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EP0259709A2 - Method for producing conductive and/or resistive paths on a substrate, and potentiometer manufactured thereby - Google Patents

Method for producing conductive and/or resistive paths on a substrate, and potentiometer manufactured thereby Download PDF

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Publication number
EP0259709A2
EP0259709A2 EP87112459A EP87112459A EP0259709A2 EP 0259709 A2 EP0259709 A2 EP 0259709A2 EP 87112459 A EP87112459 A EP 87112459A EP 87112459 A EP87112459 A EP 87112459A EP 0259709 A2 EP0259709 A2 EP 0259709A2
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EP
European Patent Office
Prior art keywords
intermediate carrier
substrate
resistance
track
potentiometer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP87112459A
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German (de)
French (fr)
Other versions
EP0259709A3 (en
Inventor
Peter Dipl.-Chem. Ambros
Walter Budig
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Preh GmbH
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Preh GmbH
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Filing date
Publication date
Application filed by Preh GmbH filed Critical Preh GmbH
Publication of EP0259709A2 publication Critical patent/EP0259709A2/en
Publication of EP0259709A3 publication Critical patent/EP0259709A3/en
Withdrawn legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C10/00Adjustable resistors
    • H01C10/30Adjustable resistors the contact sliding along resistive element
    • H01C10/32Adjustable resistors the contact sliding along resistive element the contact moving in an arcuate path
    • H01C10/34Adjustable resistors the contact sliding along resistive element the contact moving in an arcuate path the contact or the associated conducting structure riding on collector formed as a ring or portion thereof

Definitions

  • the invention relates to a method for producing conductor tracks and / or resistance tracks on a substrate, the guide tracks and / or resistance tracks being first completed on an intermediate carrier, then the substrate is connected to the conductor track and / or resistance track adhering to the intermediate carrier and finally the intermediate carrier is separated from the interconnect and / or resistance track.
  • the invention further relates to a potentiometer produced by this method.
  • EP-O 0 157 666 A1 describes a rotatable potentiometer in which a resistance track is arranged on the inner wall of an approximately cylindrical space.
  • the object of the invention is to propose a method of the type mentioned at the outset, with which conductor tracks and / or resistance tracks can be produced on a concavely curved wall surface.
  • the above object is achieved in a method of the type mentioned at the outset in that a cylindrical or conical body is used as the intermediate carrier, on the outer circumference of which the conductor and / or resistance track is produced, by the circumference of the guide and / or resistance track supporting intermediate body, the substrate is applied and cured and that the intermediate carrier is then removed.
  • This method easily creates a substrate with a cylindrical or conical interior, on the wall of which the conductor and / or resistance track is arranged.
  • the substrate is applied at a temperature higher than the ambient temperature and the coefficient of thermal expansion of the intermediate carrier is chosen to be higher than that of the substrate. It is thereby achieved that the intermediate carrier can be easily pulled out of the substrate after cooling.
  • the intermediate carrier preferably consists of metal in a manner known per se and is provided with an oxide layer as a separating layer. This favors the separation of the conductor and / or resistance path in the substrate from the intermediate carrier.
  • the intermediate carrier can also consist of a thermoplastic.
  • the substrate is preferably formed from a thermosetting plastic molding compound.
  • the substrate can then simultaneously form a stable housing.
  • a potentiometer manufactured according to the above-mentioned method is characterized in that the substrate forms the housing of the potentiometer and encloses a cylindrical cavity, on the inner wall of which the conducting and resistance tracks are provided, and in that a tapping part which is rotatable about its central axis is mounted in the cavity contacted the conductive and resistance tracks.
  • the conductive and resistance tracks are extremely smooth and fit into the substrate or housing without steps. As a result, the wear is correspondingly low.
  • the conductive and resistance tracks do not extend on concentric, radial circular ring surfaces, but on the inner wall of the cylindrical cavity of the housing.
  • the equipotential lines run parallel, so that a comparatively higher electrical load capacity is achieved. This arrangement also reduces mechanical stresses between the inner wall and the webs as a result of temperature fluctuations.
  • the potentiometer can be constructed with an extremely small diameter.
  • the tracks in the housing are protected against external influences.
  • a cylindrical intermediate carrier (1) consists of metal, for example bronze (cf. FIG. 1).
  • An oxide layer (2) is built up on this.
  • a polymer thick film conductive paste (3) is printed on the oxide layer (2), for example using the screen printing method. This is dried in at around 120 ° C.
  • a polymer thick film poaching paste (4) is then printed on.
  • a round screen printing machine is suitable for printing. The printed screen printing pastes are cured at a temperature up to 250 ° C.
  • the intermediate carrier (1) is then inserted into a press tool of a plastic press and overmolded with a poly press compound (5) at about 150 ° C.
  • This forms the substrate for the conductive or resistance tracks (3 ⁇ , 4 ⁇ ) consisting of the conductive paste (3) or the poaching paste (4) and the housing (5 ⁇ ) of the potentiometer described in more detail below.
  • the coefficient of thermal expansion of the bronze intermediate carrier (1) is greater than that of the housing (5 ⁇ ) formed by the polyester molding compound (5).
  • the intermediate carrier (1) can be pulled out of the housing (5 () axially in the direction of the arrow (P).
  • the conductive or resistance layer tracks (3 ⁇ , 4 ⁇ ) adhere to the inner wall of the housing (5 ⁇ ) because there is greater adhesion between them and the polyester plastic of the housing (5 ⁇ ) than between the intermediate carrier (1) and its Oxide layer (2).
  • oxide layer (2) is etched.
  • the intermediate carrier (1) consists of a high-temperature-resistant thermoplastic, such as linear polyester, or polyimide, or polyamide or also polyphenylene sulfide.
  • a separation layer (2) there is no need to build up a separation layer (2) here.
  • the curing temperature for the polymer thick film pastes (3, 4) should be set lower; it does not regularly exceed 180 ° C.
  • the removal of the intermediate carrier (1) from the housing (5 ⁇ ) formed by the hardened polyester molding compound (5) can be facilitated in that the intermediate carrier (1) is made slightly conical or conical.
  • the intermediate carrier (1) need not be a cylindrical solid body. It can also be formed by a tube.
  • a potentiometer is constructed approximately as follows (cf. FIGS. 3, 4):
  • the housing (5 ⁇ ) formed by the polyester molding compound (5) has a cylindrical interior (6), around the inner wall (7) of which the lead strip (3 ⁇ ) and the resistance strip (4 ⁇ ) extend.
  • a bearing shell (8) is formed on the closed bottom of the housing (5 ⁇ ) by a corresponding design of the intermediate carrier (1).
  • the inside diameter of the interior (6) has a diameter of only 7 mm, for example.
  • a tapping part (9) is inserted into the interior (6) and engages with the bearing journal (10) in the bearing shell (8).
  • Several grinders (11) are attached to the circumference of the tapping part (9).
  • the grinders (11) are partially assigned to the interconnect (3 ⁇ ) and partially to the resistance track (4 ⁇ ).
  • the grinders (11) are electrically connected to one another. Connections (12) of the interconnect (3 ⁇ ) and the resistance track (4 ⁇ ) are led through the housing (5 ⁇ ) to the outside.
  • the connections (12) can also be injected during the manufacture of the housing (5 ⁇ ).
  • the housing (5 ⁇ ) is closed by means of a cover (13) which has a recess for the passage of a handle part (14) of the tap part (9).
  • the equipotential lines on the resistance track (4 ⁇ ) run parallel to the axis of rotation - not radial to this - and parallel to each other.
  • the resilience of the resistance track (4 ⁇ ) is comparatively large.
  • a good thing about this arrangement of the resistance track (4 ⁇ ) is that tolerances in the alignment of the tapping part (9) have hardly any effect on the resistance setting.
  • a projection (15) is formed thereon. This is assigned a stop (16) in the interior (6).
  • the stop (16) is created by a corresponding shape of the intermediate carrier (1) when it is encapsulated with the molding compound (5).

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Adjustable Resistors (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

In a method for producing conductive and/or resistive paths (3', 4') on a substrate (5'), the conductive and/or resistive path (3', 4') is initially applied onto an intermediate carrier (1) and is subsequently laminated onto the substrate (5'). In order to be able to produce conductive or resistive paths on a concavely curved wall surface, a cylindrical or conical body is used as the intermediate carrier (1), on whose outer circumference the paths (3', 4') are manufactured. The substrate (5') is then applied around the circumference of the intermediate carrier (1), after which the intermediate carrier (1) is removed. <IMAGE>

Description

Die Erfindung betrifft ein Verfahren zur Herstellung von Leit- und/­oder Widerstandsbahnen an einem Substrat, wobei zunächst die Leit- ­und/oder Widerstandsbahnen auf einem Zwischenträger fertiggestellt werden, danach das Substrat mit der auf dem Zwischenträger haftenden Leit- und/oder Widerstandsbahn verbunden wird und schließlich der Zwischenträger von der Leit- und/oder Widerstandsbahn getrennt wird. Weiterhin betrifft die Erfindung ein nach diesem Verfahren hergestelltes Potentiometer.The invention relates to a method for producing conductor tracks and / or resistance tracks on a substrate, the guide tracks and / or resistance tracks being first completed on an intermediate carrier, then the substrate is connected to the conductor track and / or resistance track adhering to the intermediate carrier and finally the intermediate carrier is separated from the interconnect and / or resistance track. The invention further relates to a potentiometer produced by this method.

Ein Verfahren der genannten Art ist in der DE-OS 33 22 382 beschrieben. Bei diesem Umkehrlaminierverfahren ist von einem ebenen Zwischenträger ausgegangen. Dementsprechend verlaufen die Leit- und Widerstandsbahnen in einer Ebene.A method of the type mentioned is described in DE-OS 33 22 382. This reverse lamination process is based on a flat intermediate carrier. Accordingly, the conductive and resistance tracks run on one level.

In der EP-O 0 157 666 A1 ein drehbares Potentiometer beschrieben, bei dem an der Innenwand eines etwa zylindrischen Raumes eine Wider­standsbahn angeordnet ist.EP-O 0 157 666 A1 describes a rotatable potentiometer in which a resistance track is arranged on the inner wall of an approximately cylindrical space.

Aufgabe der Erfindung ist es, ein Verfahren der eingangs genannten Art vorzuschlagen, mit dem Leit- und/oder Widerstandsbahnen an einer konkav gewölbten Wandfläche herstellbar sind.The object of the invention is to propose a method of the type mentioned at the outset, with which conductor tracks and / or resistance tracks can be produced on a concavely curved wall surface.

Erfindungsgemäß ist obige Aufgabe bei einem Verfahren der eingangs ge­nannten Art dadurch gelöst, daß als Zwischenträger ein zylindrischer oder kegelförmiger Körper verwendet wird, auf dessen Außenumfang die Leit- und/oder Widerstandsbahn gefertigt wird, daß um den Umfang des die Leit- und/oder Widerstandsbahn tragenden Zwischenkörpers das Sub­strat aufgebracht und ausgehärtet wird und daß danach der Zwischenträger abgezogen wird.According to the invention, the above object is achieved in a method of the type mentioned at the outset in that a cylindrical or conical body is used as the intermediate carrier, on the outer circumference of which the conductor and / or resistance track is produced, by the circumference of the guide and / or resistance track supporting intermediate body, the substrate is applied and cured and that the intermediate carrier is then removed.

Durch dieses Verfahren ist auf einfache Weise ein Substrat mit eimen zylindrischen bzw. kegelförmigen Innenraum geschaffen, an dessen wand die Leit- und/oder Widerstandsbahn angeordnet ist.This method easily creates a substrate with a cylindrical or conical interior, on the wall of which the conductor and / or resistance track is arranged.

In Weiterbildung der Erfindung erfolgt das Aufbringen des Substrats bei einer höheren als der Umgebungstemperatur und der Wärmeausdehnungs­koeffizient des Zwischenträgers wird höher gewält als der des Substrats. Dadurch ist erreicht, daß sich nach dem Abkühlen der Zwischenträger leicht aus dem Substrat herausziehen läßt.In a further development of the invention, the substrate is applied at a temperature higher than the ambient temperature and the coefficient of thermal expansion of the intermediate carrier is chosen to be higher than that of the substrate. It is thereby achieved that the intermediate carrier can be easily pulled out of the substrate after cooling.

Vorzugweise besteht der Zwischenträger in an sich bekannter Weise aus Metall und ist mit einer Oxidschicht als Trennschicht versehen. Dies begünstigt die Trennung der Leit- und/oder Widerstandsbahn im Substrat vom Zwischenträger. In anderer Ausgestaltung der Erfindung kann der Zwischenträger auch aus einem thermoplastischen Kunststoff bestehen.The intermediate carrier preferably consists of metal in a manner known per se and is provided with an oxide layer as a separating layer. This favors the separation of the conductor and / or resistance path in the substrate from the intermediate carrier. In another embodiment of the invention, the intermediate carrier can also consist of a thermoplastic.

Das substrat wird vorzugsweise aus einer wärmehärtbaren Kunststoff­formmasse gebildet. Das Substrat kann dann zugleich ein stabiles Gehäuse bilden.The substrate is preferably formed from a thermosetting plastic molding compound. The substrate can then simultaneously form a stable housing.

Ein nach dem genannten Verfahren hergestelltes Potentiometer zeichnet sich dadurch aus, daß das Substrat das Gehäuse des Potentiometers bildet und einen zylindrischen Hohlraum umschließt, an dessen Innenwand die Leit- und Widerstandsbahnen vorgesehen sind und daß im Hohlraum ein um dessen Mittelachse drehbares Abgriffsteil gelagert ist, das die Leit- ­und Widerstandsbahnen kontaktiert.A potentiometer manufactured according to the above-mentioned method is characterized in that the substrate forms the housing of the potentiometer and encloses a cylindrical cavity, on the inner wall of which the conducting and resistance tracks are provided, and in that a tapping part which is rotatable about its central axis is mounted in the cavity contacted the conductive and resistance tracks.

Bei einem derartigen Bauteil sind die Leit- und Widerstandsbahnen extrem glatt und fügen sich ohne Stufen in das Substrat bzw. Gehäuse ein. Da­durch ist der Verschleiß entsprechend gering.With such a component, the conductive and resistance tracks are extremely smooth and fit into the substrate or housing without steps. As a result, the wear is correspondingly low.

Die Leit- und Widerstandsbahnen erstrecken sich nicht auf konzentri­schen, radialen Kreisringflächen, sondern an der Innenwand des zylindrischen Hohlraums des Gehäuses. Die Äquipotentiallinien verlaufen dabei parallel, so daß eine vergleichsweise höhere elektrische Belast­barkeit erreicht ist. Durch diese Anordnung sind auch mechanische Span­nungen zwischen der Innenwand und den Bahnen infolge von Temperatur­schwankungen herabgesetzt.The conductive and resistance tracks do not extend on concentric, radial circular ring surfaces, but on the inner wall of the cylindrical cavity of the housing. The equipotential lines run parallel, so that a comparatively higher electrical load capacity is achieved. This arrangement also reduces mechanical stresses between the inner wall and the webs as a result of temperature fluctuations.

Da sich die Bahnen nicht radial erstrecken, ist ein im Durchmesser äußerst kleiner Aufbau des Potentiometers möglich. Außerdem liegen die Bahnen im Gehäuse gegen äußere Einflüsse geschützt.Since the tracks do not extend radially, the potentiometer can be constructed with an extremely small diameter. In addition, the tracks in the housing are protected against external influences.

Weitere vorteilhafte Ausgestaltungen der Erfindung ergeben sich aus den Unteransprüchen und der folgenden Beschreibung von Ausführungsbei­spielen.Further advantageous embodiments of the invention result from the subclaims and the following description of exemplary embodiments.

In der Zeichnung zeigen:

  • Figur 1      einen Zwischenträger mit aufgedruckter Leit- und Widerstandsbahn,
  • Figur 2      den Zweischenträger nach Figur 1 mit dem Substrat umspritzt im Teilschnitt,
  • Figur 3      ein Potentiometer mit dem Substrat bzw. Gehäuse nach Figur 2
    und
  • Figur 4      einem Schnitt längs der Linie IV-IV nach Figur 3.
The drawing shows:
  • FIG. 1 shows an intermediate carrier with a printed conductor and resistance track,
  • FIG. 2 is a partial section of the double carrier according to FIG. 1 with the substrate overmolded,
  • 3 shows a potentiometer with the substrate or housing according to FIG. 2
    and
  • 4 shows a section along the line IV-IV of Figure 3.

Ein zylindrischer Zwischenträger (1) besteht aus Metall, beispielsweise aus Bronze (vgl. Figur 1). Auf diesem wird eine Oxidschicht (2) aufge­baut. Auf die Oxidschicht (2) wird, beispielsweise im Siebdruckver­fahren, eine Polymer-Dickfilm-Leitpaste (3) aufgedruckt. Diese wird bei etwa 120°C eingetrocknet. Anschließend wird eine Polymer-Dickfilm-­Wilderstandspaste (4) aufgedruckt. Zum Bedrucken eignet sich eine Rund-­Siebdruckmaschine. Die aufgedruckten Siebdruckpasten werden bei einer Temperatur bis zu 250°C ausgehärtet.A cylindrical intermediate carrier (1) consists of metal, for example bronze (cf. FIG. 1). An oxide layer (2) is built up on this. A polymer thick film conductive paste (3) is printed on the oxide layer (2), for example using the screen printing method. This is dried in at around 120 ° C. A polymer thick film poaching paste (4) is then printed on. A round screen printing machine is suitable for printing. The printed screen printing pastes are cured at a temperature up to 250 ° C.

Danach wird der Zwischenträger (1) in ein Preßwerkzeug einer Kunststoff­presse eingesetzt und mit einer Poly-Preßmasse (5) bei etwa 150°C umspritzt. Diese bildet das Substrat für die aus der Leitpaste (3) bzw. der Wilderstandspaste (4) bestehenden Leit- bzw. Widerstandsbahnen (3ʹ, 4ʹ) und das Gehäuse (5ʹ) des unten näher beschriebenen Potentiometers.The intermediate carrier (1) is then inserted into a press tool of a plastic press and overmolded with a poly press compound (5) at about 150 ° C. This forms the substrate for the conductive or resistance tracks (3ʹ, 4ʹ) consisting of the conductive paste (3) or the poaching paste (4) and the housing (5ʹ) of the potentiometer described in more detail below.

Der Wärmeausdehnungskoeffizient des Bronze-Zwischenträgers (1) ist größer als der des von der Polyester-Preßmasse (5) gebildeten Gehäuses (5ʹ). Nach dem Abkühlen des Preßlings (vgl. Figur 2) läßt sich der Zwischenträger (1) axial in Richtung des Pfeiles (P) aus dem Gehäuse (5ʹ) herausziehen. Dabei bleiben die Leit- bzw. Widerstandsschicht­bahnen.(3ʹ,4ʹ) an der Innenwand des Gehäuses (5ʹ) haften, weil zwischen ihnen und dem Polyester-Kunststoff des Gehäuses (5ʹ) eine größere Adhäsion besteht als zwischen dem Zwischenträger (1) und dessen Oxidschicht (2).The coefficient of thermal expansion of the bronze intermediate carrier (1) is greater than that of the housing (5ʹ) formed by the polyester molding compound (5). After the compact has cooled (see FIG. 2), the intermediate carrier (1) can be pulled out of the housing (5 () axially in the direction of the arrow (P). The conductive or resistance layer tracks (3ʹ, 4ʹ) adhere to the inner wall of the housing (5ʹ) because there is greater adhesion between them and the polyester plastic of the housing (5ʹ) than between the intermediate carrier (1) and its Oxide layer (2).

Schließlich wird die Oxidschicht (2) obgeätzt.Finally the oxide layer (2) is etched.

Bei einem anderen Ausführungsbeispiel der Erfindung besteht der Zwischenträger (1) aus einem hochtemperaturbeständigen Thermoplast, wie lineares Polyester, oder Polyimid, oder Polyamid oder auch Polyphenylen­sulfid. Der Aufbau einer Trennschicht (2) erübrigt sich hier. Die Aus­härttemperatur für die Polymer-Dickfilmpasten (3, 4) ist in diesem Fall niedriger anzusetzen, sie übersteigt regelmäßig nicht 180°C.In another embodiment of the invention, the intermediate carrier (1) consists of a high-temperature-resistant thermoplastic, such as linear polyester, or polyimide, or polyamide or also polyphenylene sulfide. There is no need to build up a separation layer (2) here. In this case, the curing temperature for the polymer thick film pastes (3, 4) should be set lower; it does not regularly exceed 180 ° C.

Das Entnehmen des Zwischenträgers (1) aus dem von der ausgehärten Polyester-Preßmasse (5) gebildeten Gehäuse (5ʹ) läßt sich dadurch er­leichtern, daß der Zwischenträger (1) geringfügig kegelförmig bzw. konisch ausgebildet wird.The removal of the intermediate carrier (1) from the housing (5ʹ) formed by the hardened polyester molding compound (5) can be facilitated in that the intermediate carrier (1) is made slightly conical or conical.

Der Zwischenträger (1) braucht kein zylindrischer Vollkörper zu sein. Er kann auch von einem Rohr gebildet sein.The intermediate carrier (1) need not be a cylindrical solid body. It can also be formed by a tube.

Ein Potentiometer ist unter Verwendung des in der beschriebenen Weise hergestellten Gehäuses (5ʹ) etwa folgendermaßen aufgebaut (vgl. Figur 3, 4):Using the housing (5 aufgebaut) produced in the manner described, a potentiometer is constructed approximately as follows (cf. FIGS. 3, 4):

Das von der Polyester-Preßmasse (5) gebildete Gehäuse (5ʹ) weist einen zylindrischen Innenraum (6) auf, um dessen Innenwand (7) sich die Lietbahn (3ʹ) und die Widerstandsbahn (4ʹ) erstrecken. Durch eine entsprechende Formgestaltung des Zwischenträgers (1) ist am geschlos­senen Boden des Gehäuses (5ʹ) eine Lagerschale (8) ausgebildet. Der Innendurchmesser des Innenraums (6) weist beispielsweise einen Durch­messer von nur 7 mm auf.The housing (5ʹ) formed by the polyester molding compound (5) has a cylindrical interior (6), around the inner wall (7) of which the lead strip (3ʹ) and the resistance strip (4ʹ) extend. A bearing shell (8) is formed on the closed bottom of the housing (5ʹ) by a corresponding design of the intermediate carrier (1). The inside diameter of the interior (6) has a diameter of only 7 mm, for example.

In den Innenraum (6) ist ein Abgriffsteil (9) eingesetzt, das mit dem Lagerzapfen (10) in die Lagerschale (8) greift. Am Umfang des Abgriffs­teils (9) sind mehrere Schleifer (11) befestigt. Die Schleifer (11) sind teilweise der Leitbahn (3ʹ) und teilweise der Widerstandsbahn (4ʹ) zugeordnet. Die Schleifer (11) sind elekrisch miteinander ver­bunden. Anschlüsse (12) der Leitbahn (3ʹ) und der Widerstandsbahn (4ʹ) sind durch das Gehäuse (5ʹ) nach außen geführt. Die Anschlüsse (12) können bei der Herstellung des Gehäuses (5ʹ) miteingespritzt sein.A tapping part (9) is inserted into the interior (6) and engages with the bearing journal (10) in the bearing shell (8). Several grinders (11) are attached to the circumference of the tapping part (9). The grinders (11) are partially assigned to the interconnect (3ʹ) and partially to the resistance track (4ʹ). The grinders (11) are electrically connected to one another. Connections (12) of the interconnect (3ʹ) and the resistance track (4ʹ) are led through the housing (5ʹ) to the outside. The connections (12) can also be injected during the manufacture of the housing (5ʹ).

Das Gehäuse (5ʹ) ist mittels eines Deckels (13) verschlossen, welcher eine Ausnehmung für den Durchtritt eines Griffteils (14) des Abgriffs­teils (9) aufweist.The housing (5ʹ) is closed by means of a cover (13) which has a recess for the passage of a handle part (14) of the tap part (9).

Die Äquipotentiallinien auf der Widerstandsbahn (4ʹ) verlaufen parallel zur Drehachse - nicht radial zu dieser - und parallel zueinander. Die Belastbarkeit der Widerstandsbahn (4ʹ) ist dabei vergleichsweise groß. Außerdem ergibt sich eine hohe Auflösung des Widerstandsbereischs beim Drehen der Schleifer (11) längs der Widerstandsbahn (4ʹ). Günstig an dieser Anordnung der Widerstandsbahn (4ʹ) ist auch, daß Toleranzen der Ausrichtung des Abgriffsteils (9) sich kaum auf die Widerstandsein­stellung auswirken.The equipotential lines on the resistance track (4ʹ) run parallel to the axis of rotation - not radial to this - and parallel to each other. The resilience of the resistance track (4ʹ) is comparatively large. In addition, there is a high resolution of the resistance area when turning the grinder (11) along the resistance path (4ʹ). A good thing about this arrangement of the resistance track (4ʹ) is that tolerances in the alignment of the tapping part (9) have hardly any effect on the resistance setting.

Die radiale Anordnung von Schleifer (11) und Liet- bzw. Wilderstandsbahn (3ʹ, 4ʹ) sichert auch bei hoher Drehgeschwindigkeit des Abgriffsteils (9) deren kontakt zueinander.The radial arrangement of grinder (11) and Liet or Wilderstandsbahn (3ʹ, 4ʹ) ensures their contact with each other even at high rotational speed of the tapping part (9).

Zur Begrenzung des Drehwinkels des Abgriffsteils (9) ist an diesem ein Vorsprung (15) ausgebildet. Diesem ist ein Anschlag (16) im Inneraum (6) zugeordnet. Der Anschlag (16) ist durch eine entsprechender Formge­stalt des Zwischenträgers (1) bei dessen Umspritzen mit der Preßmasse (5) geschaffen.To limit the angle of rotation of the tapping part (9), a projection (15) is formed thereon. This is assigned a stop (16) in the interior (6). The stop (16) is created by a corresponding shape of the intermediate carrier (1) when it is encapsulated with the molding compound (5).

Bezugszeichenliste 09/86 Pt.Reference number list 09/86 Pt.

  • 1 Zwischenträger1 intermediate beam
  • 2 Oxidschicht2 oxide layer
  • 3 Leitpaste3 conductive paste
  • 3ʹ Leitbahn3ʹ interconnect
  • 4 Widerstandspaste4 resistance paste
  • 4ʹ Widerstandsbahn4ʹ resistance track
  • 5 Polyester-Preßmasse5 polyester molding compound
  • 5ʹ Gehäuse5ʹ housing
  • 6 Innenraum6 interior
  • 7 Innenwand7 inner wall
  • 8 Lagerschale8 bearing shell
  • 9 Abgriffsteil9 tap part
  • 10 Lagerzapfen10 journals
  • 11 Schleifer11 grinders
  • 12 Anschlüsse12 connections
  • 13 Deckel13 lid
  • 14 Griffteil14 grip part
  • 15 Vorsprung15 head start
  • 16 Anschlag16 stop
  • P PfeilP arrow

Claims (10)

1. Verfahren zur Herstellung von Leit- und/oder Widerstandsbahnen an einem Substrat, wobei zunächst die Liet- und/oder Widerstands-­bahn auf einem Zwischenträger fertiggestellt wird, danach das Substrat mit der auf dem Zwischenträger haftenden Leit- und/oder Widerstandsbahn verbunden wird und schließlich der Zwischenträger von der Leit- und/oder Widerstandsbahn getrennt wird,
dadurch gekennzeichnet,
daß als Zwischenträger ein zylindrischer oder kegelförmiger Körper verwendet wird, auf dessen Außenumfang die Leit- und/oder Wider­standsbahn gefertigt wird, daß um den Umfang des die Leit- und/oder Widerstandsbahn tragenden Zwischenträgers das Substrat aufgebracht und ausgehärtet wird und daß danach der Zwischenträger abgezogen wird.
1. A method for producing conductor tracks and / or resistance tracks on a substrate, the soldering track and / or resistance track being first completed on an intermediate carrier, then the substrate is connected to the conductor track and / or resistance track adhering to the intermediate carrier and finally the intermediate carrier is separated from the conductor track and / or resistance track,
characterized,
that a cylindrical or conical body is used as the intermediate carrier, on the outer circumference of which the conductor and / or resistance track is produced, that the substrate is applied and cured around the circumference of the intermediate carrier and / or resistance path and that the intermediate carrier is then removed becomes.
2. Verfahren nach Anspruch 1,
dadurch gekennzeichnet,
daß das Aufbringen des Substrats bei einer höheren als der Um­gebungstemperatur erfolgt und daß der Wärmeausdehnungskoeffizient des Zwischenträgers höher als der des Substrats gewählt wird.
2. The method according to claim 1,
characterized,
that the application of the substrate takes place at a temperature higher than the ambient temperature and that the coefficient of thermal expansion of the intermediate carrier is chosen to be higher than that of the substrate.
3. Verfahren nach Anspruch 1 oder 2,
dadurch gekennzeichnet,
daß der Zwischenträger aus Metall besteht und mit einer Oxidschicht als Trennschicht versehen wird.
3. The method according to claim 1 or 2,
characterized,
that the intermediate carrier consists of metal and is provided with an oxide layer as a separating layer.
4. Verfahren nach Anspruch 1 oder 2,
dadurch gekennzeichnet,
daß der Zwischenträger aus einem thermoplastischen Kunststoff besteht.
4. The method according to claim 1 or 2,
characterized,
that the intermediate carrier consists of a thermoplastic.
5. Verfahren nach einem der vorhergehenden Ansprüche,
dadurch gekennzeichnet,
daß das Substrat aus einer wärmehärtbaren Kunststofformmasse gebildet wird.
5. The method according to any one of the preceding claims,
characterized,
that the substrate is formed from a thermosetting plastic molding compound.
6. Verfahren nach einem vorhergehenden Ansprüche,
dadurch gekennzeichnet,
daß der Zwischenträger von einem Rohr gebildet ist.
6. The method according to any preceding claim,
characterized,
that the intermediate carrier is formed by a tube.
7. Potentiometer,
hergestellt nach einem Verfahren eines der vorhergehenden Ansprüche,
dadurch gekennzeichnet,
daß das Substrat das Gehäuse (5ʹ) des Potentiometers bildet und einem zylindrischen Hohlraum (6) umschließt, an dessen Innenwand (7) die Leit- und/oder Widerstandsbahnen (3ʹ, 4ʹ) vorgesehen sind, und daß im Hohlraum (6) ein um dessen Mittelachse drehbares Abgriffsteil (9) gelagert ist, das die Leit- und/oder Weiderstandsbahnen (3ʹ, 4ʹ) kontaktiert.
7. potentiometer,
produced by a method of one of the preceding claims,
characterized,
that the substrate forms the housing (5ʹ) of the potentiometer and encloses a cylindrical cavity (6), on the inner wall (7) of the conductive and / or resistance tracks (3ʹ, 4ʹ) are provided, and that in the cavity (6) around whose center axis has a rotatable tapping part (9) which contacts the guide and / or resistance tracks (3ʹ, 4ʹ).
8. Potentiometer nach Anspruch 7,
dadurch gekennzeichnet,
daß die Leit- und/oder Widerstandsbahnen (3ʹ, 4ʹ) in Umfangsrichtung der Innenwand (7) verlaufen.
8. Potentiometer according to claim 7,
characterized,
that the conductive and / or resistance tracks (3ʹ, 4ʹ) extend in the circumferential direction of the inner wall (7).
9. Potentiometer nach einem der vorhergehenden Ansprüche,
dadurch gekennzeichnet,
daß elektrische Anschlüsse (12) der Leit- und/oder Widerstandsbahnen (3ʹ, 4ʹ) mit in das das Gehäuse (5ʹ) bildende Substrat eingespritzt sind
9. Potentiometer according to one of the preceding claims,
characterized,
that electrical connections (12) of the conductive and / or resistance tracks (3ʹ, 4ʹ) are also injected into the substrate (5ʹ) forming the substrate
10. Potentiometer nach einem der vorhergehenden Ansprüche,
dadurch gekennzeichnet,
daß am Gehäuse (5ʹ) Anformungen (8, 16) für das Abgriffsteil (9) durch entsprechende Gestaltung des Zwischenträgers (1) ausgebildet sind.
10. Potentiometer according to one of the preceding claims,
characterized,
that on the housing (5ʹ) are formed (8, 16) for the tapping part (9) by appropriate design of the intermediate carrier (1).
EP87112459A 1986-09-12 1987-08-27 Method for producing conductive and/or resistive paths on a substrate, and potentiometer manufactured thereby Withdrawn EP0259709A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3631058 1986-09-12
DE19863631058 DE3631058A1 (en) 1986-09-12 1986-09-12 METHOD FOR PRODUCING GUIDANCE AND / OR RESISTANCE TRACKS ON A SUBSTRATE AND POTENTIOMETER PRODUCED BY THIS METHOD

Publications (2)

Publication Number Publication Date
EP0259709A2 true EP0259709A2 (en) 1988-03-16
EP0259709A3 EP0259709A3 (en) 1989-12-06

Family

ID=6309437

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87112459A Withdrawn EP0259709A3 (en) 1986-09-12 1987-08-27 Method for producing conductive and/or resistive paths on a substrate, and potentiometer manufactured thereby

Country Status (3)

Country Link
EP (1) EP0259709A3 (en)
JP (1) JPS6373603A (en)
DE (1) DE3631058A1 (en)

Cited By (1)

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US5781100A (en) * 1994-03-16 1998-07-14 Alps Electric Co., Ltd. Resistor substrate containing carbon fibers and having a smooth surface

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3808583C1 (en) * 1988-03-15 1989-05-11 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt, De

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US4355293A (en) * 1979-10-22 1982-10-19 The Bendix Corporation Electrical resistance apparatus having integral shorting protection
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EP0148601A2 (en) * 1984-01-09 1985-07-17 Stauffer Chemical Company Transfer lamination of electrical circuit patterns
EP0157666A1 (en) * 1984-02-28 1985-10-09 Siemens Automotive S.A. Rotating potentiometer, particularly for angular position measurement

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US4355293A (en) * 1979-10-22 1982-10-19 The Bendix Corporation Electrical resistance apparatus having integral shorting protection
US4355293B1 (en) * 1979-10-22 1985-09-03
FR2489072A1 (en) * 1980-08-22 1982-02-26 Ruf Kg Wilhelm PCB resistance mfg. method - uses conductive layer formed on support and cursor, hardened and transferred
EP0129697A2 (en) * 1983-06-22 1985-01-02 Preh-Werke GmbH &amp; Co. KG Method of making printed circuit boards
EP0148601A2 (en) * 1984-01-09 1985-07-17 Stauffer Chemical Company Transfer lamination of electrical circuit patterns
EP0157666A1 (en) * 1984-02-28 1985-10-09 Siemens Automotive S.A. Rotating potentiometer, particularly for angular position measurement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5781100A (en) * 1994-03-16 1998-07-14 Alps Electric Co., Ltd. Resistor substrate containing carbon fibers and having a smooth surface

Also Published As

Publication number Publication date
EP0259709A3 (en) 1989-12-06
DE3631058A1 (en) 1988-03-24
JPS6373603A (en) 1988-04-04

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