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EP0637470A3 - Backing layer for acoustic transducer array. - Google Patents

Backing layer for acoustic transducer array. Download PDF

Info

Publication number
EP0637470A3
EP0637470A3 EP94305729A EP94305729A EP0637470A3 EP 0637470 A3 EP0637470 A3 EP 0637470A3 EP 94305729 A EP94305729 A EP 94305729A EP 94305729 A EP94305729 A EP 94305729A EP 0637470 A3 EP0637470 A3 EP 0637470A3
Authority
EP
European Patent Office
Prior art keywords
backing layer
transducer array
acoustic transducer
acoustic
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP94305729A
Other languages
German (de)
French (fr)
Other versions
EP0637470A2 (en
Inventor
Michael Greenstein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of EP0637470A2 publication Critical patent/EP0637470A2/en
Publication of EP0637470A3 publication Critical patent/EP0637470A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
    • B06B1/0681—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure
    • B06B1/0685—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure on the back only of piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/0629—Square array

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
EP94305729A 1993-08-05 1994-08-02 Backing layer for acoustic transducer array. Withdrawn EP0637470A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10300793A 1993-08-05 1993-08-05
US103007 1993-08-05

Publications (2)

Publication Number Publication Date
EP0637470A2 EP0637470A2 (en) 1995-02-08
EP0637470A3 true EP0637470A3 (en) 1995-11-22

Family

ID=22292863

Family Applications (1)

Application Number Title Priority Date Filing Date
EP94305729A Withdrawn EP0637470A3 (en) 1993-08-05 1994-08-02 Backing layer for acoustic transducer array.

Country Status (2)

Country Link
EP (1) EP0637470A3 (en)
JP (1) JPH0779498A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10390793B2 (en) 2012-01-31 2019-08-27 Samsung Medison Co., Ltd. Backing element of ultrasonic probe, backing layer of ultrasonic probe, and manufacturing method thereof

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629906A (en) * 1995-02-15 1997-05-13 Hewlett-Packard Company Ultrasonic transducer
FR2740933B1 (en) * 1995-11-03 1997-11-28 Thomson Csf ACOUSTIC PROBE AND METHOD FOR PRODUCING THE SAME
US5732706A (en) * 1996-03-22 1998-03-31 Lockheed Martin Ir Imaging Systems, Inc. Ultrasonic array with attenuating electrical interconnects
JP3939652B2 (en) * 2000-11-15 2007-07-04 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Multidimensional ultrasonic transducer array
JP4624659B2 (en) 2003-09-30 2011-02-02 パナソニック株式会社 Ultrasonic probe
US7105986B2 (en) * 2004-08-27 2006-09-12 General Electric Company Ultrasound transducer with enhanced thermal conductivity
JP4693386B2 (en) * 2004-10-05 2011-06-01 株式会社東芝 Ultrasonic probe
JP2009153851A (en) * 2007-12-27 2009-07-16 Konica Minolta Medical & Graphic Inc Ultrasonic diagnostic apparatus and manufacturing method of wire used therefor
US20120040407A1 (en) 2009-02-05 2012-02-16 Kabushiki Kaisha Hayashibara Seibutsu Kagaku Kenkyujo Cellobiose 2-epimerase, its preparation and uses
CN108461623B (en) * 2018-01-23 2024-05-14 曼图电子(上海)有限公司 Backing material for array probe and manufacturing method thereof
JP6876645B2 (en) * 2018-03-15 2021-05-26 株式会社日立製作所 Ultrasonic probe and its manufacturing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0160821A2 (en) * 1984-04-04 1985-11-13 Siemens Aktiengesellschaft Apparatus for reading a two-dimensional charge image using an array
EP0256378A1 (en) * 1986-08-11 1988-02-24 Siemens Aktiengesellschaft Apparatus for reading a two-dimensional charge image
EP0294826A1 (en) * 1987-06-12 1988-12-14 Fujitsu Limited Ultrasonic transducer structure
US5329498A (en) * 1993-05-17 1994-07-12 Hewlett-Packard Company Signal conditioning and interconnection for an acoustic transducer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0160821A2 (en) * 1984-04-04 1985-11-13 Siemens Aktiengesellschaft Apparatus for reading a two-dimensional charge image using an array
EP0256378A1 (en) * 1986-08-11 1988-02-24 Siemens Aktiengesellschaft Apparatus for reading a two-dimensional charge image
EP0294826A1 (en) * 1987-06-12 1988-12-14 Fujitsu Limited Ultrasonic transducer structure
US5329498A (en) * 1993-05-17 1994-07-12 Hewlett-Packard Company Signal conditioning and interconnection for an acoustic transducer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10390793B2 (en) 2012-01-31 2019-08-27 Samsung Medison Co., Ltd. Backing element of ultrasonic probe, backing layer of ultrasonic probe, and manufacturing method thereof

Also Published As

Publication number Publication date
JPH0779498A (en) 1995-03-20
EP0637470A2 (en) 1995-02-08

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