of sulfuric acid (97%) are diluted in approx. 600 ml of water. This solution contains 16 g of platinum in the form of Platinum amine sulfamato complex solution and 0.1 g of a fluorosurfactant added. After filling with water, 1 l of the finished bath is obtained. At a bath temperature of 80 ° C and a current density of 2 A / dm 2 , a part made of silver is coated while rotating. After approx. 13 hours, an approx. 120 µm thick, shiny platinum layer has deposited evenly. After removing the silver with nitric acid, diluted 1: 1, a stable, crack-free platinum foil is obtained.
Claims (4)
dadurch gekennzeichnet,
daß der Elektrolyt höchstens 5 g/l freie Amidoschwefelsäure und 20 bis 400 g/l einer starken Säure mit einem pH-Wert kleiner 1 enthält.Galvanic platinum bath, in particular for the deposition of thick layers, which contains 5 to 30 g / l platinum as amine sulfamato complex and has a pH of less than 1,
characterized,
that the electrolyte contains at most 5 g / l of free amidosulfuric acid and 20 to 400 g / l of a strong acid with a pH of less than 1.
dadurch gekennzeichnet,
daß als starke Säure Schwefelsäure, Methansulfonsäure oder Perchlorsäure eingesetzt wird.Galvanic platinum bath according to claim 1,
characterized,
that sulfuric acid, methanesulfonic acid or perchloric acid is used as the strong acid.
dadurch gekennzeichnet,
daß es 0,01 bis 0,2 g/l eines Fluortensids als Netzmittel enthält.Galvanic platinum bath according to claim 1 or 2,
characterized,
that it contains 0.01 to 0.2 g / l of a fluorosurfactant as a wetting agent.
dadurch gekennzeichnet,
daß als Ammin-sulfamato-Komplex das Produkt aus der Umsetzung von 1 Mol Diamminodinitritoplatin(II) mit 4 bis 6 Mol Amidoschwefelsäure eingesetzt wird.Galvanic platinum bath according to claim 1,
characterized,
that the product from the reaction of 1 mole of diamminodinitritoplatinum (II) with 4 to 6 moles of amidosulfuric acid is used as the amine-sulfamato complex.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19514253 | 1995-04-15 | ||
| DE19514253 | 1995-04-15 | ||
| DE19547900 | 1995-12-21 | ||
| DE19547900A DE19547900C2 (en) | 1995-04-15 | 1995-12-21 | Galvanic platinum bath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0737760A1 true EP0737760A1 (en) | 1996-10-16 |
| EP0737760B1 EP0737760B1 (en) | 2000-04-19 |
Family
ID=26014434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP96102799A Expired - Lifetime EP0737760B1 (en) | 1995-04-15 | 1996-02-24 | Platinum electroplating bath |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5620583A (en) |
| EP (1) | EP0737760B1 (en) |
| JP (1) | JPH08319595A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022129461A1 (en) | 2020-12-18 | 2022-06-23 | Umicore Galvanotechnik Gmbh | Stabilization of the deposition rate of platinum electrolytes |
| DE102021107826A1 (en) | 2021-03-29 | 2022-09-29 | Umicore Galvanotechnik Gmbh | platinum electrolyte |
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|---|---|---|---|---|
| US6294425B1 (en) | 1999-10-14 | 2001-09-25 | Samsung Electronics Co., Ltd. | Methods of forming integrated circuit capacitors by electroplating electrodes from seed layers |
| US20020000380A1 (en) * | 1999-10-28 | 2002-01-03 | Lyndon W. Graham | Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpiece |
| KR100331570B1 (en) | 2000-06-13 | 2002-04-06 | 윤종용 | Method for manufacturing capacitor of semiconductor memory device using electroplating method |
| US7150820B2 (en) * | 2003-09-22 | 2006-12-19 | Semitool, Inc. | Thiourea- and cyanide-free bath and process for electrolytic etching of gold |
| US20050230262A1 (en) * | 2004-04-20 | 2005-10-20 | Semitool, Inc. | Electrochemical methods for the formation of protective features on metallized features |
| FR2974582A1 (en) * | 2011-04-27 | 2012-11-02 | Commissariat Energie Atomique | PROCESS FOR GROWING METALLIC PARTICLES BY ELECTRODEPOSITION WITH IN SITU INHIBITION |
| GB201200482D0 (en) * | 2012-01-12 | 2012-02-22 | Johnson Matthey Plc | Improvements in coating technology |
| US10612149B1 (en) | 2019-09-05 | 2020-04-07 | Chow Sang Sang Jewellery Company Limited | Platinum electrodeposition bath and uses thereof |
| TWI784601B (en) | 2021-01-08 | 2022-11-21 | 日商Ｅｅｊａ股份有限公司 | Platinum electroplating baths and platinum-plated products |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0358375A1 (en) * | 1988-09-07 | 1990-03-14 | Johnson Matthey Public Limited Company | Platinum or platinum alloy plating bath |
| JPH04297592A (en) * | 1991-03-25 | 1992-10-21 | Tanaka Kikinzoku Kogyo Kk | Platinum electroplating bath |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL123540C (en) * | 1958-08-06 |
-
1996
- 1996-02-24 EP EP96102799A patent/EP0737760B1/en not_active Expired - Lifetime
- 1996-03-27 US US08/624,806 patent/US5620583A/en not_active Expired - Fee Related
- 1996-04-11 JP JP8089750A patent/JPH08319595A/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0358375A1 (en) * | 1988-09-07 | 1990-03-14 | Johnson Matthey Public Limited Company | Platinum or platinum alloy plating bath |
| JPH04297592A (en) * | 1991-03-25 | 1992-10-21 | Tanaka Kikinzoku Kogyo Kk | Platinum electroplating bath |
Non-Patent Citations (1)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 17, no. 113 (C - )<1033> 9 March 1993 (1993-03-09) * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022129461A1 (en) | 2020-12-18 | 2022-06-23 | Umicore Galvanotechnik Gmbh | Stabilization of the deposition rate of platinum electrolytes |
| DE102020007789A1 (en) | 2020-12-18 | 2022-06-23 | Umicore Galvanotechnik Gmbh | Stabilization of the deposition rate of platinum electrolytes |
| DE102021107826A1 (en) | 2021-03-29 | 2022-09-29 | Umicore Galvanotechnik Gmbh | platinum electrolyte |
| WO2022207539A1 (en) | 2021-03-29 | 2022-10-06 | Umicore Galvanotechnik Gmbh | Platinum electrolyte |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08319595A (en) | 1996-12-03 |
| US5620583A (en) | 1997-04-15 |
| EP0737760B1 (en) | 2000-04-19 |
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