EP0105328A4 - Purification of silicon halides. - Google Patents
Purification of silicon halides.Info
- Publication number
- EP0105328A4 EP0105328A4 EP19830901472 EP83901472A EP0105328A4 EP 0105328 A4 EP0105328 A4 EP 0105328A4 EP 19830901472 EP19830901472 EP 19830901472 EP 83901472 A EP83901472 A EP 83901472A EP 0105328 A4 EP0105328 A4 EP 0105328A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- impurities
- silicon
- trichlorosilane
- organosiloxane
- boron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- -1 silicon halides Chemical class 0.000 title claims abstract description 54
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 35
- 239000010703 silicon Substances 0.000 title claims abstract description 35
- 238000000746 purification Methods 0.000 title description 8
- 239000012535 impurity Substances 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 26
- 229910052796 boron Inorganic materials 0.000 claims abstract description 15
- 238000004821 distillation Methods 0.000 claims abstract description 8
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 claims description 19
- 239000005052 trichlorosilane Substances 0.000 claims description 18
- 239000002841 Lewis acid Substances 0.000 claims description 13
- 150000007517 lewis acids Chemical class 0.000 claims description 13
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 12
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 claims description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 125000005375 organosiloxane group Chemical group 0.000 claims description 10
- JJRDHFIVAPVZJN-UHFFFAOYSA-N cyclotrisiloxane Chemical class O1[SiH2]O[SiH2]O[SiH2]1 JJRDHFIVAPVZJN-UHFFFAOYSA-N 0.000 claims description 5
- HTDJPCNNEPUOOQ-UHFFFAOYSA-N hexamethylcyclotrisiloxane Chemical group C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O1 HTDJPCNNEPUOOQ-UHFFFAOYSA-N 0.000 claims description 5
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 claims description 3
- 239000005049 silicon tetrachloride Substances 0.000 claims description 3
- DDJSWKLBKSLAAZ-UHFFFAOYSA-N cyclotetrasiloxane Chemical class O1[SiH2]O[SiH2]O[SiH2]O[SiH2]1 DDJSWKLBKSLAAZ-UHFFFAOYSA-N 0.000 claims description 2
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims description 2
- 125000005376 alkyl siloxane group Chemical group 0.000 claims 2
- NRTJGTSOTDBPDE-UHFFFAOYSA-N [dimethyl(methylsilyloxy)silyl]oxy-dimethyl-trimethylsilyloxysilane Chemical group C[SiH2]O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C NRTJGTSOTDBPDE-UHFFFAOYSA-N 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 238000011282 treatment Methods 0.000 abstract description 3
- 238000011109 contamination Methods 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 10
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 5
- 239000005046 Chlorosilane Substances 0.000 description 4
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical class Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 4
- 239000013638 trimer Substances 0.000 description 4
- 229910015900 BF3 Inorganic materials 0.000 description 3
- 150000001642 boronic acid derivatives Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004566 IR spectroscopy Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052987 metal hydride Inorganic materials 0.000 description 1
- 150000004681 metal hydrides Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical class Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/08—Compounds containing halogen
- C01B33/107—Halogenated silanes
- C01B33/10778—Purification
Definitions
- This invention relates to the preparation of trichlorosilane for the manufacture of electronic grade silicon and, more particularly, to novel methods for removing trace impurities of electrical donor contaminates, especially boron and other Lewis acid or proton donor-type impurities.
- Silicon of extremely high purity is required for sophisticated electronics uses such as in semiconductors and transistors. It is well known that even trace impurities can seriously impair the performance of silicon-containing electronic components.
- Elemental silicon for semiconductor use is generally prepared by reduction of silicon halides, such as silicon tetrachloride (SiCl 4 ), trichlorosilane (HSiCl 3 ) and dichlorosilane (H 2 SiCl 2 ), with hydrogen, zinc, sodium or metal hydrides. Silicon may also be derived from thermal decomposition of silane (SiH 4 ), but this latter material is hard to work with because it burns explosively on contact with air.
- boron One of the most difficult impurities to remove from high purity silicon is boron. Whereas other common impurities such as copper, iron and manganese are comparatively easy to remove by conventional techniques (e.g., zone refining, crystal pulling), boron has physical properties so similar to silicon that separation is accomplished only by repeated trials. Moreover, concentrating purification efforts on the starting materials, e.g., chlorosilanes, is likewise difficult because boron forms corresponding compounds with similar properties.
- the method of this invention involves contacting the boron halide or other Lewis acid impurity present in a silicon halide solution with a molar excess of an organosiloxane, heating the solution to cause a reaction between the impurities and the siloxane to yield compounds of lower vapor pressure than the silicon halide, and then distilling the pure silicon halide off, leaving the siloxane-bound impurities behind.
- This method is very effective for removing boron contaminates, especially from solutions of silicon chlorides, such as trichlorosilane.
- the boron concentration in a solution of trichlorosilane can be reduced by the treatment of the present invention to less than 50 parts per trillion (ppt) .
- a "Lewis acid” is any substance that will take up an electron pair to form a covalent bond (i.e., "electron-pair acceptor”). This includes the “proton donor” concept of the Lowry-Br ⁇ nsted definition of acids.
- boron trifluoride (BF 3 ) is a typical Lewis acid, as it contains only six electrons in its outermost electron orbital shell. BF 3 tends to accept a free electron pair to complete its eight-electron orbital.
- siloxane compounds suitable for the purposes herein are any organosiloxanes which will react with the boron or other impurity present in the silicon halide solution to form impurity-siloxane compounds (e.g., borosiloxane) having a lower vapor pressure than the solution to be purified, such that a pure silicon-containing solution may be distilled from the reaction vessel, leaving the impurity-siloxane compounds behind.
- impurity-siloxane compounds e.g., borosiloxane
- siloxanes include alkyl, aryl, halogenated alkyl, halogenated aryl or hydrogen substituted alkyl or aryl cyclotrisiloxanes and cyclotetrasiloxanes such as hexamethylcyclotri siloxane, octamethylcyclotetrasiloxane, polydimethyl siloxane fluids, dimethyl (methyl hydrogensiloxane copolymers and other cyclic siloxane monomers. Cyclotrisiloxanes, alkyl cyclotrisiloxanes, halogenated alkyl cyclotrisiloxanes are preferred; hexamethylcyclotrisiloxane is most preferred.
- the siloxanes are added to the contaminated silicon halides solution in an amount which will ensure reaction of the siloxanes with the Lewis acid impurities. Best results are obtained if this amount is a large molar excess, for example 5-100 times, based on the concentration of the contaminate. However, any amount of siloxane suitable to effectively bind the impurities present in the solution is contemplated.
- the mixture is heated to drive the reaction of the siloxanes with the Lewis acid impurities.
- very high temperatures i.e. , temperatures over 200 oC
- the reaction may not be sufficient to effectively remove all of the BCl 3 .
- a reaction temperature range from 25oC to about 200°C is preferred, from about 80oC to about 130°C is most preferred, but higher temperatures are also contemplated so long as the reaction products will not be distilled in the same fraction as the silicon halide, and thereby confound the purification. Best results have been obtained at about 100oC.
- reaction is allowed to proceed until substantially all of the impurities are bound to siloxane compounds.
- the time will of course vary according to materials used, temperature used, pressure, etc. Simple experimentation will readily lead to the optimum reaction period for a given purification.
- the final step in the purification of the present invention is to distill the pure silicon halide from the reaction solution.
- the decreased volatility of the siloxane-bound impurities compared to the silicon halides makes this final distillation possible.
- the distillation may be carried out at atmospheric pressures or at higher pressure so long as the temperature of the liquid material does not exceed the decomposition temperature of the borates formed in the process. It is preferred to maintain the temperature of the liquid below about 200oC.
- TCS trichlorosilane
- BCl 3 boron trichloride
- the charge to the distillation vessel was 2000 g. with 99% of the material recovered, the presence of boron was less than 50 parts per trillion in each of the distilled fractions.
- Example 1 400 parts by weight of 0.018 molar BCl 3 (5000 ppm) in TCS was placed in a reaction vessel with sufficient trimer to make the solution 0.09 molar. The reaction mixture was agitated under pressure and samples distilled periodically for analysis by infrared spectroscopy as in Example 1:
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
Abstract
A method for the selective removal of boron halides and other Lewis acid-type impurities from silicon halides. Treatment of contaminated silicon halides with siloxanes, which react with the impurities, allow the distillation of silicon halide which is virtually free from contamination within extremely low limits of detectability.
Description
PURIFICATION OF SILICON HALIDES
FOR: PURIFICATION OF SILICON HALIDES
This invention relates to the preparation of trichlorosilane for the manufacture of electronic grade silicon and, more particularly, to novel methods for removing trace impurities of electrical donor contaminates, especially boron and other Lewis acid or proton donor-type impurities.
Silicon of extremely high purity is required for sophisticated electronics uses such as in semiconductors and transistors. It is well known that even trace impurities can seriously impair the performance of silicon-containing electronic components.
Elemental silicon for semiconductor use is generally prepared by reduction of silicon halides, such as silicon tetrachloride (SiCl4), trichlorosilane (HSiCl3) and dichlorosilane (H2SiCl2), with hydrogen, zinc, sodium or metal hydrides. Silicon may also be derived from thermal decomposition of silane (SiH4), but this latter material is hard to work with because it burns explosively on contact with air.
One of the most difficult impurities to remove from high purity silicon is boron. Whereas other common impurities such as copper, iron and manganese are comparatively easy to remove by conventional techniques (e.g., zone refining, crystal pulling), boron has physical properties so similar to silicon that separation is accomplished only by repeated trials. Moreover, concentrating purification efforts on
the starting materials, e.g., chlorosilanes, is likewise difficult because boron forms corresponding compounds with similar properties.
Various compounds, for example, phenols, tri- phenols, and nitrogen-containing compounds, have been used in the past to complex and bind with impurities in near-pure silicon halide solutions. U.S. Patents 3,403,003 (Morganthaler) ; 3,126,248 (Pohl et al.); and 3,041,141 {Shoemaker et al.), for instance, describe such treatments. The prevailing conventional technique for removing boron contaminates, disclosed in U.S. 4,112,507 (Lang et al.), involves introducing water vapor on silica gel to chlorosilane solutions. However, problems with regeneration of the impurities and corrosion are experienced.
It has now been discovered that boron chlorides and other Lewis acids can be removed almost totally from chlorosilane solutions by the introduction of organo siloxanes. The siloxanes react or complex with the impurit and subsequently react to form thermally stable compounds, i.e., borosiloxanes, which are left behind in a distillation of the chlorosilane.
Accordingly, it is an object of the present invention to provide a novel method for purifying silicon halides.
It is another object of the present invention to provide a method for removing boron halides, Lewis acid a proton donor-type compounds from silicon halide solutions.
It is another object of the present invention to provide a purification method which is irreversible
and non-corrosive.
It is another object of the present invention to provide a means of obtaining electronic grade silicon from high purity trichlorosilane.
These and other objects are accomplished herein by a method for purifying silicon halides comprising:
(A) adding to a solution of silicon halide contaminated with Lewis acid impurities a stoichiometric excess, based on the concentration of the impurities, of an organosiloxane;
(B) reacting the impurities in solution with said siloxanes at a temperature of from about 25°C to 200ºC until substantially all the impurities form non-volatile products; and thereafter
(C) removing purified silicon halide by distillation.
DETAILED DESCRIPTION OF THE INVENTION
The method of this invention involves contacting the boron halide or other Lewis acid impurity present in a silicon halide solution with a molar excess of an organosiloxane, heating the solution to cause a reaction between the impurities and the siloxane to yield compounds of lower vapor pressure than the silicon halide, and then distilling the pure silicon halide off, leaving the siloxane-bound impurities behind. This method is very effective for removing boron contaminates, especially from solutions of silicon chlorides, such as trichlorosilane. The boron concentration in a solution of trichlorosilane can be reduced by the treatment of the present invention to less than 50 parts per trillion (ppt) .
For the purposes herein, a "Lewis acid" is any substance that will take up an electron pair to form a covalent bond (i.e., "electron-pair acceptor"). This includes the "proton donor" concept of the Lowry-Brønsted definition of acids. Thus boron trifluoride (BF3) is a typical Lewis acid, as it contains only six electrons in its outermost electron orbital shell. BF3 tends to accept a free electron pair to complete its eight-electron orbital.
The siloxane compounds suitable for the purposes herein are any organosiloxanes which will react with the boron or other impurity present in the silicon halide solution to form impurity-siloxane compounds (e.g., borosiloxane) having a lower vapor pressure than the solution to be purified, such that a pure silicon-containing solution may be distilled from the reaction vessel, leaving the impurity-siloxane compounds behind. These siloxanes include
alkyl, aryl, halogenated alkyl, halogenated aryl or hydrogen substituted alkyl or aryl cyclotrisiloxanes and cyclotetrasiloxanes such as hexamethylcyclotri siloxane, octamethylcyclotetrasiloxane, polydimethyl siloxane fluids, dimethyl (methyl hydrogensiloxane copolymers and other cyclic siloxane monomers. Cyclotrisiloxanes, alkyl cyclotrisiloxanes, halogenated alkyl cyclotrisiloxanes are preferred; hexamethylcyclotrisiloxane is most preferred.
The siloxanes are added to the contaminated silicon halides solution in an amount which will ensure reaction of the siloxanes with the Lewis acid impurities. Best results are obtained if this amount is a large molar excess, for example 5-100 times, based on the concentration of the contaminate. However, any amount of siloxane suitable to effectively bind the impurities present in the solution is contemplated.
After the siloxane is mixed into the solution, the mixture is heated to drive the reaction of the siloxanes with the Lewis acid impurities. At very high temperatures, i.e. , temperatures over 200 ºC, there may occur some degradation of the siloxane compound and volatile borates may form. At low temperatures the reaction may not be sufficient to effectively remove all of the BCl3. For these reasons a reaction temperature range from 25ºC to about 200°C is preferred, from about 80ºC to about 130°C is most preferred, but higher temperatures are also contemplated so long as the reaction products will not be distilled in the same fraction as the silicon halide, and thereby confound the purification. Best results have been obtained at about 100ºC.
As mentioned before, the reaction is allowed to proceed until substantially all of the impurities are bound to siloxane compounds. The time will of course vary according to materials used, temperature used, pressure, etc. Simple experimentation will readily lead to the optimum reaction period for a given purification.
The final step in the purification of the present invention is to distill the pure silicon halide from the reaction solution. The decreased volatility of the siloxane-bound impurities compared to the silicon halides makes this final distillation possible.
The distillation may be carried out at atmospheric pressures or at higher pressure so long as the temperature of the liquid material does not exceed the decomposition temperature of the borates formed in the process. It is preferred to maintain the temperature of the liquid below about 200ºC.
In order that persons skilled in the art may readily understand the practice of the instant invention, the following examples are provided by way of illustration, and not by way of limitation.
EXAMPLE 1
7 parts by weight hexamethylcyclotrisiloxane (trimer) was admixed with a solution of 150 parts by weight trichlorosilane (TCS) containing 5000 parts per million (ppm) boron trichloride (BCl3) and agitated periodically for 1 hour. A sample of TCS distilled from the reaction mixture content contained no BCl3 or borates as determined by infrared spectroscopy with a limit of detectability of 25 ppm.
EXAMPLE 2
A solution of TCS containing 5 parts per billion (ppb) BCl3 and 25 ppb trimer were mixed at 120°C under 120 psig. A spectroscopic analysis, with a limit of detectability of 25 parts per trillion (ppt) of a sample of distillate indicates that all of the BCl3 was consumed.
EXAMPLE 3
200 ppm of trimer was added to a solution of TCS containing 2 ppm BCl3. The mixture was heated in an oil bath to 130-135ºC at 100 psig for 4 hours. After standing overnight, 4 fractions were distilled and analyzed for boron content by the colorometric method used in Example 2.
The charge to the distillation vessel was 2000 g. with 99% of the material recovered, the presence of boron was less than 50 parts per trillion in each of the distilled fractions.
EXAMPLES 4 and 5
The procedure of Example 3 was repeated twice, with the following results:
EXAMPLE 6
400 parts by weight of 0.018 molar BCl3 (5000 ppm) in TCS was placed in a reaction vessel with sufficient trimer to make the solution 0.09 molar. The reaction mixture was agitated under pressure and samples distilled periodically for analysis by infrared spectroscopy as in Example 1:
Claims
Claims:
1. A method for purifying silicon halides comprising:
(A) adding to a solution of silicon halide contaminated with Lewis acid impurities a stoichiometric excess, based on the concentration of the impurities, of an organosiloxane;
(B) reacting the impurities in solution with said siloxanes at a temperature of from about 25°C to 200ºC until substantially all the impurities form non-volatile products; and thereafter
(C) removing purified silicon halide by distillation.
2. The method of Claim 1 wherein said impurities contain boron.
3. The method of Claim 2 wherein said boron impurities are boron halides.
4. The method of Claim 1 wherein said silicon halides are selected from the group consisting of silicon tetrachloride, trichlorosilane, and dichlorosilane.
5. The method of Claim 4 wherein the silicon halide is trichlorosilane.
6. The method of Claim 1 wherein the organosiloxane is selected from the group consisting of cyclotrisiloxanes, cyclotetrasiloxanes, polydiemthylsiloxane fluids and dimethylmethyl hydrogen siloxane copolymers.
7. The method fo Claim 6 wherein the organosiloxane is a cyclotrisiloxane.
8. The method of Claim 7 wherein the cyclotrisiloxane is selected from the group consisting of cyclotrisiloxane, aryl cyclotrisiloxanes, alkyl cyclotrisiloxane halogenated alkyltrisiloxanes.
9. The method of Claim 8 wherein the -organosiloxane is an alkyl cyclotrisiloxane.
10. The method of Claim 9 wherein the alkyl cyclo trisiloxane is hexamethylcyclotrisiloxane.
11. The method of Claim 6 wherein the organosiloxane is octamethyltetrasiloxane.
12. The method of Claim 1 wherein the organo siloxane is added to a concentration of 5-100 times the molar concentration of the Lewis acid impurities.
13. The method of Claim 1 wherein the silicon halide is trichlorosilane, the Lewis acid impurities are predominantly boron trichloride, the alkyl siloxane is hexamethylcyclotrisiloxane, and the alkyl siloxane is added in a concentration of about 100 times that of the boron trichloride impurity. 14. In the process for producing electronic grade silicon from high purity trichlorosilane, the improvement which comprises purifying the trichlorosilane by the method comprising:
(A) adding to a solution of trichlorosilane contaminated with Lewis acid impurities a stoichiometric excess, based on the concentration of the impurities, of an organosiloxane;
(B) reacting the impurities in solution with said siloxanes at a temperature of from about 20ºC to 200°C until substantially all the impurities form non-volatile products; and thereafter (C) removing purified trichlorosilane by distillation.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US35943782A | 1982-03-18 | 1982-03-18 | |
US359437 | 1982-03-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0105328A1 EP0105328A1 (en) | 1984-04-18 |
EP0105328A4 true EP0105328A4 (en) | 1984-09-19 |
Family
ID=23413785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19830901472 Withdrawn EP0105328A4 (en) | 1982-03-18 | 1983-03-17 | Purification of silicon halides. |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0105328A4 (en) |
IT (1) | IT1163149B (en) |
WO (1) | WO1983003244A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5660690A (en) * | 1996-06-03 | 1997-08-26 | Dow Corning Corporation | Method for distilling hexamethylcyclotrisiloxane |
EP1741732B1 (en) * | 2004-04-13 | 2013-06-19 | Daikin Industries, Ltd. | Chlorotrifluoroethylene copolymer |
EP3002262B1 (en) | 2014-10-01 | 2018-06-27 | Heraeus Quarzglas GmbH & Co. KG | Method for the manufacture of synthetic quartz glass with polymerizable polyalkylsiloxane |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1330442A (en) * | 1961-08-04 | 1963-06-21 | Merck & Co Inc | Semiconductor body and its manufacturing process |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3126248A (en) * | 1964-03-24 | Process for producing purified | ||
US2857249A (en) * | 1956-07-03 | 1958-10-21 | Guenter A Wolff | Method of purifying silicon tetrachloride |
US3403003A (en) * | 1966-12-23 | 1968-09-24 | Western Electric Co | Method of removing boron from silicon tetrachloride |
US3540861A (en) * | 1968-02-07 | 1970-11-17 | Union Carbide Corp | Purification of silicon compounds |
DE2546957C3 (en) * | 1975-10-20 | 1980-10-23 | Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen | Process for cleaning halosilanes |
-
1983
- 1983-03-17 EP EP19830901472 patent/EP0105328A4/en not_active Withdrawn
- 1983-03-17 WO PCT/US1983/000372 patent/WO1983003244A1/en not_active Application Discontinuation
- 1983-03-18 IT IT20139/83A patent/IT1163149B/en active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1330442A (en) * | 1961-08-04 | 1963-06-21 | Merck & Co Inc | Semiconductor body and its manufacturing process |
Also Published As
Publication number | Publication date |
---|---|
EP0105328A1 (en) | 1984-04-18 |
WO1983003244A1 (en) | 1983-09-29 |
IT1163149B (en) | 1987-04-08 |
IT8320139A0 (en) | 1983-03-18 |
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