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EP0648154B1 - Utilisation de plaques zonales de fresnel poue usiner des materiaux - Google Patents

Utilisation de plaques zonales de fresnel poue usiner des materiaux Download PDF

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Publication number
EP0648154B1
EP0648154B1 EP92915314A EP92915314A EP0648154B1 EP 0648154 B1 EP0648154 B1 EP 0648154B1 EP 92915314 A EP92915314 A EP 92915314A EP 92915314 A EP92915314 A EP 92915314A EP 0648154 B1 EP0648154 B1 EP 0648154B1
Authority
EP
European Patent Office
Prior art keywords
workpiece
plate
diffractive
discrete
fzp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP92915314A
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German (de)
English (en)
Other versions
EP0648154A1 (fr
Inventor
Bruce G. Macdonald
Robert O. Hunter, Jr.
Adlai H. Smith
Clark C. Guest
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Litel Instruments Inc
Original Assignee
Litel Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Litel Instruments Inc filed Critical Litel Instruments Inc
Publication of EP0648154A1 publication Critical patent/EP0648154A1/fr
Application granted granted Critical
Publication of EP0648154B1 publication Critical patent/EP0648154B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means

Definitions

  • Very small holes of arbitrary contours are important for many applications, including fabricating vias in printed circuit boards and integrated circuit packages (see for example DE-A-4 106 423).
  • Traditional mechanical means of forming vias such as drills or punches, are capable of forming vias as small as 0.004 inch (.10 mm). Below this limit, lithographic or optical techniques must be used.
  • One of the optical techniques for micro-machining is direct ablation with a laser focused onto the workpiece with a microscope. Vias are drilled one-at-a-time with the stage on which the workpiece sits scanning to the next via to be formed, repeating the procedure until all of the vias are formed.
  • This technique may include the use of a patterned metal mask over the surface of the substrate so that the laser ablates material only through the openings in the metal. After ablation the metal can be patterned or removed as the design requires.
  • the processing quality of this method is limited in that it takes a relatively long time to complete a single workpiece.
  • Lithographic techniques include determining the pattern of vias with photoresist then subjecting the workpiece to reactive ion etch. The photoresist is subsequently removed leaving the vias patterned in the workpiece.
  • the reactive ion etch involves the use of a very expensive piece of equipment, and several additional process steps are required for patterning, etch and photoresist strip.
  • the apparatus for drilling vias or holes in a circuit board includes an excimer laser and a Fresnel zone plate (FZP) positioned parallel to the circuit board, with the distance between the FZP and the circuit board being the focal length of the FZP.
  • FZP Fresnel zone plate
  • Each FZP may be patterned directly centered over the desired via location or in high density patterns it may be located off-center from the via with deflection being accomplished by the formation of finer circular arcs on the side of the FZP opposite the desired direction of deflection.
  • a beam scanner is included to provide a more uniform illumination of the FZP by the laser beam.
  • the scanning eliminates non-uniformity of intensity.
  • the alignment mechanism uses a helium-neon laser, the beam from which is projected onto a surface relief grating on the workpiece.
  • the reflected light from the surface relief grating is filtered to create interference fringes which, when aligned, provide maximum light intensity projected through a transmission grating on the Fresnel zone plate.
  • the FZP may be patterned to provide any contour hole by producing the pattern of the Fourier transform of the desired hole shape.
  • the material processing system comprises a processing laser 2 for emitting beam 3, a beam scanner 4, a spatial filter 5, a beam expander/collimator optical train 6, a Fresnel zone plate array 8 and an alignment subsystem 10.
  • the workpiece, illustrated as a circuit board 12 is mounted on stage 14.
  • Processing laser 2 is an excimer laser, which provides a single pulse brightness in ultraviolet light much greater than that emitted by other commercial lasers.
  • the preferred excimer laser is KrF which emits at 248 nm and provides a power of 400 mJ/pulse for a 20 nsec pulse. This particular laser is selected for its ability to ablate polyimide which is used for printed circuit boards and alumina (Al 2 O 3 ) which is used in ceramic packaging.
  • Beam scanner 4 is included because the laser beam quality has been tailored to the requirements for focusing the laser to the diameter specifications of a circuit board.
  • the beam quality modifications generate a speckle pattern which decreases the uniformity of the laser intensity.
  • Laser uniformity is an important parameter because it affects the diameter of the via. Since the polyimide has an energy threshold below which little ablation occurs, the profile of the laser beam will have the effect that a higher intensity pulse will be wider at the ablation threshold because the tails of the beam profile have increased in intensity. This results in an increase in hole diameter which creates a nonuniform distribution of hole diameters across the circuit board 12, possibly exceeding specified tolerances.
  • Beam scanner 4 alleviates the nonuniform intensity of the beam by causing the beam to continuously scan across a narrow region such that it overlaps itself at all locations during the scan.
  • the beam scanner 4, shown in Figure 5, consists of two stages 41 and 42 with reflectors 43 and 44.
  • Stage 41 oscillates continuously in ⁇ x-direction with reflector 43 mounted thereon at a 45° angle. Motion of stage 41 in ⁇ x-direction causes the beam to move in the ⁇ x-direction at the target plane while motion of stage 42 in ⁇ z-direction causes the beam to move in the ⁇ z direction at the target plane.
  • Stages 41 and 42 have tight pitch and yaw specifications so that the motion does not introduce any beam tilt.
  • Spatial filter 5 is a pinhole provided to permit spatial filtering of the input beam.
  • the pinhole rejects highly divergent components of the laser beam.
  • Beam expander/collimator optical train 6 is illustrated a simple combination of lenses which expand the beam 3 to match the beam size to the workpiece then collimate the expanded beam.
  • a more complex multiple lens telescope may also be used for precise magnification and speed, suggested values being 6:1 and f/20, respectively.
  • Fresnel zone plates are structures for focusing light that can be readily mass produced in arbitrary arrangements. They therefore provide an effective means for etching patterns of holes using laser light.
  • a single substrate can be imprinted with a large number of FZPs using standard lithographic techniques.
  • the operating principle of FZPs is the diffraction of light. The principle of diffraction states that a lightwave will not travel in a straight path after passing through a small aperture (small meaning comparable in size to the wavelength), but will expand outward to fill the space behind the aperture. Thus, light beams passing through a screen with two or more apertures will overlap and combine. Because light is a wave, it has peaks and troughs in its amplitude.
  • a screen with the correct pattern of apertures can be used to focus light. Light at the focus should have as high an amplitude as possible. Therefore, only apertures that contribute constructively interfering light to the focus position should be open in the screen. Whether an aperture contributes constructive or destructive light depends on the distance of the aperture from the focus.
  • the total amplitude of light at the focus can be increased by using the light that would ordinarily be blocked by the opaque rings of the FZP.
  • Destructive light can be turned to constructive light by changing its phase by half a wavelength.
  • those regions can also constructively contribute to the focus, thereby doubling the total light amplitude.
  • Materials etched by light at the focus react not to light amplitude, but to light intensity which is the square of the amplitude. Thus, doubling the amplitude increases the potential for etching by a factor of four.
  • the procedure for fabricating a Fresnel zone plate involves the preparation of a mask using electron beam lithography. Since E-beam lithography involves directly "writing" the pattern into photoresist on the chrome mask plate, it is relatively little additional work to pattern a large number of zones on a single mask. The location of each zone is determined by the pattern of beam projection desired to simultaneously process selected locations of a workpiece. The perimeter of the FZP array will have a clear unpatterned area 7 on the order of 1 cm wide to permit inclusion of alignment features. After etching of the exposed chrome (under the unexposed resist) and stripping of the resist, a mask is created bearing a pattern of the desired FZP array. An example of such a pattern with partially overlapping FZPs is shown in Figure 2.
  • the ability to partially overlap the zones permits relatively close and arbitrary positioning of the selected areas of the workpiece as required.
  • the FZPs and the selected area on the workpiece corresponding need not be limited to a circular shape.
  • By patterning the FZP as the Fourier transform of the desired shape virtually any shape via or hole can be drilled, including squares, polygons, asymmetric shapes, etc.
  • the mask is used to pattern photoresist on a quartz plate by projecting light through the mask to expose the resist.
  • the quartz is etched using either wet chemical (HF) or reactive ion etch (RIE).
  • HF wet chemical
  • RIE reactive ion etch
  • Wet etch can be used only where small spacing between the lines on the plate is not critical, because the isotropic nature of the wet etch results in undercut of the resist making dimensions difficult to control.
  • RIE an anisotropic etch, is preferred and is necessary to achieve narrow spacing between the lines with well-defined vertical steps.
  • an FZP is as follows: the radius of the k-th circle that separates the rings of the zone is given by ⁇ k ⁇ f, where ⁇ is the wavelength of light emitted by the processing laser 2 and f is the focal length of the Fresnel zone.
  • the width of the narrowest ring, which determines the resolution required for fabrication, is k ⁇ f - (k-1) ⁇ f .
  • FZP array 8 is positioned parallel to the circuit board 12, 50 millimeters away.
  • the focal length of the FZP is 50 mm.
  • the holes drilled in the circuit board 12 are 12.5 microns in diameter.
  • the holes are randomly positioned on the workpiece and may be as close as 75 microns center-to-center.
  • the FZPs must be 1 mm in diameter, using zones centered over the holes as seen in Figure 3a.
  • the FZPs must be able to produce holes that are not centered behind the FZP, but deflected to one side as in Figures 3b and 3c.
  • any selected 1 mm square area of that pattern directs light to the focus behind the center of the pattern. Therefore, FZPs designed to produce holes not centered under them will be 1 mm square areas selected from the outer portion of larger FZPs. The more the hole is deflected from the center of the FZP, the finer the circular arcs of the FZP opposite the direction of deflection, as shown in Figure 3c. Thus, the maximum deflection is limited by the minimum resolution of the fabrication process.
  • Alignment subsystem 10 is shown in Figure 4.
  • Reference laser 20 emits light within the visible spectrum, for example, a helium-neon laser (632.8 nm).
  • Alignment beam 22 is projected toward a reflective prism 24 attached to the perimeter of FZP 8 which directs beam 22 through a clear area 7 of FZP toward a location on the circuit board 12 at which is patterned a surface relief grating 14.
  • beam 22 When beam 22 strikes grating 15 it is split into several diffracted orders which are reflected back toward the FZP array through a blocking filter 16 which filters the reflected light, removing all diffracted orders except the -1 and +1.
  • visible light beam 22 passes through refractive prism 24 which causes beam 22 to leave Fresnel zone plate array 8 at an angle.
  • Beam 22 strikes surface relief grating 14 on workpiece 12.
  • Grating 14 breaks beam 22 into multiple diffracted orders 23.
  • Diffracted orders 23 are reflected and focused by reflective grating lens 29. Beams 23 reflect a second time off mirrored surface 16, which is patterned to reflect +1 and -1 diffracted beams but to stop 0th and all other beams.
  • the +1 and 1 beams encountered reflective bumps 17 on top surface of 8.
  • Purpose of bumps 17 is that beam 22 may be scanned through small angles, causing +1 and -1 beams to move onto and off of bumps 17. As they do so, their relative phases are modulated. Beams reflect once more off of 16 and from interference pattern at plane of transmission grating 18. Proper alignment of workpiece 12 and plate 8 gives maximum signal to detector 24. Phase modulation of beams produced by bumps 17 serves to rock interference pattern back and forth, giving a modulated signal to detector 24. This modulated signal is suitable for synchronous detection which gives high accuracy and noise immunity.
  • Mirrored surface 16 may be placed on the underside of FZP array 8 or may be a separate component.
  • transmission grating 18 which is preferably patterned on the perimeter of FZP array 8.
  • Transmission grating 18 may alternately be a separate component.
  • the light passing through the transmission grating 18 is measured at detector 24 to determine the total amount of light passed.
  • the above alignment procedure is preferably performed at two or more locations which may be facilitated by placing beamsplitter 25 between laser 20 and reflective prism 24 to provide two separate beams 22 and 22' which impact gratings 15 and 15', respectively to permit the above-described alignment procedure at two locations.
  • alignment subsystem 30 using a reference laser 20 as above, directs a reference beam through a reticle which has a set of alignment marks patterned at two of its edges.
  • a corresponding set of alignment marks is located on the workpiece onto which reference beam is focused by the use of a Fresnel lens.
  • the alignment marks are partially reflective, reflecting the beam back through the reticle and alignment marks thereon.
  • a camera looks at the images carried by the reflected beam to determine whether complete overlap and, thus, alignment has been achieved.
  • the material processing method and system of the present invention permits many locations to be processed simultaneously, providing high system throughput while efficiently using available laser power.
  • the processing steps for producing FZPs by standard lithographic techniques allow arbitrary patterning for customization of plates in accordance with a user's requirements.
  • the alignment subsystem permits repeatable positioning further allowing whole field stepping to increase throughput.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Polymerisation Methods In General (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)

Claims (10)

  1. Procédé pour traiter une pluralité d'emplacements choisis sur une pièce à oeuvrer en projetant des motifs de travail arbitraires sur ladite pièce à des emplacements prédéterminés, ledit procédé comprenant les étapes consistant à :
    fournir une plaque ayant une rangée de régions de Fresnel diffractives discrètes, chaque région diffractive discrète focalisant la lumière tombant sur ladite plaque à une distance focale discrète depuis ladite plaque dans un motif de travail arbitraire correspondant à un emplacement discret choisi sur ladite pièce, chaque emplacement recevant un faisceau respectif;
    aligner ladite plaque par rapport à ladite pièce pour focaliser simultanément chaque région diffractive discrète dans ledit motif de travail arbitraire à l'un des emplacements de ladite pluralité d'emplacements choisis ; et
    projeter un faisceau incident à travers ladite rangée de régions diffractives discrètes sur ladite plaque, grâce à quoi chacune desdites régions diffractives discrètes produit ledit motif de travail arbitraire à chaque emplacement discret choisi.
  2. Procédé selon la revendication 1, dans laquelle l'étape consistant à fournir une plaque inclut le fait de prévoir au moins une région diffractive avec un motif de travail arbitraire projeté qui est choisi parmi un groupe qui inclut les carrés, les polygones et les formes asymétriques.
  3. Procédé selon la revendication 1, dans lequel l'étape consistant à fournir une plaque inclut le fait de prévoir qu'au moins une desdites régions diffractives chevauche partiellement une seconde région optique diffractive adjacente.
  4. Procédé selon la revendication 1, dans lequel l'étape consistant à projeter inclut l'opération consistant à défléchir une partie dudit faisceau incident projeté à travers au moins une région diffractive discrète sous un angle  depuis la perpendiculaire à un centre de ladite au moins une région diffractive discrète.
  5. Procédé selon la revendication 1, dans lequel l'étape consistant à projeter inclut l'opération consistant à balayer en continu le faisceau incident séquentiellement à travers ladite rangée de régions diffractives discrètes sur ladite plaque.
  6. Procédé selon la revendication 5, dans lequel ladite étape de balayage en continu inclut le fait de balayer en continu ledit faisceau à travers des régions étroites de ladite plaque, lesdits balayages se chevauchant eux-mêmes.
  7. Procédé selon la revendication 1, comprenant les étapes consistant à:
    projeter un faisceau de lumière de référence depuis un laser de référence à travers une pluralité de premières marques d'alignement sur une plaque transparente située au-dessus de ladite pièce;
    aligner ladite pluralité de premières marques; d'alignement avec une pluralité de secondes marques d'alignement sur ladite pièce ; et
    projeter ledit faisceau de traitement incident à travers ladite rangée de régions diffractives sur ladite plaque pour focaliser simultanément une pluralité de faisceaux portant un motif de travail arbitraire sur ladite pièce, une région diffractive correspondant à chaque emplacement choisi sur ladite pièce pour focaliser un motif de travail arbitraire sur celle-ci, en créant ainsi une pluralité de faisceaux de traitement, chacun portant un motif de travail arbitraire correspondant, un faisceau de traitement correspondant à chaque emplacement choisi.
  8. Appareil pour traiter une pluralité d'emplacements choisis sur une pièce à oeuvrer en projetant des motifs de travail arbitraires sur ladite pièce à des emplacements prédéterminés, ledit appareil comprenant :
    une source de lumière pour engendrer un faisceau de traitement incident ; et
    une plaque ayant une rangée de régions de Fresnel diffractives, chaque région diffractive focalisant ledit faisceau de traitement incident à une distance focale discrète depuis ladite plaque dans un motif de travail arbitraire correspondant à un emplacement prédéterminé discret sur ladite pièce, chaque emplacement recevant un faisceau respectif.
  9. Appareil selon la revendication 8, dans lequel au moins deux régions optiques diffractives dans ladite rangée ont des longueurs focales différentes et des directions focales différentes.
  10. Plaque pour mettre en oeuvre le procédé selon l'une des revendications 1 à 7, caractérisée en ce qu'elle comprend une rangée de régions de Fresnel diffractives, chaque région de Fresnel diffractive focalisant un faisceau de traitement incident à une distance focale discrète depuis ladite plaque dans un motif de travail arbitraire correspondant à un emplacement prédéterminé discret sur une pièce.
EP92915314A 1992-07-01 1992-07-01 Utilisation de plaques zonales de fresnel poue usiner des materiaux Expired - Lifetime EP0648154B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1992/005555 WO1994001240A1 (fr) 1992-07-01 1992-07-01 Utilisation de plaques zonales de fresnel poue usiner des materiaux

Publications (2)

Publication Number Publication Date
EP0648154A1 EP0648154A1 (fr) 1995-04-19
EP0648154B1 true EP0648154B1 (fr) 1998-02-25

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EP92915314A Expired - Lifetime EP0648154B1 (fr) 1992-07-01 1992-07-01 Utilisation de plaques zonales de fresnel poue usiner des materiaux

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EP (1) EP0648154B1 (fr)
JP (1) JPH08504132A (fr)
AT (1) ATE163381T1 (fr)
DE (1) DE69224536T2 (fr)
DK (1) DK0648154T3 (fr)
ES (1) ES2114943T3 (fr)
WO (1) WO1994001240A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9601049D0 (en) 1996-01-18 1996-03-20 Xaar Ltd Methods of and apparatus for forming nozzles
FR2748412B1 (fr) * 1996-05-07 1998-06-19 Solaic Sa Procede de decoupe d'une plaque en matiere plastique
DE10084915C2 (de) * 1999-08-27 2003-12-24 Asahi Chemical Ind Polierkissen und Poliervorrichtung
GB9922082D0 (en) * 1999-09-17 1999-11-17 Isis Innovation Laser apparatus for use in material processing
CN110303244B (zh) * 2019-07-25 2020-11-27 中国工程物理研究院激光聚变研究中心 一种快速制备表面周期结构方法
CN113345619B (zh) * 2021-06-16 2022-07-12 中国工程物理研究院激光聚变研究中心 一维x射线折射闪耀波带片
JP2023021574A (ja) * 2021-08-02 2023-02-14 株式会社Ｓｃｒｅｅｎホールディングス 光照射装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223693A (en) * 1990-04-28 1993-06-29 Mitsubishi Denki Kabushiki Kaisha Optical machining apparatus

Also Published As

Publication number Publication date
DK0648154T3 (da) 1998-09-23
ES2114943T3 (es) 1998-06-16
DE69224536T2 (de) 1998-09-10
ATE163381T1 (de) 1998-03-15
EP0648154A1 (fr) 1995-04-19
WO1994001240A1 (fr) 1994-01-20
JPH08504132A (ja) 1996-05-07
DE69224536D1 (de) 1998-04-02

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