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EP0325702B1 - Microstrip antenna - Google Patents

Microstrip antenna Download PDF

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Publication number
EP0325702B1
EP0325702B1 EP88117440A EP88117440A EP0325702B1 EP 0325702 B1 EP0325702 B1 EP 0325702B1 EP 88117440 A EP88117440 A EP 88117440A EP 88117440 A EP88117440 A EP 88117440A EP 0325702 B1 EP0325702 B1 EP 0325702B1
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EP
European Patent Office
Prior art keywords
base plate
substrate
radiation elements
depressions
electrically conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP88117440A
Other languages
German (de)
French (fr)
Other versions
EP0325702A1 (en
Inventor
Rudolf Dr.-Ing. Zahn
Christian Dipl.-Ing. Borgwardt
Werner Dr.-Ing. Scherber
Dr.-Ing. Chung-Chi-Lin
Joachim Dr.-Ing. Boukamp
Hans Wolfgang Dr. rer. nat. Schröder
Günter Dr.-Ing. Helwig
Albert Dipl.-Ing. Braig
Oswald Dipl.-Ing. Bender
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dornier GmbH
Original Assignee
Dornier GmbH
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Publication date
Application filed by Dornier GmbH filed Critical Dornier GmbH
Publication of EP0325702A1 publication Critical patent/EP0325702A1/en
Application granted granted Critical
Publication of EP0325702B1 publication Critical patent/EP0325702B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H01Q13/18—Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas

Definitions

  • the invention relates to two microstrip antennas, which are intended in particular for aerospace applications.
  • Microstrip antennas have advantageous properties - such as a flat structure, inexpensive and precise manufacture of the radiator geometry using lithographic processes, possible implementation of the food network for group antennas on the same substrate - which make this antenna shape appear attractive for group antennas.
  • the small distance between the radiator and the conductive base plate in the conventional design has a negative effect on the radiator efficiency and the permissible dimensional and material tolerances.
  • An increase in the distance by using a thicker substrate material has the disadvantage of an increased weight.
  • the proportion of the power carried in surface waves increases with increasing thickness of the substrate material, which in turn reduces the efficiency and worsens the radiation pattern.
  • a thick, low density substrate or a multilayer, thick substrate is used using air or vacuum or a low density material such as e.g. Foam or honeycomb material is used, so the surface wave proportion is lower.
  • a low density material such as e.g. Foam or honeycomb material
  • Foam or honeycomb material is used, so the surface wave proportion is lower.
  • the feed-in of the electrical power is problematic due to the large distance between the radiator level and the base plate and leads to further undesired radiation.
  • the exact maintenance of the distance between the radiator level and the base plate requires a support structure, in particular when the substrate is assembled using air or vacuum.
  • active antennas in particular for aerospace antennas, good thermal conductivity from the transmitter / receiver modules arranged on the base plate to the antenna front is also required. This is not the case with substrates of low density, especially not if the substrate contains a vacuum area.
  • the object of the invention is - based on the generic arrangements - to further develop them in such a way that the antenna arrangements are suitable for space travel applications and stability and low weight are ensured.
  • the devices according to the invention have a high efficiency, a high bandwidth and a high tolerance insensitivity.
  • the feed line system remains largely radiation-free due to the higher capacitive coupling to the base plate.
  • the surface wave excitation is not reinforced.
  • the weight of the antenna remains low. Adequate thermal conductivity perpendicular to the antenna surface is given, since the antenna - except under the radiator elements - can be made very thin.
  • the greater the distance between the radiator and the base plate compared to the substrate thickness is only important under the radiators. This increase in distance can be achieved by deforming the base plate (tub structure) or the substrate (mesa structure). The resulting space between the substrate and base plate is filled with a foam material for mechanical stiffening.
  • the invention makes it possible to meet the opposing requirements for high efficiency and wide bandwidth of the radiator elements on the one hand - namely a large distance between the radiator and the base plate with a low dielectric constant - and for freedom from radiation (low stripline losses) and easy coupling of the feed lines to the power supply on the other hand - namely low substrate thickness medium to high dielectric constant - to combine on a substrate.
  • the weight remains low and heat conduction from the base plate to the radiator level is guaranteed. Due to the elevations or depressions, the antenna is light and yet mechanically stable.
  • the impedance is preferably adjusted where the distance between the top line and the base plate is changed (ie at e).
  • the fact that the matching lines and the feed line network are arranged in a preferred embodiment on the top of the substrate has the advantage that the production can be carried out in one operation. Because no transitions are required, the accuracy and the reproducibility of the production of the feed lines can be as great as in the production of the radiators (c).
  • the top of the substrate is coated with thermal paint in order to improve the radiation of heat or to minimize heat absorption by the sun or albedo.
  • the surface is highly electrically conductive or can be made highly conductive by a (metal) coating.
  • Carbon fiber reinforced plastic is well suited because this material has a very low coefficient of thermal expansion.
  • the base plate can also consist of a plastic (for example a fluorocarbon such as Teflon), which is coated with a highly conductive, resistant and well-adhering layer.
  • a plastic for example a fluorocarbon such as Teflon
  • Teflon a fluorocarbon
  • the metals chromium (Cr), copper (Cu), titanium (Ti), palladium (Pd) and gold (Au) are suitable.
  • reinforced or unreinforced plastics in particular thermoplastics, are suitable as material for the substrate b.
  • These materials have sufficiently low dielectric losses. Examples include all materials that are used for the production of high-quality radomes and printed circuit boards for microwave technology. From an electrical point of view, reinforced and unreinforced materials based on fluorocarbons such as PTFE, FEP or PFA and on the basis of polyethylene are particularly suitable.
  • a particularly suitable material for the substrate is polyethylene fiber reinforced polyethylene. With this material very low thermal expansion coefficients can be realized. In addition to its function as a dielectric, this material can also perform supporting functions.
  • the substrate b consists of a 1 mm thick plate made of polyethylene fiber reinforced polyethylene and the basic structure made of carbon fiber reinforced epoxy resin.
  • the elevations or depressions can be produced by thermomechanical forming of plates.
  • a 1.5 mm thick sheet of glass microfiber reinforced PTFE available under the trade name RT / Duroid 5780, RT / Duroid is a registered trademark of Rogers Corporation, Arizona, USA
  • RT / Duroid is a registered trademark of Rogers Corporation, Arizona, USA
  • shape of the substrate b or of the basic structure can be produced by mechanical processing (for example by milling).
  • the optically structured foils can be applied before or after the deformation of the Teflon substrate.
  • a dip coating with photoresist can also be used, with the dip coating being used to lift off the remaining Flat in acetone.
  • the radiator elements can also be coupled in that the feed line is not guided on the substrate, but in each case in the substrate to below the respective radiator element and the relative dielectric constant of the substrate material between the feed line and the radiator is locally increased.
  • Both figures each show a section of a group antenna with the base plates a, the electrically insulating substrate b and radiator elements c. Also drawn are the feed lines d and widening transition regions e which electrically connect the feed lines d to the radiator elements c.
  • the elevations or depressions can be, for example, between 0.5 and 10 mm high (deep).
  • Figure 1 shows the embodiment with a mesa-shaped increase in the substrate b.
  • Figure 2 shows the version with a trough-shaped depression of the base plate a.

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Description

Die Erfindung betrifft zwei Mikrostreifenleiterantennen, die insbesondere für Luft- und Raumfahrtanwendungen vorgesehen sind.The invention relates to two microstrip antennas, which are intended in particular for aerospace applications.

Mikrostreifenleiterantennen besitzen vorteilhafte Eigenschaften - wie flacher Aufbau, kostengünstige und genaue Herstellung der Strahlergeometrie mit lithografischen Verfahren, mögliche Realisierung des Speisennetzwerkes für Gruppenantennen auf dem gleichen Substrat -, die diese Antennenform für Gruppenantennen attraktiv erscheinen lassen.
Andererseits wirkt sich der in der konventionellen Bauform geringe Abstand zwischen Strahler und leitender Grundplatte nachteilig auf den Strahlerwirkungsgrad und die zulässigen Abmessungs- und Stoffkonstantentoleranzen aus.Microstrip antennas have advantageous properties - such as a flat structure, inexpensive and precise manufacture of the radiator geometry using lithographic processes, possible implementation of the food network for group antennas on the same substrate - which make this antenna shape appear attractive for group antennas.
On the other hand, the small distance between the radiator and the conductive base plate in the conventional design has a negative effect on the radiator efficiency and the permissible dimensional and material tolerances.

Eine Vergrösserung des Abstandes durch Verwendung eines dickeren Substratmaterials hat den Nachteil eines vergrösserten Gewichts. Der Anteil der in Oberflächenwellen geführten Leistung wird mit zunehmender Dicke des Substratmaterials grösser, was wiederum den Wirkungsgrad verringert und das Strahlungsdiagramm verschlechtert.An increase in the distance by using a thicker substrate material has the disadvantage of an increased weight. The proportion of the power carried in surface waves increases with increasing thickness of the substrate material, which in turn reduces the efficiency and worsens the radiation pattern.

Wird ein dickes Substrat geringer Dichte oder ein mehrschichtiges, dickes Substrat unter Verwendung von Luft bzw. Vakuum oder einem Material geringer Dichte, wie z.B. Schaum oder Wabenmaterial, benutzt, so wird der Oberflächenwellenanteil geringer. Gleichzeitig tritt jedoch eine verstärkte unerwünschte Abstrahlung durch die Speiseleitungen auf. Die Einspeisung der elektrischen Leistung ist durch den grossen Abstand zwischen Strahlerebene und Grundplatte problematisch und führt zu weiterer unerwünschter Abstrahlung. Die genaue Einhaltung des Abstandes zwischen Strahlerebene und Grundplatte erfordert insbesondere bei zusammengesetztem Substrat unter Verwendung von Luft beziehungsweise Vakuum eine Stützkonstruktion. Für aktive Antennen, insbesondere für Raumfahrtantennen, wird zudem eine gute Wärmeleitfähigkeit von den auf der Grundplatte angeordneten Sende/Empfangsmodulen zur Antennenvorderseite benötigt. Diese ist bei Substraten geringer Dichte nicht gegeben, insbesondere dann nicht, wenn das Substrat einen Vakuumbereich enthält.If a thick, low density substrate or a multilayer, thick substrate is used using air or vacuum or a low density material such as e.g. Foam or honeycomb material is used, so the surface wave proportion is lower. At the same time, however, there is an increased unwanted radiation through the feed lines. The feed-in of the electrical power is problematic due to the large distance between the radiator level and the base plate and leads to further undesired radiation. The exact maintenance of the distance between the radiator level and the base plate requires a support structure, in particular when the substrate is assembled using air or vacuum. For active antennas, in particular for aerospace antennas, good thermal conductivity from the transmitter / receiver modules arranged on the base plate to the antenna front is also required. This is not the case with substrates of low density, especially not if the substrate contains a vacuum area.

Aus der DE-OS 28 16 362 ist eine Mikrostreifenleiterantenne bekannt mit

  • einer elektrisch leitfähigen Grundplatte,
  • einem elektrisch isolierenden Substrat,
  • einer Gruppe von Strahlerelementen
  • und Speiseleitungen,
wobei die Grundplatte unterhalb der auf der Oberseite des Substrats angebrachten Strahlerelemente Vertiefungen aufweist, deren Lateral- abmessungen etwas grösser sind als die der Strahlerelemente.
Durch diese Vertiefungen werden zur Erzielung von Resonanzefffekten eine Vielzahl kleiner Hohlraumresonatoren gebildet. Diese Vorrichtung bildet den Oberbegriff des nebengeordneten Anspruchs 2.From DE-OS 28 16 362 a microstrip antenna is known with
  • an electrically conductive base plate,
  • an electrically insulating substrate,
  • a group of radiator elements
  • and feed lines,
the base plate having depressions below the radiator elements attached to the top of the substrate, the lateral dimensions of which are somewhat larger than those of the radiator elements.
A large number of small cavity resonators are formed through these depressions in order to achieve resonance effects. This device forms the preamble of the independent claim 2.

Der Problemkreis: Wirkungsgrad - Gewicht - Wärmeableitung - Eignung für Weltraumanwendungen ist nicht angesprochen.The problem area: efficiency - weight - heat dissipation - suitability for space applications is not addressed.

Aus der GB 2 046 530 A ist eine Mikrostreifenleiterantenne bekannt mit

  • einer elektrisch leitfähigen Grundplatte,
  • einem elektrisch isolierenden Substrat aus Kunststoff,
  • einer Gruppe von Strahlerelementen aus Kupfer,
  • und Speiseleitungen,
wobei die Strahlerelemente auf Erhebungen aus dielektrischem Material angeordnet sind, deren Lateralabmessungen etwas grösser sind als die Strahlerelemente.
Diese Vorrichtung bildet den Oberbegriff des Anspruchs 1. Zur Erreichung einer hohen mechanischen Stabilität bei geringem Gewicht und zur Eignung für den Betrieb unter Weltraumbedingungen sind keine Angaben gemacht. GB 2 046 530 A discloses a microstrip antenna
  • an electrically conductive base plate,
  • an electrically insulating substrate made of plastic,
  • a group of copper radiator elements,
  • and feed lines,
the radiator elements being arranged on elevations made of dielectric material, the lateral dimensions of which are somewhat larger than the radiator elements.
This device forms the preamble of claim 1. No information has been given on achieving high mechanical stability with low weight and on suitability for operation under space conditions.

Aufgabe der Erfindung ist es - ausgehend von den gattungsgemäßen Anordnungen - diese so weiterzubilden, daß die Antennenanordnungen für Raumfahrtanwendungen geeignet sind und dabei Stabilität und geringes Gewicht gewährleistet ist.The object of the invention is - based on the generic arrangements - to further develop them in such a way that the antenna arrangements are suitable for space travel applications and stability and low weight are ensured.

Diese Aufgabe wird erfindungsgemäß gelöst von den Vorrichtungen der nebengeordneten Ansprüche 1 und 2.According to the invention, this object is achieved by the devices of the independent claims 1 and 2.

Die erfindungsgemäßen Vorrichtungen haben einen hohen Wirkungsgrad, eine hohe Bandbreite sowie eine hohe Toleranzunempfindlichkeit. Das Speiseleitungssystem bleibt dabei wegen der höheren kapazitiven Kopplung mit der Grundplatte weitgehend abstrahlungsfrei. Die Oberflächenwellenanregung wird nicht verstärkt. Das Gewicht der Antenne bleibt gering. Eine ausreichende Wärmeleitfähigkeit senkrecht zur Antennenfläche ist gegeben, da die Antenne - außer unter den Strahlerelementen - sehr dünn ausgelegt sein kann.The devices according to the invention have a high efficiency, a high bandwidth and a high tolerance insensitivity. The feed line system remains largely radiation-free due to the higher capacitive coupling to the base plate. The surface wave excitation is not reinforced. The weight of the antenna remains low. Adequate thermal conductivity perpendicular to the antenna surface is given, since the antenna - except under the radiator elements - can be made very thin.

Wichtig ist der grössere Abstand zwischen Strahler und Grundplatte gegenüber der Substratdicke nur unter den Strahlern. Diese Abstandsvergrösserung kann durch Verformen der Grundplatte (Wannen-struktur) oder des Substrats (Mesa-Struktur) erreicht werden. Der entstehende Zwischenraum zwischen Substrat und Grundplatte ist mit einem Schaummaterial zur mechanischen Versteifung gefüllt.The greater the distance between the radiator and the base plate compared to the substrate thickness is only important under the radiators. This increase in distance can be achieved by deforming the base plate (tub structure) or the substrate (mesa structure). The resulting space between the substrate and base plate is filled with a foam material for mechanical stiffening.

Die Erfindung erlaubt es, die gegenläufigen Forderungen für hohen Wirkungsgrad und grosse Bandbreite der Strahlerelemente einerseits - nämlich grosser Abstand zwischen Strahler und Grundplatte bei kleiner Dielektrizitätszahl - sowie für Abstrahlungsfreiheit (geringe Streifenleiterverluste) und leichte Ankoppelbarkeit der Speiseleitungen an die Leistungszufühtung andererseits - nämlich geringe Substratdicke bei mittlerer bis hoher Dielektrizitätszahl - auf einem Substrat zu vereinigen. Gleichzeitig bleibt das Gewicht gering und eine Wärmeleitung von der Grundplatte zur Strahlerebene ist gewährleistet. Die Antenne ist durch die Erhebungen oder Vertiefungen leicht und doch mechanisch stabil.The invention makes it possible to meet the opposing requirements for high efficiency and wide bandwidth of the radiator elements on the one hand - namely a large distance between the radiator and the base plate with a low dielectric constant - and for freedom from radiation (low stripline losses) and easy coupling of the feed lines to the power supply on the other hand - namely low substrate thickness medium to high dielectric constant - to combine on a substrate. At the same time, the weight remains low and heat conduction from the base plate to the radiator level is guaranteed. Due to the elevations or depressions, the antenna is light and yet mechanically stable.

Die Anpassung des Wellenwiderstands erfolgt bevorzugt dort, wo der Abstand zwischen der oberseitigen Leitung und der Grundplatte geändert wird (also bei e). Daß die Anpassungsleitungen und das Speiseleitungsnetzwerk in einer bevorzugten Ausführung auf der Substratoberseite angeordnet sind, hat den Vorteil, daß die Herstellung in einem Arbeitsgang erfolgen kann. Dadurch, daß keine Übergänge erforderlich sind, können die Genauigkeit und die Reproduzierbarkeit der Herstellung der Zuleitungen so groß sein, wie bei der Herstellung der Strahler (c).
In einer Ausführung ist die Substratoberseite mit Thermalfarbe beschichtet, um die Abstrahlung der Wärme zu verbessern oder die Wärmeaufnahme durch Sonne oder Albedo zu minimieren.The impedance is preferably adjusted where the distance between the top line and the base plate is changed (ie at e). The fact that the matching lines and the feed line network are arranged in a preferred embodiment on the top of the substrate has the advantage that the production can be carried out in one operation. Because no transitions are required, the accuracy and the reproducibility of the production of the feed lines can be as great as in the production of the radiators (c).
In one embodiment, the top of the substrate is coated with thermal paint in order to improve the radiation of heat or to minimize heat absorption by the sun or albedo.

Hinsichtlich der Werkstoffe für die Grundplatte bestehen im Prinzip keine Einschränkungen, sofern die Oberfläche elektrisch gut leitfähig ist oder durch eine (Metall-) Beschichtung gut leitfähig gemacht werden kann. Carbonfaserverstärkter Kunststoff ist gut geeignet, da dieses Material sehr geringe thermische Ausdehnungskoeffizienten aufweist. Die Grundplatte kann auch aus einem Kunststoff (z.B. einem Fluorkohlenwasserstoff wie Teflon) bestehen, der mit einer hochleitenden, widerstandsfähigen und gut haftenden Schicht belegt ist. In Frage kommen z.B. die Metalle Chrom (Cr), Kupfer (Cu), Titan (Ti), Palladium (Pd) und Gold (Au).With regard to the materials for the base plate, there are in principle no restrictions, provided the surface is highly electrically conductive or can be made highly conductive by a (metal) coating. Carbon fiber reinforced plastic is well suited because this material has a very low coefficient of thermal expansion. The base plate can also consist of a plastic (for example a fluorocarbon such as Teflon), which is coated with a highly conductive, resistant and well-adhering layer. For example, the metals chromium (Cr), copper (Cu), titanium (Ti), palladium (Pd) and gold (Au) are suitable.

Wegen seiner guten Haftung, der hohen Leitfähigkeit und der einfachen Verfahren der galvanischen Verstärkung ist Kupfer als Leitschicht besonders gut geeignet. Zur Erhöhung der Korrosionsbeständigkeit kann es mit Gold beschichtet sein. Die Herstellungsprozesse sind an sich bekannt:

  • Teflon mechanisch und naßchemisch reinigen
  • Teflon im Vakuumplasma sputterätzen
  • Kupfer ca. 300 nm dick aufsputtern
  • Kupfer galvanisch verstärken
  • Gold aufdampfen
Moderne Kassettensputteranlagen erlauben die Beschichtung großflächiger Substrate (> 1 m²). In solchen Anlagen werden beispielsweise bisher Autoscheiben und Fenstergläser mit optischen Schichten besputtert.Because of its good adhesion, high conductivity and simple galvanic reinforcement processes, copper is particularly suitable as a conductive layer. It can be coated with gold to increase corrosion resistance. The manufacturing processes are known per se:
  • Clean Teflon mechanically and wet-chemically
  • Sputter etch Teflon in vacuum plasma
  • Sputter copper approx. 300 nm thick
  • Galvanically reinforce copper
  • Evaporate gold
Modern cassette sputtering systems allow the coating of large substrates (> 1 m²). In such systems, for example, car windows and window glasses have previously been sputtered with optical layers.

Als Material für das Substrat b eignen sich neben mehrschichtigen Dielektrika verstärkte oder unverstärkte Kunststoffe, insbesondere Thermoplaste. Diese Werkstoffe haben hinreichend geringe dielektrische Verluste. Beispiele dafür sind alle Werkstoffe, die für die Herstellung von hochwertigen Radomen, sowie von Leiterplatinen für die Mikrowellentechnik eingesetzt werden. Aus elektrischer Sicht besonders geeignet sind verstärkte und unverstärkte Werkstoffe auf der Basis von Fluorkohlenstoffen wie PTFE, FEP oder PFA, sowie auf der Basis von Polyethylen. Ein besonders geeigneter Werkstoff für das Substrat ist polyethylenfaserverstärktes Polyethylen. Bei diesem Werkstoff können sehr geringe thermische Ausdehnungskoeffizienten realisiert werden. Dieser Werkstoff kann zudem über die Funktion als Dielektrikum hinaus noch tragende Funktionen erfüllen. In einem Ausführungsbeispiel wurde eine Bauweise realisiert, bei der das Substrat b aus eine 1 mm dicken Platte aus polyethylenfaserverstärktem Polyethylen und die Grundstruktur aus carbonfaserverstärktem Epoxidharz besteht.In addition to multilayer dielectrics, reinforced or unreinforced plastics, in particular thermoplastics, are suitable as material for the substrate b. These materials have sufficiently low dielectric losses. Examples include all materials that are used for the production of high-quality radomes and printed circuit boards for microwave technology. From an electrical point of view, reinforced and unreinforced materials based on fluorocarbons such as PTFE, FEP or PFA and on the basis of polyethylene are particularly suitable. A particularly suitable material for the substrate is polyethylene fiber reinforced polyethylene. With this material very low thermal expansion coefficients can be realized. In addition to its function as a dielectric, this material can also perform supporting functions. In one embodiment, a construction was realized in which the substrate b consists of a 1 mm thick plate made of polyethylene fiber reinforced polyethylene and the basic structure made of carbon fiber reinforced epoxy resin.

Die Herstellung der Erhebungen oder Vertiefungen kann durch thermomechanisches Umformen von Platten erfolgen. In einem Ausführungsbeispiel wird eine 1,5 mm dicke Platte aus glasmikrofaserverstärktem PTFE (unter der Handelsbezeichnung RT/Duroid 5780 erhältlich, RT/Duroid ist ein eingetragenes Warenzeichen der Rogers Corporation, Arizona, USA) bei 350°C zwischen konturierten Metallstempeln tiefgezogen. In einer anderen Ausbildungsform kann die Form des Substrats b oder der Grundstruktur durch mechanische Bearbeitung (z.B. durch Fräsen) hergestellt werden.The elevations or depressions can be produced by thermomechanical forming of plates. In one embodiment, a 1.5 mm thick sheet of glass microfiber reinforced PTFE (available under the trade name RT / Duroid 5780, RT / Duroid is a registered trademark of Rogers Corporation, Arizona, USA) is deep-drawn at 350 ° C. between contoured metal stamps. In another embodiment, the shape of the substrate b or of the basic structure can be produced by mechanical processing (for example by milling).

Die Beschichtung des Substrats kann mit den Verfahren erfolgen, die weiter oben zur Beschichtung der Grundplatte genannt waren. Die Strukturierung der Metallschichten kann durch Ätzverfahren oder Lift-off-Verfahren erfolgen. Als Ätzresist oder Lift-off-Schicht können photoempfindliche Lacke und Folien eingesetzt werden, aber auch (mechanisch) strukturierte Polymer- und Metallfolien.
Geeignet ist folgendes Verfahren:

  • Eine lichtempfindliche Folie wird auf ein Teflon-Substrat der Mikrostripantenne aufgewalzt.
  • Metallbeschichtung wieder wie weiter oben beschrieben oder durch Aufdampfen oder Aufsputtern.
  • Nach dem letzten Beschichtungsschritt wird die Folie mitsamt der unerwünschten Beschichtung abgezogen (Negativverfahren).
The substrate can be coated using the methods mentioned above for coating the base plate. The structuring of the metal layers can be carried out by etching processes or lift-off processes. Photosensitive lacquers and foils can be used as an etching resist or lift-off layer, but also (mechanically) structured polymer and metal foils.
The following procedure is suitable:
  • A photosensitive film is rolled onto a Teflon substrate of the microstrip antenna.
  • Metal coating again as described above or by vapor deposition or sputtering.
  • After the last coating step, the film together with the unwanted coating peeled off (negative process).

Die optisch strukturierten Folien können vor oder nach Verformung des Teflon-Substrats aufgebracht werden. Es kann auch auf eine Tauchbadlackierung mit Photolack übergegangen werden, wobei derTauchlack zum Lift-off der freibleibenden Flachen in Azeton abgelöst wird.The optically structured foils can be applied before or after the deformation of the Teflon substrate. A dip coating with photoresist can also be used, with the dip coating being used to lift off the remaining Flat in acetone.

Die Ankoppelung der Strahlerelemente kann auch dadurch erfolgen, daß die Zuleitung nicht auf dem Substat, sondern jeweils im Substrat bis unter das jeweilige Strahlerelement geführt ist und die relative Dielektrizitätskonstante des Substratmaterials zwischen Zuleitung und Strahler lokal erhöht wird.The radiator elements can also be coupled in that the feed line is not guided on the substrate, but in each case in the substrate to below the respective radiator element and the relative dielectric constant of the substrate material between the feed line and the radiator is locally increased.

Die Erfindung wird anhand zweier Figuren näher erläutert.The invention is explained in more detail with reference to two figures.

Beide Figuren zeigen je einen Ausschnitt aus einer Gruppenantenne mit den Grundplatten a, dem elektrisch isolierenden Substrat b und Strahlerelementen c. Gezeichnet sind weiter die Speiseleitungen d und sich verbreiternde Übergangsbereiche e, die die Speiseleitungen d mit den Strahlerelementen c elektrisch verbinden. Die Erhöhungen oder Vertiefungen können beispielsweise zwischen 0,5 und 10 mm hoch (tief) sein.
Figur 1 zeigt die Ausführung mit mesa-förmiger Erhöhung des Substrats b.
Figur 2 zeigt die Ausführung mit wannenförmiger Vertiefung der Grundplatte a.Both figures each show a section of a group antenna with the base plates a, the electrically insulating substrate b and radiator elements c. Also drawn are the feed lines d and widening transition regions e which electrically connect the feed lines d to the radiator elements c. The elevations or depressions can be, for example, between 0.5 and 10 mm high (deep).
Figure 1 shows the embodiment with a mesa-shaped increase in the substrate b.
Figure 2 shows the version with a trough-shaped depression of the base plate a.

Claims (2)

  1. Microstrip antenna, having:
    - an electrically conductive base plate (a);
    - an electrically insulating substrate (b) of plastics material;
    - a group of radiation elements (c) of copper; and
    - feed lines (d),
    wherein the radiation elements (c) are disposed on raised areas of dielectric material, the lateral dimensions of which are somewhat larger than those of the radiation elements (c), characterised in that the raised areas are formed below the radiation elements (c) out of the insulating substrate (b), whereby a space between the substrate (b) and the base plate (a) is formed under each raised area, in that the electrically conductive base plate (a) comprises carbon-fibre reinforced plastics material, in that the space under the raised areas is filled with a foam material; and in that the radiation elements (c) are coated with gold.
  2. Microstrip antenna having
    - an electrically conductive base plate (a);
    - an electrically insulating substrate (b);
    - a group of radiation elements (c); and
    - feed lines (d),
    wherein the base plate (a) has depressions below the radiation elements (c) mounted on the top of the substrate (b), the lateral measurements of which depressions are somewhat larger than those of the radiation elements (c), and the depressions below the radiation elements (c) are formed in the base plate (a), whereby a space between the substrate (b) and the base plate (a) is formed in each depression, characterised in that the electrically conductive base plate (a) comprises carbon-fibre reinforced plastics material; and in that the space in the depressions is filled with a foam material; and in that the radiation elements (c) comprise copper and are coated with gold.
EP88117440A 1987-11-13 1988-10-19 Microstrip antenna Expired - Lifetime EP0325702B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19873738513 DE3738513A1 (en) 1987-11-13 1987-11-13 MICROSTRIP LADDER AERIAL
DE3738513 1987-11-13

Publications (2)

Publication Number Publication Date
EP0325702A1 EP0325702A1 (en) 1989-08-02
EP0325702B1 true EP0325702B1 (en) 1993-09-08

Family

ID=6340391

Family Applications (1)

Application Number Title Priority Date Filing Date
EP88117440A Expired - Lifetime EP0325702B1 (en) 1987-11-13 1988-10-19 Microstrip antenna

Country Status (4)

Country Link
US (1) US5061938A (en)
EP (1) EP0325702B1 (en)
JP (1) JP2774116B2 (en)
DE (2) DE3738513A1 (en)

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Also Published As

Publication number Publication date
US5061938A (en) 1991-10-29
DE3738513A1 (en) 1989-06-01
DE3883960D1 (en) 1993-10-14
JPH01251805A (en) 1989-10-06
EP0325702A1 (en) 1989-08-02
JP2774116B2 (en) 1998-07-09
DE3738513C2 (en) 1991-04-11

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