EP0407349A2 - Electrode for use in electrolytic processes and process for manufacturing it - Google Patents
Electrode for use in electrolytic processes and process for manufacturing it Download PDFInfo
- Publication number
- EP0407349A2 EP0407349A2 EP90810492A EP90810492A EP0407349A2 EP 0407349 A2 EP0407349 A2 EP 0407349A2 EP 90810492 A EP90810492 A EP 90810492A EP 90810492 A EP90810492 A EP 90810492A EP 0407349 A2 EP0407349 A2 EP 0407349A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- metal
- article
- microinches
- etching
- profilometer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 50
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 115
- 239000002184 metal Substances 0.000 claims abstract description 115
- 238000000576 coating method Methods 0.000 claims abstract description 88
- 239000011248 coating agent Substances 0.000 claims abstract description 70
- 238000005530 etching Methods 0.000 claims abstract description 51
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 46
- 239000010936 titanium Substances 0.000 claims abstract description 46
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000012535 impurity Substances 0.000 claims description 29
- 238000000137 annealing Methods 0.000 claims description 22
- 238000007689 inspection Methods 0.000 claims description 20
- 238000011282 treatment Methods 0.000 claims description 17
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 12
- 150000002739 metals Chemical class 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 11
- 239000003518 caustics Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 9
- 230000003746 surface roughness Effects 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 238000005323 electroforming Methods 0.000 claims description 6
- 238000005363 electrowinning Methods 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 239000000155 melt Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910001040 Beta-titanium Inorganic materials 0.000 claims description 5
- 230000002939 deleterious effect Effects 0.000 claims description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- YADSGOSSYOOKMP-UHFFFAOYSA-N dioxolead Chemical compound O=[Pb]=O YADSGOSSYOOKMP-UHFFFAOYSA-N 0.000 claims description 4
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 238000005868 electrolysis reaction Methods 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 239000010955 niobium Substances 0.000 claims description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- -1 platinum group metal oxides Chemical class 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 2
- 238000009792 diffusion process Methods 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 claims description 2
- 229910000311 lanthanide oxide Inorganic materials 0.000 claims description 2
- 229910052748 manganese Inorganic materials 0.000 claims description 2
- 239000011572 manganese Substances 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 235000006408 oxalic acid Nutrition 0.000 claims description 2
- 235000011007 phosphoric acid Nutrition 0.000 claims description 2
- 150000003016 phosphoric acids Chemical class 0.000 claims description 2
- 235000010333 potassium nitrate Nutrition 0.000 claims description 2
- 239000004323 potassium nitrate Substances 0.000 claims description 2
- 238000010791 quenching Methods 0.000 claims description 2
- 230000000171 quenching effect Effects 0.000 claims description 2
- 229910052596 spinel Inorganic materials 0.000 claims description 2
- 239000011029 spinel Substances 0.000 claims description 2
- 239000003381 stabilizer Substances 0.000 claims description 2
- 229910000859 α-Fe Inorganic materials 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims 1
- 229910000428 cobalt oxide Inorganic materials 0.000 claims 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 229910000480 nickel oxide Inorganic materials 0.000 claims 1
- 150000002913 oxalic acids Chemical class 0.000 claims 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000005272 metallurgy Methods 0.000 abstract description 3
- 230000000149 penetrating effect Effects 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 12
- 238000012360 testing method Methods 0.000 description 11
- 238000005259 measurement Methods 0.000 description 10
- 238000001723 curing Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000005554 pickling Methods 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000010953 base metal Substances 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 239000008199 coating composition Substances 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 2
- 229910000102 alkali metal hydride Inorganic materials 0.000 description 2
- 150000008046 alkali metal hydrides Chemical class 0.000 description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 235000010755 mineral Nutrition 0.000 description 2
- 229910003455 mixed metal oxide Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- 229910018974 Pt3O4 Inorganic materials 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- WZOZCAZYAWIWQO-UHFFFAOYSA-N [Ni].[Ni]=O Chemical compound [Ni].[Ni]=O WZOZCAZYAWIWQO-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 150000003841 chloride salts Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910000457 iridium oxide Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/26—Acidic compositions for etching refractory metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
- C25C7/02—Electrodes; Connections thereof
Definitions
- a coating applied directly to a base metal is an electrocatalytic coating, often containing a precious metal from the platinum metal group, and applied directly onto a metal such as a valve metal.
- the metal may be simply cleaned to give a very smooth surface.
- Treatment with fluorine compounds may produce a smooth surface.
- Cleaning might include chemical degreasing, electrolytic degreasing or treatment with an oxidizing acid.
- the metal can be treated for coating removal.
- such treatment may be with a melt containing a basic material used in the presence of an oxidant or oxygen. Such can be followed by pickling to reconstitute the original surface for coating.
- a molten alkali metal hydroxide bath is used containing an alkali metal hydride, this is preferably followed by a hot mineral acid treatment.
- U.S. Patent No. 3,706,600 It has also been Proposed to prepare the surface without stripping the old Coating.
- U.S. Patent No. 3,684,543 More recently, this procedure has been improved by activation of the 01d coating, prior to application of the new.
- Another procedure for anchoring the fresh coating to the substrate that has found utility in the application of an electrocatalytic coating to a valve metal, is to provide a Porous oxide layer which can be formed on the base metal.
- the invention may provide for lower effective current densities and also achieve substrate metal grains desirably stabilized against passivation.
- the invention is directed to a metal article having a surface adapted for enhanced coating adhesion, such surface being free from deleterious affects of abrasive treatment while having desirable surface grain size, which surface has three-dimensional grains with deep grain boundaries, such surface having been etched including the etching of impurities located in the grain boundaries at the surface of the metal, which intergranular etching provides a profilometer-measured average surface roughness of at least about 250 microinches and an average surface peaks per inch of at least about 40, basis a profilometer upper threshold limit of 400 microinches and a profilometer lower threshold limit of 300 microinches.
- the invention is directed to a metal article having a surface adapted for enhanced coating adhesion, said surface having, as measured by profilometer, an average roughness of at least about 250 microinches and an average surface peaks per inch of at least about 40, basis the lower and upper threshold limits mentioned hereinbefore.
- Such surface most desirably also has an average distance between the maximum peak and the maximum valley of at least about 1,000 microinches and an average peak height of at least about 1,000 microinches.
- such electrodes can have highly desirable service life.
- metals as electrodes may provide an effectively lower current density, which will aid in prolonging the life of the electrode, when used as above discussed or, for example, in water or brine electrolysis.
- the metals of the substrate are broadly contemplated to be any coatable metal.
- the substrate metals might be such as nickel or manganese, but will most always be valve metals, including titanium, tantalum, aluminum, zirconium and niobium. Of particular interest for its ruggedness, corrosion resistance and availability is titanium.
- the suitable metals of the substrate can include metal alloys and intermetallic mixtures.
- titanium may be alloyed with nickel, cobalt, iron, manganese or copper.
- Grade 5 titanium may include up to 6.75 weight% aluminum and 4.5 weight% vanadium, grade 6 up to 6% aluminum and 3% tin, grade 7 up to 0.25 weight% palladium, grade 10, from 10 to 13 weight% molybdenum plus 4.5 to 7.5 weight% zirconium and so on.
- metals in their normally available condition, i.e., having minor amounts of impurities.
- metal of particular interest i.e., titanium
- various grades of the metal are available including those in which other constituents may be alloys or alloys plus impurities.
- iron may be a usual impurity. Its maximum concentration can be expected to vary from 0.2 weight percent for grades 1 and 11 up to 0.5% for grades 4 and 6. Additional impurities that may be found throughout the grades of titanium include nitrogen, carbon, hydrogen and oxygen.
- beta-titanium located at the titanium grain boundaries can be susceptible to etching, such beta-titanium is considered herein for purposes of this discussion as an impurity.
- etching of an impurity as discussed herein may include etching of a phase of the metal itself.
- the titanium metal of particular interest may have beta-phase stabilizers, some of which may be present in extremely minor amounts in the manner of an impurity and include vanadium, niobium, tantalum, molybdenum, ruthenium, zirconium, tin, hafnium and mixtures thereof.
- Grades of titanium have been more specifically set forth in the standard specifications for titanium detailed in ASTM B 265-79.
- the substrate metal advantageously is a cleaned surface. This may be obtained by any of the treatments used to achieve a clean metal surface, but with the provision that unless called for to remove an old coating, mechanical cleaning is typically minimized and preferably avoided. Thus the usual cleaning procedures of degreasing, either chemical or electrolytic, or other chemical cleaning operation may be used to advantage.
- etching it is important to aggressively etch the metal surface to provide deep grain boundaries providing well exposed, three-dimensional grains. It is preferred that such operation will etch impurities located at such grain boundaries.
- a metal having etchable grain boundary impurities may be referred to herein as a metal having a correct "metallurgy”.
- an important aspect of the invention involves the enhancement of impurities of the metal at the grain boundaries. This is advantageously done at an early stage of the overall process of metal preparation.
- One manner of this enhancement that is contemplated is the inducement at, or introduction to, the grain-boundaries of one or more impurities for the metal.
- the impurities of the metal might include iron, nitrogen, carbon, hydrogen, oxygen, and beta-titanium.
- impurities introduction procedures that might be used can include surface deposition, e.g., vapor deposition, which might be followed by a heat treatment for surface impurity diffusion
- one particular manner contemplated for impurity enhancement is to subject the titanium metal to a hydrogen-containing treatment. This can be accomplished by exposing the metal to a hydrogen atmosphere at elevated temperature. Or the metal might be subjected to an electrochemical hydrogen treatment, with the metal as a cathode in a suitable electrolyte evolving hydrogen at the cathode.
- etching Another consideration for the aspect of the invention involving etching, which aspect can lead to impurity enhancement at the grain boundaries, involves the heat treatment history of the metal.
- a metal such as titanium
- annealing Proper annealing of grade 1 titanium will enhance the concentration of the iron impurity at grain boundaries.
- the suitable preparation includes annealing, and the metal is grade 1 titanium
- the titanium can be annealed at a temperature of at least about 500°C. for a time of at least about 15 minutes.
- a more elevated annealing temperature e.g., 600°-800°C. is advantageous.
- Annealing times at such more elevated temperatures will typically be on the order of 15 minutes to 4 hours.
- a short, high temperature anneal e.g., on the order of 800°C. for a few minutes such as 5-10 minutes, may be continued, after rapid or slow cooling, at a quite low temperature, with 200°-400°C. being representative, for several hours, with 10-20 hours being typical.
- Suitable conditions can include annealing in air, or under vacuum, or with an inert gas such as argon.
- Subsequent cooling of the annealed metal can appropriately stabilize the grain boundaries for etching. Stabilization may be achieved by controlled or rapid cooling of the metal or by other usual metal cooling technique including quenching,
- a metal having such stabilization may be referred to herein as a metal having a desirable "heat history".
- a metal surface having a correct grain boundary metallurgy as above-discussed with an advantageous grain size.
- a metal surface having a correct grain boundary metallurgy as above-discussed with an advantageous grain size.
- at least a substantial amount of the grains having grain size within the range of from about 3 to about 7 is advantageous.
- Grain size as referred to herein is in accordance with the designation provided in ASTM E 112-84. Size for titanium grains below about 3 produce a high percentage of brad grains which detract from advantageous coating adhesion. Grain sizes above about 7 are not desired for best three-dimensional grain structure development.
- the grains will have size within the range from about 4 to about 6.
- the metal surface is then ready for continuing operation.
- etching it will be with a sufficiently active etch solution to develop aggressive grain boundary attack.
- Typical etch solutions are acid solution. These can be provided by hydrochloric, sulfuric, perchloric, nitric oxalic, tartaric, and phosphoric acids as well as mixtures thereof, e.g., aqua regia.
- etchants that may be utilized include caustic etchants such as a solution of potassium hydroxide/hydrogen peroxide in combination, or a melt of potassium hydroxide with potassium nitrate.
- the etch solution is advantageously a strong, or concentrated, solution, such as an 18-22 weight% solution of hydrochloric acid.
- the solution is advantageously maintained during etching at elevated temperature such as at 80°C. or more for aqueous solutions, and often at or near boiling condition or greater, e.g., under refluxing condition.
- the etched metal surface can then be subjected to rinsing and drying steps to prepare the surface for coating.
- the metal surface have an average roughness (Ra) of at least about 250 microinches and an average number of surface peaks per inch (Nr) of at least about 40.
- the surface peaks per inch can be typically measured at a lower threshold limit of 300 microinches and an upper threshold limit of 400 microinches.
- a surface having an average roughness of below about 250 microinches will be undesirably smooth. as will a surface having an average number of surface peaks per inch of below about 40., for providing the needed, substantially enhanced, coating adhesion.
- Ra average roughness
- Nr average number of surface peaks per inch
- the surface will have an average roughness of on the order of about 250 microinches or more, e.g., ranging up to about 750-1500 microinches, with no low spots of less than about 200 microinches.
- the surface will be free from low spots that are less than about 210 to 220 microinches. It is preferable that the surface have an average roughness of from about 300 to about 500 microinches.
- the surface has an average number of peaks per inch of at least about 60, but which might be on the order of as great as about 130 or more, with an average from about 80 to about 120 being preferred.
- the surface prefferably has an average distance between the maximum peak and the maximum valley (Rm) of at least about 1,000 microinches and to have an average peak height (Rz) of at least about 1,000 microinches. All of such foregoing surface characteristics are as measured by a profilometer. More desirably, the surface for coating will have an Rm value of at least about 1,500 microinches to about 3500 microinches and have a maximum valley characteristic of at least about 1,500 microinches up to about 3500 microinches.
- electrochemically active coatings that may then be applied to the etched surface of the metal, are those provided from platinum or other platinum group metals or they can be represented by active oxide coatings such as platinum group metal oxides, magnetite , ferrite, cobalt spinel or mixed metal oxide coatings.
- active oxide coatings such as platinum group metal oxides, magnetite , ferrite, cobalt spinel or mixed metal oxide coatings.
- Such coatings have typically been developed for use as anode coatings in the industrial electrochemical industry. They may be water based or solvent based, e.g., using alcohol solvent. Suitable coatings of this type have been generally described in one or more of the U.S. Patent Nos. 3,265,526, 3,632,498, 3,711,385 and 4,528,084.
- coatings will be applied to the metal by any of those means which are useful for applying a liquid coating composition to a metal substrate. Such methods include dip spin and dip drain techniques, brush application, roller coating and spray application such as electrostatic spray. Moreover spray application and combination techniques, e.g., dip drain with spray application can be utilized. With the above-mentioned coating compositions for providing an electrochemically active coating, a modified dip drain operation can be most serviceable. Following any of the foregoing coating procedures, upon removal from the liquid coating composition, the coated metal surface may simply dip drain or be subjected to other post coating technique such as forced air drying.
- Typical curing conditions for electrocatalytic coatings can include cure temperatures of from about 300°C. up to about 600°C. Curing times may vary from only a few minutes for each coating layer up to an hour or more, e.g., a longer cure time after several coating layers have been applied. However, cure procedures duplicating annealing conditions of elevated temperature plus prolonged exposure to such elevated temperature, are generally avoided for economy of operation.
- the curing technique employed can be any of those that may be used for curing a coating on a metal substrate.
- oven curing including conveyor ovens may be utilized.
- infrared cure techniques can be useful.
- oven curing is used and the cure temperature used for electrocatalytic coatings will be within the range of from about 450°C. to about 550°C. At such temperatures, curing times of only a few minutes, e.g., from about 3 to 10 minutes, will most always be used for each applied coating layer.
- titanium plate measuring 2 inches by 6 inches by 3/8 inch and being an unalloyed grade 1 titanium, as determined in accordance with the specifications of ASTM B 265-79. This titanium sheet thus contained 0.20 Percent, maximum, iron impurity.
- This plate which was a fresh grade 1 titanium plate, was degreased in perchloroethylene vapors, rinsed with deionized water and air dried. It was then etched for approximately 1 hour by immersion in 20 weight percent hydrochloric acid aqueous solution heated to 95°C. After removal from the hot hydrochloric acid, the plate was again rinsed with deionized water and air dried. By this etching, the plate achieves a weight loss of 500-600 grams per square meter of plate surface area. This weight loss is determined by pre and post etching weighing of the plate sample and then calculating the loss per square meter by straight forward calculation on the basis of the surface area of both large flat faces of the plate.
- the surface structure of the sample plate, on both broad surfaces, is then examined under a stereo microscope under magnification varying during the study from 40X to 60X.
- Such plate surface can be seen to have a well defined, three dimensional, grain boundary etch.
- the etched surface was then subjected to surface profilometer measurement using a Hommel model T1000 C instrument manufactured by Hommelwerk GmbH.
- the plate surface profilometer measurements as average values computed from eight separate measurements conducted by running the instrument in random orientation across on large flat face of the plate. This gave average values for surface roughness (Ra) of 393 microinches, peaks per inch (Nr) of 86 and an average distance between the maximum peak and the maximum valley (Rz) of 2104.
- the peaks per inch were measured within the threshold limits of 300 microinches (lower) and 400 microinches (upper).
- a second sample plate from the same batch of unalloyed titanium as was used for the plate sample of Comparative Example 2 was subjected to annealing operation. In this operation, the sample was placed in an oven and the oven was heated until the air temperature reached 700°C. This air temperature was then held for 15 minutes, cooled to 450°C., and held for 30 minutes. Thereafter, while the sample was maintained in the oven, the oven air temperature was permitted to cool to about 200°C in a period of 1.5 hours. The sample was then removed for cooling to room temperature.
- Example 1 The resulting test sample was then etched in boiling 18 weight percent HCl for one hour, then rinsed and dried as described in Example 1. Subsequently, under visual examination in the manner of Example 1, the etched sample plate was seen to have a highly desirable, three dimensional grain boundary etch. This was confirmed by profilometer measurements which provided average values of 398 (Ra), 76 (Nr) and 2040 (Rz).
- the resulting sample was tested as an anode in an electrolyte that was a mixture of 285 grams per liter (g/l) of sodium sulfate and 60 g/l of magnesium sulfate.
- the test cell was maintained at 65°C and operated at a current density of 15 kiloamps per square meter (kA/m2).
- the coated titanium plate anode was removed from the electrolyte, rinsed in deionized water, air dried and then cooled to ambient temperature. There was then applied to the coated plate surface, by firmly manually pressing onto the coating, a strip of self-adhesive, pressure sensitive tape. This tape was then removed from the surface by quickly pulling the tape away from the plate. After 3000 hours of operation, including approximately 18 tape tests, the coated anode continued to exhibit excellent coating adhesion to the underlying titanium substrate.
- a sample of 2 mm thick, grade 1 titanium sheet was etched in 20% HCl at 90-95°C. After etching, the profilimeter measurements were found to be 124 (Ra), 12 (Nr) and 765 (Rz).
- a coating was applied to the etched sheet as described in Example 3.
- a sample of the sheet was tested in the electrolyte and under the conditions as described in Example 3. After 424 hours of operation, a tape test was performed on the sample resulting in the nearly complete removal of the coating from the tested area, exposing the underlying substrate and effectively terminating the testing.
- Example 1 A sample of titanium which had been previously coated with an electrochemically active coating, was blasted with alumina powder to remove the previous coating. By this abrasive method, it was determined by X-ray fluoroescence that the previous coating had been removed. After removal of any residue of the abrasive treatment, the resulting sample plate was etched in the composition of Example 1 in the manner of Example 1. Under visual inspection as described in Example 1, it was seen that there was no evidence of desirable grain boundary etching. Furthermore, under profilometer measurement, the resulting average values were found to be 137 (Ra), 12 (Nr) and 841 (Rz).
- Example 3 The sample was nevertheless coated with the electrocatalytic coating of Example 3 in the manner as described in Example 3 and utilized as an anode also in the manner as described in Example 3. After 91 hours of operation, the sample was removed and the coating adhesion tested utilizing the tape test of Example 3. In this test, and after only the 91 hours of testing, the tape removed the majority of the coating exposing the underlying substrate and thus terminating further testing.
- coated metal electrodes especially coated titanium electrodes used as oxygen evolving anodes in high speed electrogalvanizing, electrotinning, electroforming or electrowinning
- the performance of coated titanium anodes is particularly erratic because the characteristics of the titanium vary substantially from one production batch to another and from one titanium sheet to another because of different heat histories and handling. This applies even to different specimens of titanium from the same batch. It was thus not possible to reliably predict anode performance based solely on careful control of the production conditions because the same etching/annealing procedure could lead to different results for different specimens.
- the invention is based on the insight that the failure mechanism of such electrodes was related to the surface morphology of the substrates. It was found that satisfactory electrodes were those whose substrate surface before coating conformed to the aforementioned specification. Electrodes made with substrates which did not meet up to this specification tended to fail prematurely. It follows that by employing the described inspection procedures it is possible to control whether or not the surface has achieved an optimum condition for receiving a coating so that when the surface is coated the risk of premature failure is practically completely eliminated.
- the intergranularly etched surface is then inspected by profilometer to determine whether the three-dimensional grains having deep grain boundaries correspond across the surface to a profilometer-measured average surface roughness (Ra) of at least about 250 microinches (about 635 micrometers), and an average surface peaks per inch (Nr) of at least about 40 (about 15.15 peaks per cm) based on a profilometer upper threshold limit of 400 microinches (1016 micrometers) and a profilometer lower threshold limit of 300 microinches (792 micrometers). If after the optical or profilometer inspection the surface does not meet said specifications, the surface may be subjected to further strong acid or strong caustic etching and to optical and/or profilometer inspection again after the further treatment.
- Ra surface roughness
- Nr average surface peaks per inch
- another substrate from the same batch may be subjected to annealing (different to the annealing of the first substrate) followed by etching and inspection, with further etching and inspection if necessary.
- annealing different to the annealing of the first substrate
- etching and inspection with further etching and inspection if necessary.
- the electrocatalytic coating is applied to the treated metal surface, but only after optical and profilometer inspection has revealed that the surface meets said specifications.
- the electrocatalytic coating can be applied directly or it is possible to perform a final "clean up" etch to present a stain-free chemically clean surface for coating, for example by etching for up to 5 minutes in fresh hot hydrochloric acid, followed by rinsing and drying.
- the optical inspection by microscope should scan the entire surface to be coated to ensure that the three-dimensional grain boundaries extend over the entire surface.
- Profilometer measurements can be carried out at selected points across the surface. To reduce the number of profilometer measurements, it is convenient to measure with settings above the minimum values given.
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Abstract
Description
- The adhesion of coatings applied directly to the surface of a substrate metal is of special concern when the coated metal will be utilized in a rigorous industrial environment. Careful attention is usually paid to surface treatment and pre-treatment operation prior to coating. Achievement particularly of a clean surface is a priority sought in such treatment or pre-treatment operation.
- Representative of a coating applied directly to a base metal is an electrocatalytic coating, often containing a precious metal from the platinum metal group, and applied directly onto a metal such as a valve metal. Within this technical area of electrocatalytic coatings applied to a base metal, the metal may be simply cleaned to give a very smooth surface. U.S. Patent No, 4,797,182. Treatment with fluorine compounds may produce a smooth surface. U.S. Patent No. 3,864,163. Cleaning might include chemical degreasing, electrolytic degreasing or treatment with an oxidizing acid. U.S. Patent 3,864,163.
- Cleaning can be followed by mechanical roughening to Prepare a surface for coating. U.S. Patent No, 3,778,307. If the mechanical treatment is sandblasting, such may be followed by etching. U.S. Patent No. 3,878,083. Or pickling with an non-oxidizing acid can produce a rough surface for coating. U.S. Patent No. 3,864.163. Such pickling can follow degreasing. U.S. patent No. Re. 28,820. The pickling may readily etch titanium to a surface roughness within the range of 150-200 or more microinches. "Titanium as a Substrate for Electrodes", Hayfield, P.C.S., IMI Research and Development Report.
- If there is a pre-existing coating present on the substrate metal, the metal can be treated for coating removal. For an electrocatalytic coating, such treatment may be with a melt containing a basic material used in the presence of an oxidant or oxygen. Such can be followed by pickling to reconstitute the original surface for coating. U.S. Patent No, 3,573,100. Or if a molten alkali metal hydroxide bath is used containing an alkali metal hydride, this is preferably followed by a hot mineral acid treatment. U.S. Patent No. 3,706,600. It has also been Proposed to prepare the surface without stripping the old Coating. U.S. Patent No. 3,684,543. More recently, this procedure has been improved by activation of the 01d coating, prior to application of the new. U.S. Patent No. 4,446,245.
- Another procedure for anchoring the fresh coating to the substrate, that has found utility in the application of an electrocatalytic coating to a valve metal, is to provide a Porous oxide layer which can be formed on the base metal.
- It has however been found difficult to provide long-lived coated metal articles for serving in the most rugged commercial environments, e.g., oxygen evolving anodes for use in the present-day commercial applications utilized in electrogalvanizing, electrotinning, electroforming or electrowinning. Such may be continuous operation. They can involve severe conditions including potential surface damage. It would be most desirable to provide coated metal substrates to serve as electrodes in such operations, exhibiting extended stable operation while preserving excellent coating adhesion. It would also be highly desirable to provide such an electrode not only from fresh metal but also from recoated metal.
- There has now been found a metal surface which provides an excellent, locked on coating of outstanding coating adhesion. The coated metal substrate can have highly desirable extended lifetime even in most rigorous industrial environments. For the electrocatalytic coatings, the invention may provide for lower effective current densities and also achieve substrate metal grains desirably stabilized against passivation.
- In one aspect, the invention is directed to a metal article having a surface adapted for enhanced coating adhesion, such surface being free from deleterious affects of abrasive treatment while having desirable surface grain size, which surface has three-dimensional grains with deep grain boundaries, such surface having been etched including the etching of impurities located in the grain boundaries at the surface of the metal, which intergranular etching provides a profilometer-measured average surface roughness of at least about 250 microinches and an average surface peaks per inch of at least about 40, basis a profilometer upper threshold limit of 400 microinches and a profilometer lower threshold limit of 300 microinches.
- In another aspect, the invention is directed to the method of preparing a surface of an impure valve metal for enhanced coating adhesion on such surface, which method comprises subjecting the surface to elevated temperature annealing for a time sufficient to provide an at least substantially continuous intergranular network of impurities, including impurities at the surface of such metal; cooling the resulting annealed surface; and etching intergranularly the surface at an elevated temperature and with a strong acid or strong caustic etchant; while maintaining the surface at least substantially free from the deleterious effects of abrasive surface treatment.
- In a still further aspect, the invention is directed to a metal article having a surface adapted for enhanced coating adhesion, said surface having, as measured by profilometer, an average roughness of at least about 250 microinches and an average surface peaks per inch of at least about 40, basis the lower and upper threshold limits mentioned hereinbefore. Such surface most desirably also has an average distance between the maximum peak and the maximum valley of at least about 1,000 microinches and an average peak height of at least about 1,000 microinches.
- When the fully prepared metals are electrocatalytically coated and used as oxygen evolving electrodes, even under the rigorous commercial operations including continuous electrogalvanizing, electrotinning, electroforming or electrowinning, such electrodes can have highly desirable service life. Also, such metals as electrodes may provide an effectively lower current density, which will aid in prolonging the life of the electrode, when used as above discussed or, for example, in water or brine electrolysis.
- The metals of the substrate are broadly contemplated to be any coatable metal. For the particular application of an electrocatalytic coating, the substrate metals might be such as nickel or manganese, but will most always be valve metals, including titanium, tantalum, aluminum, zirconium and niobium. Of particular interest for its ruggedness, corrosion resistance and availability is titanium. As well as the normally available elemental metals themselves, the suitable metals of the substrate can include metal alloys and intermetallic mixtures. For example, titanium may be alloyed with nickel, cobalt, iron, manganese or copper. More specifically, Grade 5 titanium may include up to 6.75 weight% aluminum and 4.5 weight% vanadium, grade 6 up to 6% aluminum and 3% tin, grade 7 up to 0.25 weight% palladium, grade 10, from 10 to 13 weight% molybdenum plus 4.5 to 7.5 weight% zirconium and so on.
- By use of elemental metals, alloys and intermetallic mixtures, it is most particularly meant the metals in their normally available condition, i.e., having minor amounts of impurities. Thus for the metal of particular interest, i.e., titanium, various grades of the metal are available including those in which other constituents may be alloys or alloys plus impurities. In titanium, iron may be a usual impurity. Its maximum concentration can be expected to vary from 0.2 weight percent for grades 1 and 11 up to 0.5% for grades 4 and 6. Additional impurities that may be found throughout the grades of titanium include nitrogen, carbon, hydrogen and oxygen. Since beta-titanium located at the titanium grain boundaries can be susceptible to etching, such beta-titanium is considered herein for purposes of this discussion as an impurity. Thus etching of an impurity as discussed herein may include etching of a phase of the metal itself. In addition to the beta-titanium, the titanium metal of particular interest may have beta-phase stabilizers, some of which may be present in extremely minor amounts in the manner of an impurity and include vanadium, niobium, tantalum, molybdenum, ruthenium, zirconium, tin, hafnium and mixtures thereof. Grades of titanium have been more specifically set forth in the standard specifications for titanium detailed in ASTM B 265-79.
- Regardless of the metal selected and how the metal surface is subsequently processed, the substrate metal advantageously is a cleaned surface. This may be obtained by any of the treatments used to achieve a clean metal surface, but with the provision that unless called for to remove an old coating, mechanical cleaning is typically minimized and preferably avoided. Thus the usual cleaning procedures of degreasing, either chemical or electrolytic, or other chemical cleaning operation may be used to advantage.
- Where an old coating is present on the metal surface, such needs to be addressed before recoating. It is preferred for best extended performance when the finished article will be used with an electrocatalytic coating, such as use as an oxygen evolving electrode, to remove the old coating. In the technical area of the invention which pertains to electrochemically active coatings on a valve metal, chemical means for coating removal are well known. Thus a melt of essentially basic material, followed by an initial pickling will suitably reconstitute the metal surface, as taught in U.S. Patent No. 3,573,100. Or a melt of alkali metal hydroxide containing alkali metal hydride, which may be followed by a mineral acid treatment, is useful, as described in U.S. Patent No. 3,706,600. Usual rinsing and drying steps can also form a portion of these operations.
- When a cleaned surface, or prepared and cleaned surface has been obtained, and particularly where applying an electrocatalytic coating to a valve metal, it is most always contemplated in the practice of the present invention that surface roughness will be achieved by means of etching. In the invention context of etching, it is important to aggressively etch the metal surface to provide deep grain boundaries providing well exposed, three-dimensional grains. It is preferred that such operation will etch impurities located at such grain boundaries. For convenience, a metal having etchable grain boundary impurities may be referred to herein as a metal having a correct "metallurgy". It is however contemplated that other roughening technique, which can be used in addition to or along with the roughness achieved by etching, such as plasma spraying of one or more of a valve metal or valve metal oxide, including valve metal suboxides, onto the metal surface can provide the surface roughness characteristics. These characteristics, as measured by profilometer, are more particularly described hereinbelow.
- Where etching has been selected to achieve surface roughness, an important aspect of the invention involves the enhancement of impurities of the metal at the grain boundaries. This is advantageously done at an early stage of the overall process of metal preparation. One manner of this enhancement that is contemplated is the inducement at, or introduction to, the grain-boundaries of one or more impurities for the metal. For example, with the particularly representative metal titanium, the impurities of the metal might include iron, nitrogen, carbon, hydrogen, oxygen, and beta-titanium. Although impurities introduction procedures that might be used can include surface deposition, e.g., vapor deposition, which might be followed by a heat treatment for surface impurity diffusion, one particular manner contemplated for impurity enhancement is to subject the titanium metal to a hydrogen-containing treatment. This can be accomplished by exposing the metal to a hydrogen atmosphere at elevated temperature. Or the metal might be subjected to an electrochemical hydrogen treatment, with the metal as a cathode in a suitable electrolyte evolving hydrogen at the cathode.
- Another consideration for the aspect of the invention involving etching, which aspect can lead to impurity enhancement at the grain boundaries, involves the heat treatment history of the metal. For example, to prepare a metal such as titanium for etching, it can be most useful to condition the metal, as by annealing, to diffuse impurities to the grain boundaries. Thus, by way of example, Proper annealing of grade 1 titanium will enhance the concentration of the iron impurity at grain boundaries. Where the suitable preparation includes annealing, and the metal is grade 1 titanium, the titanium can be annealed at a temperature of at least about 500°C. for a time of at least about 15 minutes. For efficiency of operation, a more elevated annealing temperature, e.g., 600°-800°C. is advantageous. Annealing times at such more elevated temperatures will typically be on the order of 15 minutes to 4 hours. Alternatively, a short, high temperature anneal, e.g., on the order of 800°C. for a few minutes such as 5-10 minutes, may be continued, after rapid or slow cooling, at a quite low temperature, with 200°-400°C. being representative, for several hours, with 10-20 hours being typical. Suitable conditions can include annealing in air, or under vacuum, or with an inert gas such as argon. Subsequent cooling of the annealed metal can appropriately stabilize the grain boundaries for etching. Stabilization may be achieved by controlled or rapid cooling of the metal or by other usual metal cooling technique including quenching, For convenience, a metal having such stabilization may be referred to herein as a metal having a desirable "heat history".
- For enhancing coating adhesion for the invention aspect of etching, it can be desirable to combine a metal surface having a correct grain boundary metallurgy as above-discussed, with an advantageous grain size. Again, referring to titanium as exemplary, at least a substantial amount of the grains having grain size within the range of from about 3 to about 7 is advantageous. Grain size as referred to herein is in accordance with the designation provided in ASTM E 112-84. Size for titanium grains below about 3 produce a high percentage of brad grains which detract from advantageous coating adhesion. Grain sizes above about 7 are not desired for best three-dimensional grain structure development. Preferably for titanium, the grains will have size within the range from about 4 to about 6.
- After the foregoing operations, e.g., cleaning, or coating removal and cleaning, and including any desired rinsing and drying steps, followed by any impurity enhancement for grain boundary etching, the metal surface is then ready for continuing operation. Where such is etching, it will be with a sufficiently active etch solution to develop aggressive grain boundary attack. Typical etch solutions are acid solution. These can be provided by hydrochloric, sulfuric, perchloric, nitric oxalic, tartaric, and phosphoric acids as well as mixtures thereof, e.g., aqua regia. Other etchants that may be utilized include caustic etchants such as a solution of potassium hydroxide/hydrogen peroxide in combination, or a melt of potassium hydroxide with potassium nitrate. For efficiency of operation, the etch solution is advantageously a strong, or concentrated, solution, such as an 18-22 weight% solution of hydrochloric acid. Moreover, the solution is advantageously maintained during etching at elevated temperature such as at 80°C. or more for aqueous solutions, and often at or near boiling condition or greater, e.g., under refluxing condition. Following etching, the etched metal surface can then be subjected to rinsing and drying steps to prepare the surface for coating.
- Regardless of the technique employed to reach the desired roughness, e.g., plasma spray or intergranular etch, it is necessary that the metal surface have an average roughness (Ra) of at least about 250 microinches and an average number of surface peaks per inch (Nr) of at least about 40. The surface peaks per inch can be typically measured at a lower threshold limit of 300 microinches and an upper threshold limit of 400 microinches. A surface having an average roughness of below about 250 microinches will be undesirably smooth. as will a surface having an average number of surface peaks per inch of below about 40., for providing the needed, substantially enhanced, coating adhesion. Advantageously. the surface will have an average roughness of on the order of about 250 microinches or more, e.g., ranging up to about 750-1500 microinches, with no low spots of less than about 200 microinches. Advantageously, for best avoidance of surface smoothness, the surface will be free from low spots that are less than about 210 to 220 microinches. It is preferable that the surface have an average roughness of from about 300 to about 500 microinches. Advantageously, the surface has an average number of peaks per inch of at least about 60, but which might be on the order of as great as about 130 or more, with an average from about 80 to about 120 being preferred. It is further advantageous for the surface to have an average distance between the maximum peak and the maximum valley (Rm) of at least about 1,000 microinches and to have an average peak height (Rz) of at least about 1,000 microinches. All of such foregoing surface characteristics are as measured by a profilometer. More desirably, the surface for coating will have an Rm value of at least about 1,500 microinches to about 3500 microinches and have a maximum valley characteristic of at least about 1,500 microinches up to about 3500 microinches.
- As representative of the electrochemically active coatings that may then be applied to the etched surface of the metal, are those provided from platinum or other platinum group metals or they can be represented by active oxide coatings such as platinum group metal oxides, magnetite , ferrite, cobalt spinel or mixed metal oxide coatings. Such coatings have typically been developed for use as anode coatings in the industrial electrochemical industry. They may be water based or solvent based, e.g., using alcohol solvent. Suitable coatings of this type have been generally described in one or more of the U.S. Patent Nos. 3,265,526, 3,632,498, 3,711,385 and 4,528,084. The mixed metal oxide coatings can often include at least one oxide of a valve metal with an oxide of a platinum group metal including platinum, palladium, rhodium, iridium and ruthenium or mixtures of themselves and with other metals. Further coatings in addition to those enumerated above include manganese dioxide, lead dioxide, platinate coatings such as MxPt₃O₄ where M is an alkali metal and X is typically targeted at approximately 0.5, nickel-nickel oxide and nickel plus lanthanide oxides.
- It is contemplated that coatings will be applied to the metal by any of those means which are useful for applying a liquid coating composition to a metal substrate. Such methods include dip spin and dip drain techniques, brush application, roller coating and spray application such as electrostatic spray. Moreover spray application and combination techniques, e.g., dip drain with spray application can be utilized. With the above-mentioned coating compositions for providing an electrochemically active coating, a modified dip drain operation can be most serviceable. Following any of the foregoing coating procedures, upon removal from the liquid coating composition, the coated metal surface may simply dip drain or be subjected to other post coating technique such as forced air drying.
- Typical curing conditions for electrocatalytic coatings can include cure temperatures of from about 300°C. up to about 600°C. Curing times may vary from only a few minutes for each coating layer up to an hour or more, e.g., a longer cure time after several coating layers have been applied. However, cure procedures duplicating annealing conditions of elevated temperature plus prolonged exposure to such elevated temperature, are generally avoided for economy of operation. In general, the curing technique employed can be any of those that may be used for curing a coating on a metal substrate. Thus, oven curing, including conveyor ovens may be utilized. Moreover, infrared cure techniques can be useful. Preferably for most economical curing, oven curing is used and the cure temperature used for electrocatalytic coatings will be within the range of from about 450°C. to about 550°C. At such temperatures, curing times of only a few minutes, e.g., from about 3 to 10 minutes, will most always be used for each applied coating layer.
- The following examples show ways in which the invention has been practised, as well as showing comparative examples. However, the examples showing ways in which the invention has been practiced should not be construed as limiting the invention.
- There is used a titanium plate measuring 2 inches by 6 inches by 3/8 inch and being an unalloyed grade 1 titanium, as determined in accordance with the specifications of ASTM B 265-79. This titanium sheet thus contained 0.20 Percent, maximum, iron impurity.
- This plate, which was a fresh grade 1 titanium plate, was degreased in perchloroethylene vapors, rinsed with deionized water and air dried. It was then etched for approximately 1 hour by immersion in 20 weight percent hydrochloric acid aqueous solution heated to 95°C. After removal from the hot hydrochloric acid, the plate was again rinsed with deionized water and air dried. By this etching, the plate achieves a weight loss of 500-600 grams per square meter of plate surface area. This weight loss is determined by pre and post etching weighing of the plate sample and then calculating the loss per square meter by straight forward calculation on the basis of the surface area of both large flat faces of the plate.
- The surface structure of the sample plate, on both broad surfaces, is then examined under a stereo microscope under magnification varying during the study from 40X to 60X. Such plate surface can be seen to have a well defined, three dimensional, grain boundary etch.
- The etched surface was then subjected to surface profilometer measurement using a Hommel model T1000 C instrument manufactured by Hommelwerk GmbH. The plate surface profilometer measurements as average values computed from eight separate measurements conducted by running the instrument in random orientation across on large flat face of the plate. This gave average values for surface roughness (Ra) of 393 microinches, peaks per inch (Nr) of 86 and an average distance between the maximum peak and the maximum valley (Rz) of 2104. The peaks per inch were measured within the threshold limits of 300 microinches (lower) and 400 microinches (upper).
- A titanium plate sample (5mm thick) of unalloyed grade 1 titanium, but from a different batch than the plate sample of Example 1, was etched in 18% HCl at boiling temperature for 1 hour. Visually, the resulting etched surfaces of the titanium plate sample, as viewed in the manner of Example 1, were found not to have a well defined grain boundary etch. Subsequent profilometer measurements, conducted in the manner of Example 1, provided average values of 100 (Ra), 0 (Nr) and 666 (Rz). The sample was etched an additional 1 hour. Profilometer values were only slightly improved, 117(Ra), 8 (Nr) and 770 (Rz), but were still well below those of Example 1.
- A second sample plate from the same batch of unalloyed titanium as was used for the plate sample of Comparative Example 2, was subjected to annealing operation. In this operation, the sample was placed in an oven and the oven was heated until the air temperature reached 700°C. This air temperature was then held for 15 minutes, cooled to 450°C., and held for 30 minutes. Thereafter, while the sample was maintained in the oven, the oven air temperature was permitted to cool to about 200°C in a period of 1.5 hours. The sample was then removed for cooling to room temperature.
- The resulting test sample was then etched in boiling 18 weight percent HCl for one hour, then rinsed and dried as described in Example 1. Subsequently, under visual examination in the manner of Example 1, the etched sample plate was seen to have a highly desirable, three dimensional grain boundary etch. This was confirmed by profilometer measurements which provided average values of 398 (Ra), 76 (Nr) and 2040 (Rz).
- A grade 1 titanium plate sample prepared in the manner of Example 1, and having highly desirable three dimensional and well defined grain boundary etching as described in Example 1, was provided with an electrochemically active coating of tantalum oxide and iridium oxide using an aqueous, acidic solution of chloride salts, the coating being applied and baked in the manner as described in Example 1 of US Patent 4.797.182.
- The resulting sample was tested as an anode in an electrolyte that was a mixture of 285 grams per liter (g/l) of sodium sulfate and 60 g/l of magnesium sulfate. The test cell was maintained at 65°C and operated at a current density of 15 kiloamps per square meter (kA/m²). About once per week the electrolysis was briefly interrupted. The coated titanium plate anode was removed from the electrolyte, rinsed in deionized water, air dried and then cooled to ambient temperature. There was then applied to the coated plate surface, by firmly manually pressing onto the coating, a strip of self-adhesive, pressure sensitive tape. This tape was then removed from the surface by quickly pulling the tape away from the plate. After 3000 hours of operation, including approximately 18 tape tests, the coated anode continued to exhibit excellent coating adhesion to the underlying titanium substrate.
- A sample of 2 mm thick, grade 1 titanium sheet was etched in 20% HCl at 90-95°C. After etching, the profilimeter measurements were found to be 124 (Ra), 12 (Nr) and 765 (Rz). A coating was applied to the etched sheet as described in Example 3. A sample of the sheet was tested in the electrolyte and under the conditions as described in Example 3. After 424 hours of operation, a tape test was performed on the sample resulting in the nearly complete removal of the coating from the tested area, exposing the underlying substrate and effectively terminating the testing.
- At the completion of the testing of the sample of Example 3, the oxide coating was stripped from the surface by means of a molten salt bath. The sample was etched about 30 minutes in 20% HCl at 95-100°C. Profilometer measurements were 337 (Ra), 86 (Nr) and 1816 (Rz) which agreed well with the values obtained before the coating was removed (346 (Ra), 78 (Nr) and 2057 (Rz)). The sample was then recoated using the same coating and procedure as in Example 3. Operation of the recoated anode under the conditions of Example 3 resulted in a lifetime of 2956 hours with tape tests comparable to those of the original sample.
- A sample of titanium which had been previously coated with an electrochemically active coating, was blasted with alumina powder to remove the previous coating. By this abrasive method, it was determined by X-ray fluoroescence that the previous coating had been removed. After removal of any residue of the abrasive treatment, the resulting sample plate was etched in the composition of Example 1 in the manner of Example 1. Under visual inspection as described in Example 1, it was seen that there was no evidence of desirable grain boundary etching. Furthermore, under profilometer measurement, the resulting average values were found to be 137 (Ra), 12 (Nr) and 841 (Rz).
- The sample was nevertheless coated with the electrocatalytic coating of Example 3 in the manner as described in Example 3 and utilized as an anode also in the manner as described in Example 3. After 91 hours of operation, the sample was removed and the coating adhesion tested utilizing the tape test of Example 3. In this test, and after only the 91 hours of testing, the tape removed the majority of the coating exposing the underlying substrate and thus terminating further testing.
- The above-described and exemplified invention can be applied industrially as follows. The manufacture on an industrial scale of coated metal electrodes, especially coated titanium electrodes used as oxygen evolving anodes in high speed electrogalvanizing, electrotinning, electroforming or electrowinning, has involved the problem that some anodes perform satisfactorily for their anticipated lifetime, but an unacceptably high proportion of the anodes fail prematurely under the severe operating conditions and must be returned for stripping/recoating, despite strict controls in the coating procedures. The performance of coated titanium anodes is particularly erratic because the characteristics of the titanium vary substantially from one production batch to another and from one titanium sheet to another because of different heat histories and handling. This applies even to different specimens of titanium from the same batch. It was thus not possible to reliably predict anode performance based solely on careful control of the production conditions because the same etching/annealing procedure could lead to different results for different specimens.
- The invention is based on the insight that the failure mechanism of such electrodes was related to the surface morphology of the substrates. It was found that satisfactory electrodes were those whose substrate surface before coating conformed to the aforementioned specification. Electrodes made with substrates which did not meet up to this specification tended to fail prematurely. It follows that by employing the described inspection procedures it is possible to control whether or not the surface has achieved an optimum condition for receiving a coating so that when the surface is coated the risk of premature failure is practically completely eliminated.
- Such control is achieved by a method of manufacturing a coated metal electrode wherein a metal substrate is surface treated by strong acid or strong caustic etching and the entire etched surface intended to be coated is subjected to optical inspection to determine whether the surface has been intergranularly etched to produce three-dimensional grains with deep grain boundaries. If this inspection is positive, the intergranularly etched surface is then inspected by profilometer to determine whether the three-dimensional grains having deep grain boundaries correspond across the surface to a profilometer-measured average surface roughness (Ra) of at least about 250 microinches (about 635 micrometers), and an average surface peaks per inch (Nr) of at least about 40 (about 15.15 peaks per cm) based on a profilometer upper threshold limit of 400 microinches (1016 micrometers) and a profilometer lower threshold limit of 300 microinches (792 micrometers). If after the optical or profilometer inspection the surface does not meet said specifications, the surface may be subjected to further strong acid or strong caustic etching and to optical and/or profilometer inspection again after the further treatment. If said specifications cannot be attained by further etching, another substrate from the same batch may be subjected to annealing (different to the annealing of the first substrate) followed by etching and inspection, with further etching and inspection if necessary. At the appropriate stage of the process, the electrocatalytic coating is applied to the treated metal surface, but only after optical and profilometer inspection has revealed that the surface meets said specifications.
- This method can incorporate all of the previously mentioned features of the invention and other features set out in the claims.
- In practice, it is advantageous to deal with individual electrodes produced from a single batch of titanium as follows.
- A specimen is treated and inspected as set out above. If optical inspection after etching reveals that the entire surface to be coated does not have the required three-dimensional grain configuration, the same sample can be further etched and inspected as many times as required until the desired surface state is achieved. But if a specimen cannot be brought to the surface specification by further etching, it is necessary to modify the initial annealing on another specimen from the same batch, followed by etching and inspection until the desired surface state is achieved.
- Once optical and profilometer inspections have revealed that a specimen has reached the required specifications following a given annealing/etching treatment, all further specimens from the same batch will be treated in the same manner. But because there is still a risk that the surface may not be optimized, it is still necessary to finally inspect each individual electrode for qualification to the specifications. If necessary, adjustments such as a further etch are made and the inspection procedure is repeated until each electrode meets the specifications, or has been rejected.
- After final inspection, the electrocatalytic coating can be applied directly or it is possible to perform a final "clean up" etch to present a stain-free chemically clean surface for coating, for example by etching for up to 5 minutes in fresh hot hydrochloric acid, followed by rinsing and drying.
- The optical inspection by microscope should scan the entire surface to be coated to ensure that the three-dimensional grain boundaries extend over the entire surface. Profilometer measurements can be carried out at selected points across the surface. To reduce the number of profilometer measurements, it is convenient to measure with settings above the minimum values given.
- It will be appreciated that this procedure according to the invention adds to the production cost of the electrodes, but leads to a great savings during use for example as anodes in electrogalvanizing, electrotinning, electroforming or electrowinning, due to the reliability of all the anodes and the elimination of stoppages for the replacement of prematurely-failed anodes.
Claims (35)
subjecting said surface to elevated temperature annealing for a time sufficient to provide an at least sustantially continuous intergranular network of impurities, including impurities at the surface of said metal;
cooling the resulting annealed surface; and
etching intergranularly the surface at an elevated temperature and with a strong acid or strong caustic etchant;
while maintaining said surface at least substantially free from the deleterious effects of mechanical surface treatment.
subjecting said coated metal surface to a melt containing basic material for removing said coating;
separating the metal surface from the melt, cooling the metal surface and removing melt residue therefrom;
subjecting said surface to elevated temperature annealing for a time sufficient to provide an at least substantially continuous intergranular network diffusion of surface impurities for said metal;
cooling the resulting annealed surface; and etching intergranularly the surface at an elevated temperature and with a strong acid or strong caustic etchant;
while maintaining said surface at least substantially free from the deleterious effects of mechanical surface treatment.
Applications Claiming Priority (2)
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US37442989A | 1989-06-30 | 1989-06-30 | |
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EP90810492A Expired - Lifetime EP0407349B1 (en) | 1989-06-30 | 1990-06-28 | Electrode for use in electrolytic processes and process for manufacturing it |
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EP (1) | EP0407349B1 (en) |
JP (1) | JP2721739B2 (en) |
KR (1) | KR100196661B1 (en) |
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AU (1) | AU632591B2 (en) |
BR (1) | BR9003037A (en) |
CA (1) | CA2018670A1 (en) |
DE (1) | DE69019424T2 (en) |
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GR (1) | GR3017014T3 (en) |
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EP0576402A1 (en) * | 1992-06-25 | 1993-12-29 | Eltech Systems Corporation | Electrodes of improved service life |
US5324407A (en) * | 1989-06-30 | 1994-06-28 | Eltech Systems Corporation | Substrate of improved plasma sprayed surface morphology and its use as an electrode in an electrolytic cell |
EP0633327A1 (en) * | 1993-07-10 | 1995-01-11 | PTG PLASMA-OBERFLÄCHENTECHNIK GmbH | Process for coating household and kitchen utensils |
WO1997017478A1 (en) * | 1995-11-08 | 1997-05-15 | Fissler Gmbh | Process for producing a non-stick coating and objects provided with such a coating |
EP1162288A1 (en) | 2000-06-09 | 2001-12-12 | De Nora Elettrodi S.P.A. | Electrode characterized by highly adhering superficial catalytic layer |
WO2007045716A1 (en) | 2005-10-21 | 2007-04-26 | Outotec Oyj. | Method for forming an electrocatalytic surface on an electrode and the electrode |
CN100429332C (en) * | 2002-03-14 | 2008-10-29 | 德·诺拉电极股份公司 | Anode for oxygen evolution and relevant substrate |
CN104451764A (en) * | 2013-09-18 | 2015-03-25 | 株式会社神户制钢所 | Metal plate for electrode and electrode |
US9683300B2 (en) | 2012-06-18 | 2017-06-20 | Asahi Kasei Kabushiki Kaisha | Bipolar alkaline water electrolysis unit and electrolytic cell |
CN113521384A (en) * | 2021-07-05 | 2021-10-22 | 湖南湘投金天钛金属股份有限公司 | Titanium-based material and preparation method and application thereof |
CN113755902A (en) * | 2021-09-30 | 2021-12-07 | 宁波创致超纯新材料有限公司 | Titanium anode plate and preparation method and application thereof |
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CN104769162B (en) | 2012-10-31 | 2017-08-11 | 大曹株式会社 | Zero pole span salt electrolysis groove anode, salt electrolysis groove and the salt electrolysis method using the salt electrolysis groove |
JP6361437B2 (en) * | 2014-10-07 | 2018-07-25 | 新日鐵住金株式会社 | Production method of pure titanium plate |
DE102021132015B3 (en) | 2021-12-06 | 2023-03-30 | Canon Production Printing Holding B.V. | Device for printing a recording medium |
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US5324407A (en) * | 1989-06-30 | 1994-06-28 | Eltech Systems Corporation | Substrate of improved plasma sprayed surface morphology and its use as an electrode in an electrolytic cell |
EP0493326A3 (en) * | 1990-12-26 | 1993-03-17 | Eltech Systems Corporation | Substrate of improved melt sprayed surface morphology |
EP0493326A2 (en) * | 1990-12-26 | 1992-07-01 | Eltech Systems Corporation | Substrate of improved melt sprayed surface morphology |
EP0576402A1 (en) * | 1992-06-25 | 1993-12-29 | Eltech Systems Corporation | Electrodes of improved service life |
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EP0633327A1 (en) * | 1993-07-10 | 1995-01-11 | PTG PLASMA-OBERFLÄCHENTECHNIK GmbH | Process for coating household and kitchen utensils |
WO1997017478A1 (en) * | 1995-11-08 | 1997-05-15 | Fissler Gmbh | Process for producing a non-stick coating and objects provided with such a coating |
EP1162288A1 (en) | 2000-06-09 | 2001-12-12 | De Nora Elettrodi S.P.A. | Electrode characterized by highly adhering superficial catalytic layer |
CN100429332C (en) * | 2002-03-14 | 2008-10-29 | 德·诺拉电极股份公司 | Anode for oxygen evolution and relevant substrate |
WO2007045716A1 (en) | 2005-10-21 | 2007-04-26 | Outotec Oyj. | Method for forming an electrocatalytic surface on an electrode and the electrode |
US9683300B2 (en) | 2012-06-18 | 2017-06-20 | Asahi Kasei Kabushiki Kaisha | Bipolar alkaline water electrolysis unit and electrolytic cell |
CN104451764A (en) * | 2013-09-18 | 2015-03-25 | 株式会社神户制钢所 | Metal plate for electrode and electrode |
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CN113521384A (en) * | 2021-07-05 | 2021-10-22 | 湖南湘投金天钛金属股份有限公司 | Titanium-based material and preparation method and application thereof |
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Also Published As
Publication number | Publication date |
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GR3017014T3 (en) | 1995-11-30 |
CA2018670A1 (en) | 1990-12-31 |
NO902922D0 (en) | 1990-06-29 |
EP0407349A3 (en) | 1992-02-05 |
ATE122735T1 (en) | 1995-06-15 |
EP0407349B1 (en) | 1995-05-17 |
BR9003037A (en) | 1991-08-20 |
TW214570B (en) | 1993-10-11 |
ES2071803T3 (en) | 1995-07-01 |
KR100196661B1 (en) | 1999-06-15 |
AU5804190A (en) | 1991-01-03 |
KR910001096A (en) | 1991-01-30 |
JPH0347999A (en) | 1991-02-28 |
NO902922L (en) | 1991-01-02 |
AU632591B2 (en) | 1993-01-07 |
DE69019424T2 (en) | 1995-09-14 |
JP2721739B2 (en) | 1998-03-04 |
DE69019424D1 (en) | 1995-06-22 |
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