EP0510860A3 - Molded optical packaging arrangement - Google Patents

Molded optical packaging arrangement Download PDF

Info

Publication number: EP0510860A3
Authority: EP; European Patent Office
Prior art keywords: packaging arrangement; molded optical; optical packaging; molded; arrangement
Prior art date: 1991-04-25
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP19920303310

Other versions

EP0510860B1 (en

EP0510860A2 (en

Inventor

Muvaffak Sabri Acarlar

Louis Thomas Manzione

Steven David Robinson

Dennis Stefanik

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

AT&T Corp

Original Assignee

American Telephone and Telegraph Co Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1991-04-25

Filing date

1992-04-14

Publication date

1993-03-10

1992-04-14 Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc

1992-10-28 Publication of EP0510860A2 publication Critical patent/EP0510860A2/en

1993-03-10 Publication of EP0510860A3 publication Critical patent/EP0510860A3/en

1997-07-02 Application granted granted Critical

1997-07-02 Publication of EP0510860B1 publication Critical patent/EP0510860B1/en

2012-04-14 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
- G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4255—Moulded or casted packages
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Computer Hardware Design (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Electromagnetism (AREA)
Optical Couplings Of Light Guides (AREA)
Optical Communication System (AREA)
Led Device Packages (AREA)
Light Receiving Elements (AREA)

EP92303310A 1991-04-25 1992-04-14 Molded optical packaging arrangement Expired - Lifetime EP0510860B1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US07/691,649 US5113466A (en)	1991-04-25	1991-04-25	Molded optical packaging arrangement
US691649		1991-04-25

Publications (3)

Publication Number	Publication Date
EP0510860A2 EP0510860A2 (en)	1992-10-28
EP0510860A3 true EP0510860A3 (en)	1993-03-10
EP0510860B1 EP0510860B1 (en)	1997-07-02

Family

ID=24777389

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP92303310A Expired - Lifetime EP0510860B1 (en)	1991-04-25	1992-04-14	Molded optical packaging arrangement

Country Status (6)

Country	Link
US (1)	US5113466A (en)
EP (1)	EP0510860B1 (en)
JP (1)	JP2698285B2 (en)
KR (1)	KR960014128B1 (en)
CA (1)	CA2062413C (en)
DE (1)	DE69220613T2 (en)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5155786A (en) *	1991-04-29	1992-10-13	International Business Machines Corporation	Apparatus and a method for an optical fiber interface
US5241614A (en) *	1991-04-29	1993-08-31	International Business Machines Corporation	Apparatus and a method for an optical fiber interface
EP0582992B1 (en) *	1992-08-11	1998-06-03	Sumitomo Electric Industries, Ltd	Optical module with improved grounding of an optical element
US5337398A (en) *	1992-11-30	1994-08-09	At&T Bell Laboratories	Single in-line optical package
US5416871A (en) *	1993-04-09	1995-05-16	Sumitomo Electric Industries, Ltd.	Molded optical connector module
US5345524A (en) *	1993-05-20	1994-09-06	Motorola, Inc.	Optoelectronic transceiver sub-module and method for making
US5432878A (en) *	1994-03-03	1995-07-11	Cts Corporation	Silicon carrier for testing and alignment of optoelectronic devices and method of assembling same
SE9402082L (en) *	1994-06-14	1995-12-15	Ericsson Telefon Ab L M	Miniature optical capsule
US5717533A (en)	1995-01-13	1998-02-10	Methode Electronics Inc.	Removable optoelectronic module
US6220878B1 (en)	1995-10-04	2001-04-24	Methode Electronics, Inc.	Optoelectronic module with grounding means
US6354747B1 (en)	1996-08-26	2002-03-12	Sumitomo Electric Industries, Ltd.	Optical module
EP0826997B1 (en) *	1996-08-26	2003-07-23	Sumitomo Electric Industries, Ltd.	Optoelectronic module and method of manufacturing the same
EP0935770A4 (en) *	1996-10-22	2006-02-08	Bel Fuse Ltd	Optical interconnection system
JP2002508884A (en) *	1996-10-23	2002-03-19	ユニフェイズオプトホールディングスインコーポレイテッド	Electro-optical device, cage suitable for using the device, and method of manufacturing the device
JP3514609B2 (en) *	1997-05-29	2004-03-31	新光電気工業株式会社	Lead frame for optical semiconductor device and optical semiconductor device
SG71172A1 (en)	1997-12-03	2000-03-21	Sumitomo Electric Industries	Optical data link
US6239427B1 (en) *	1998-01-14	2001-05-29	Sumitomo Electric Industries, Ltd.	Optical data link
US6315465B1 (en) *	1998-12-21	2001-11-13	Sumitomo Electric Industries, Ltd.	Optical module
US6366380B1 (en)	1999-02-12	2002-04-02	Cisco Technology, Inc	Optical transceiver EMI detuning device
US6213651B1 (en)	1999-05-26	2001-04-10	E20 Communications, Inc.	Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers
US6901221B1 (en)	1999-05-27	2005-05-31	Jds Uniphase Corporation	Method and apparatus for improved optical elements for vertical PCB fiber optic modules
US6220873B1 (en)	1999-08-10	2001-04-24	Stratos Lightwave, Inc.	Modified contact traces for interface converter
US6285324B1 (en)	1999-09-15	2001-09-04	Lucent Technologies Inc.	Antenna package for a wireless communications device
US6325551B1 (en)	1999-12-08	2001-12-04	New Focus, Inc.	Method and apparatus for optically aligning optical fibers with optical devices
US6632029B1 (en)	1999-12-22	2003-10-14	New Focus, Inc.	Method & apparatus for packaging high frequency components
US6704515B1 (en) *	1999-12-30	2004-03-09	The Boeing Company	Fiber optic interface module and associated fabrication method
DE10001873B4 (en) *	2000-01-18	2010-06-02	Avago Technologies Fiber Ip (Singapore) Pte. Ltd.	Optical transmitting and receiving device
US6659655B2 (en)	2001-02-12	2003-12-09	E20 Communications, Inc.	Fiber-optic modules with housing/shielding
US6607308B2 (en)	2001-02-12	2003-08-19	E20 Communications, Inc.	Fiber-optic modules with shielded housing/covers having mixed finger types
JP4543561B2 (en) *	2001-02-19	2010-09-15	住友電気工業株式会社	Optical module manufacturing method and optical module
JP2003332590A (en) *	2002-05-14	2003-11-21	Sumitomo Electric Ind Ltd	Optical module and optical transceiver module
DE10322071A1 (en) *	2003-05-15	2004-09-02	Infineon Technologies Ag	Micro-optical module, has housing formed as molded interconnect device, with three-dimensional conductor structure for connecting optoelectronic circuitry with components
US7268368B1 (en)	2003-08-29	2007-09-11	Standard Microsystems Corporation	Semiconductor package having optical receptacles and light transmissive/opaque portions and method of making same
JP4170950B2 (en) *	2003-10-10	2008-10-22	松下電器産業株式会社	Optical device and manufacturing method thereof
US7805084B2 (en) *	2004-05-20	2010-09-28	Finisar Corporation	Dual stage modular optical devices
US20060153507A1 (en) *	2004-05-21	2006-07-13	Togami Chris K	Modular optical devices compatible with legacy form factors
US20050265650A1 (en) *	2004-05-27	2005-12-01	Sunil Priyadarshi	Small profile, pluggable optical transceiver subassembly
US7795695B2 (en)	2005-01-27	2010-09-14	Analog Devices, Inc.	Integrated microphone
US7449356B2 (en) *	2005-04-25	2008-11-11	Analog Devices, Inc.	Process of forming a microphone using support member
US7885423B2 (en) *	2005-04-25	2011-02-08	Analog Devices, Inc.	Support apparatus for microphone diaphragm
US20070071268A1 (en) *	2005-08-16	2007-03-29	Analog Devices, Inc.	Packaged microphone with electrically coupled lid
US7825484B2 (en) *	2005-04-25	2010-11-02	Analog Devices, Inc.	Micromachined microphone and multisensor and method for producing same
US7258495B1 (en)	2005-06-24	2007-08-21	Corning Incorporated	Lensed fiber stub assemblies optical and optoelectronic packages including them
US20070040231A1 (en) *	2005-08-16	2007-02-22	Harney Kieran P	Partially etched leadframe packages having different top and bottom topologies
WO2007024909A1 (en) *	2005-08-23	2007-03-01	Analog Devices, Inc.	Multi-microphone system
US7961897B2 (en)	2005-08-23	2011-06-14	Analog Devices, Inc.	Microphone with irregular diaphragm
US8344487B2 (en) *	2006-06-29	2013-01-01	Analog Devices, Inc.	Stress mitigation in packaged microchips
EP2044802B1 (en) *	2006-07-25	2013-03-27	Analog Devices, Inc.	Multiple microphone system
TW200847827A (en) *	2006-11-30	2008-12-01	Analog Devices Inc	Microphone system with silicon microphone secured to package lid
US7694610B2 (en) *	2007-06-27	2010-04-13	Siemens Medical Solutions Usa, Inc.	Photo-multiplier tube removal tool
JP5412069B2 (en) *	2008-07-30	2014-02-12	矢崎総業株式会社	Female optical connector and manufacturing method of female optical connector
EP2265102B1 (en) *	2009-06-19	2014-06-25	Baumer Innotec AG	Sensor device without housing
US8632261B2 (en) *	2010-04-20	2014-01-21	Hon Hai Precision Industry Co., Ltd.	Integrated and sealed opto-electronic device assembly
US9676614B2 (en)	2013-02-01	2017-06-13	Analog Devices, Inc.	MEMS device with stress relief structures
US10167189B2 (en)	2014-09-30	2019-01-01	Analog Devices, Inc.	Stress isolation platform for MEMS devices
US10131538B2 (en)	2015-09-14	2018-11-20	Analog Devices, Inc.	Mechanically isolated MEMS device
US11417611B2 (en)	2020-02-25	2022-08-16	Analog Devices International Unlimited Company	Devices and methods for reducing stress on circuit components
US11981560B2 (en)	2020-06-09	2024-05-14	Analog Devices, Inc.	Stress-isolated MEMS device comprising substrate having cavity and method of manufacture

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3004379A1 (en) *	1979-02-06	1980-08-14	Texas Instruments Inc	Housing with light emitter or detector - has self alignment for optical fibre and catch locating in recess and element on precision frame
EP0053482A2 (en) *	1980-11-28	1982-06-09	Kabushiki Kaisha Toshiba	Module for a fiber optic link
EP0389824A1 (en) *	1989-03-29	1990-10-03	Nortel Networks Corporation	Transient voltage suppression for electro-optic modules
GB2229857A (en) *	1989-03-31	1990-10-03	Stc Plc	Electro-optic transducer secured to integrated circuit package
WO1990014607A1 (en) *	1989-05-19	1990-11-29	E.I. Du Pont De Nemours And Company	Housing for an opto-electronic device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4307934A (en) *	1978-05-08	1981-12-29	General Dynamics, Pomona Division	Packaged fiber optic modules
DE3172553D1 (en) *	1980-11-28	1985-11-07	Toshiba Kk	Method for manufacturing a module for a fiber optic link
US4798440A (en) *	1983-01-24	1989-01-17	Amp Incorporated	Fiber optic connector assembly
JPS59136610U (en) *	1983-03-02	1984-09-12	富士通株式会社	optical connector
US4633582A (en) *	1985-08-14	1987-01-06	General Instrument Corporation	Method for assembling an optoisolator and leadframe therefor
US4803361A (en) *	1986-05-26	1989-02-07	Hitachi, Ltd.	Photoelectric device with optical fiber and laser emitting chip
US4752109A (en) *	1986-09-02	1988-06-21	Amp Incorporated	Optoelectronics package for a semiconductor laser
US4911519A (en) *	1989-02-01	1990-03-27	At&T Bell Laboratories	Packaging techniques for optical transmitters/receivers
US4913511A (en) *	1989-03-30	1990-04-03	Northern Telecom Limited	Transient voltage suppression for electro-optic modules
JP2881806B2 (en) *	1989-04-12	1999-04-12	住友電気工業株式会社	Optical module and manufacturing method thereof

1991
- 1991-04-25 US US07/691,649 patent/US5113466A/en not_active Expired - Lifetime
1992
- 1992-03-06 CA CA002062413A patent/CA2062413C/en not_active Expired - Lifetime
- 1992-04-14 EP EP92303310A patent/EP0510860B1/en not_active Expired - Lifetime
- 1992-04-14 DE DE69220613T patent/DE69220613T2/en not_active Expired - Lifetime
- 1992-04-20 KR KR1019920006586A patent/KR960014128B1/en not_active IP Right Cessation
- 1992-04-22 JP JP4127975A patent/JP2698285B2/en not_active Expired - Lifetime

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3004379A1 (en) *	1979-02-06	1980-08-14	Texas Instruments Inc	Housing with light emitter or detector - has self alignment for optical fibre and catch locating in recess and element on precision frame
EP0053482A2 (en) *	1980-11-28	1982-06-09	Kabushiki Kaisha Toshiba	Module for a fiber optic link
EP0389824A1 (en) *	1989-03-29	1990-10-03	Nortel Networks Corporation	Transient voltage suppression for electro-optic modules
GB2229857A (en) *	1989-03-31	1990-10-03	Stc Plc	Electro-optic transducer secured to integrated circuit package
WO1990014607A1 (en) *	1989-05-19	1990-11-29	E.I. Du Pont De Nemours And Company	Housing for an opto-electronic device

Also Published As

Publication number	Publication date
KR960014128B1 (en)	1996-10-14
US5113466A (en)	1992-05-12
KR920020227A (en)	1992-11-20
EP0510860B1 (en)	1997-07-02
CA2062413C (en)	1997-08-05
JPH07193262A (en)	1995-07-28
DE69220613T2 (en)	1998-01-29
DE69220613D1 (en)	1997-08-07
JP2698285B2 (en)	1998-01-19
CA2062413A1 (en)	1992-10-26
EP0510860A2 (en)	1992-10-28

Publication	Publication Date	Title
EP0510860A3 (en)	1993-03-10	Molded optical packaging arrangement
GB9014639D0 (en)	1990-08-22	Optical component packaging
EP0499492A3 (en)	1992-09-30	Plastic optical articles
EP0510859A3 (en)	1993-03-10	Molded optical package utilizing leadframe technology
GB2245254B (en)	1994-07-27	Packaging
HU912321D0 (en)	1991-12-30	Package
GB2276138B (en)	1996-07-31	Packages
GB9012333D0 (en)	1990-07-25	Packaging
AU109864S (en)	1990-12-17	Package
GB9026946D0 (en)	1991-01-30	Packaging
GB9023528D0 (en)	1990-12-12	Packaging
GB9114112D0 (en)	1991-08-14	Packaging
EP0453775A3 (en)	1992-02-05	Package
GB2286575B (en)	1996-07-31	Packages
GB9110026D0 (en)	1991-07-03	Packaging
GB2258648B (en)	1995-01-18	Packaging
CA66813S (en)	1990-09-11	Package
ZA917790B (en)	1992-05-27	Packaging arrangement
GB9009749D0 (en)	1990-06-20	Packaging
GB9001112D0 (en)	1990-03-21	Packaging
GB9005997D0 (en)	1990-05-09	Packaging
GB9023856D0 (en)	1990-12-12	Packaging
GB9025544D0 (en)	1991-01-09	Packaging
GB9122379D0 (en)	1991-12-04	Packaging
GB9119787D0 (en)	1991-10-30	Packaging

Legal Events

Date	Code	Title	Description
1992-09-11	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
1992-10-28	AK	Designated contracting states	Kind code of ref document: A2 Designated state(s): DE FR GB
1993-01-19	PUAL	Search report despatched	Free format text: ORIGINAL CODE: 0009013
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1993-10-27	17P	Request for examination filed	Effective date: 19930826
1994-06-22	RAP3	Party data changed (applicant data changed or rights of an application transferred)	Owner name: AT&T CORP.
1995-03-01	17Q	First examination report despatched	Effective date: 19950119
1996-08-24	GRAG	Despatch of communication of intention to grant	Free format text: ORIGINAL CODE: EPIDOS AGRA
1996-12-18	GRAH	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOS IGRA
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