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EP0082051B1 - Process for realising a cooling device - Google Patents

Process for realising a cooling device Download PDF

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Publication number
EP0082051B1
EP0082051B1 EP82402215A EP82402215A EP0082051B1 EP 0082051 B1 EP0082051 B1 EP 0082051B1 EP 82402215 A EP82402215 A EP 82402215A EP 82402215 A EP82402215 A EP 82402215A EP 0082051 B1 EP0082051 B1 EP 0082051B1
Authority
EP
European Patent Office
Prior art keywords
mandrels
support
windings
base support
winding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP82402215A
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German (de)
French (fr)
Other versions
EP0082051A2 (en
EP0082051A3 (en
Inventor
René Dassonville
Philippe Bauchet
Eugène Borget
Gildas Laudren
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Thales SA
Original Assignee
Thomson CSF SA
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Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to AT82402215T priority Critical patent/ATE24818T1/en
Publication of EP0082051A2 publication Critical patent/EP0082051A2/en
Publication of EP0082051A3 publication Critical patent/EP0082051A3/en
Application granted granted Critical
Publication of EP0082051B1 publication Critical patent/EP0082051B1/en
Expired legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a method for producing a cooling device comprising a base support and at least one coil with non-contiguous turns of wire of good thermal conductivity, fixed to the support by a weld metal.
  • the cooling device obtained by this process ensures good thermal coupling between a member to be cooled and the ambient medium and applies in particular to electrical components with high heat dissipation.
  • cooling devices are associated with a forced air generator which increases cooling by forced convection.
  • the cooling of a traveling wave tube is a typical example of an application using such means.
  • the known cooling devices used for such applications are generally so-called "spike" radiators and include a base support pian on which many small cylindrical elements are arranged perpendicular to this support.
  • alloys with good thermal conductivity generally have poor flowability, which leads to a reduction in the length of the pins and their distribution density, thereby limiting the contact surface with the cooling fluid.
  • the molten metal tends to cool before reaching the bottom of the mold cavities if they are deep and of small section; moreover, during the demoulding, certain pins break and remain inside the mold.
  • the need to be able to demold limits the forms that a radiator can have, the base of which is, therefore, generally planar, the pins being perpendicular to this base. To these drawbacks are added the high cost of a mold and the difficulties encountered in obtaining modifications of the characteristics of the radiator.
  • Milling in the mass introduces a significant loss of material and requires a relatively long execution time.
  • the pins tend to bend in the direction where the tool attacks the metal; to limit this deflection, the pins must be short, of large section and consequently few in number, which limits the performance of the device.
  • the milling technique is also ill-suited to mass production.
  • each spike is placed in a blind hole made in the support, the pins and the support being previously tinned. The whole is brought to the melting temperature of the tin and then cooled. The pins are thus welded to the support.
  • the assembly technique requires a long execution time and is not compatible with the requirements of mass production.
  • the invention therefore aims to provide a simple method of this type ensuring a correct and reproducible position of the windings on the support, and lending itself to automation.
  • FIG. 1 illustrates an example of a radiator with pins according to the known art, as it could be obtained by a molding or assembly technique.
  • the pins 2 secured to a flat base support 1 are, for the clarity of the figure shown with a low density of distribution.
  • the edge to edge distance between two pins and the diameter of said pins are of the same order of magnitude.
  • FIG. 2 represents a first variant of the device obtained by the method according to the invention.
  • Wire of good thermal conductivity in this example tinned copper wire, is wound with non-contiguous turns on a mandrel with rectangular section.
  • the rectangle constituting the section of the mandrel has, in this preferred variant, short sides of length substantially greater than the diameter of the wire and long sides of length equal to approximately fifteen times said diameter. For the clarity of the drawing these proportions are not exactly respected.
  • FIG. 3 represents a second variant of the device obtained by the method according to the invention.
  • the sets 5 of turns 6 are obtained by winding tinned copper wire on mandrels of triangular section.
  • Each set 5, arranged parallel to the long sides of the support 1, has its evenings 6 partly engaged between the turns of the sets 5 which are adjacent to it.
  • For each of the turns 6, one side of the triangle ensures contact over its entire length with the base support 1.
  • Each turn is situated in a plane perpendicular to the support 1 and fixed to the latter by a filler metal with a low melting point. (tin, lead-tin alloy).
  • the mandrels of triangular section must be eliminated before the positioning of the assemblies 5 on the support 1.
  • the assemblies 5 are placed, in the nested position, in the cavities 'a positioning support before being brought closer to the base support 1. The positioning support is removed after fixing the turns 6 on the support 1.
  • FIG. 4 presents a step in a method allowing two cooling devices to be produced simultaneously.
  • a first device is produced according to the method described for the first variant corresponding to FIG. 2.
  • a second base support 7 bearing on the other short side of the turns is superimposed on the first base support 1.
  • the second support 7 is subjected to a thermal cycle which makes it integral with the turns by melting a filler metal.
  • the mandrels are eliminated and FIG. 4 illustrates the device obtained at this stage.
  • the space between the supports 1 and 7 comprising the turns is filled with wax or another product which can be solidified at room temperature.
  • the assembly After hardening of the wax, the assembly is cut along a plane parallel to the supports 1 and 7, located midway between these two supports and represented in FIG. 4 by the two orthogonal 8 and 9.
  • the wax is removed by elevation temperature and the two cooling devices obtained constitute so-called "spike" coolers.
  • the invention is not limited to the three variant embodiments which have just been described. It is indeed possible to act separately or in combinations on numerous parameters such as the nature of the wire, the shape and the value of its section, the shape and the size of the turns; the turns can, after fixing, be opened and the filiform elements take any desired configuration.
  • the density of distribution of the filiform elements can be modulated by varying the pitch of the turns, the distance between the sets of turns, the dimension of the turns and the section of the wire of each of the sets of turns in order to optimize the performance in each case. of application.
  • the material, shape and dimensions of the support can also contribute to this optimization.
  • the manufacturing method of the cooling device described above has the advantages of not requiring any elaborate and expensive tooling and of making it possible to obtain more efficient radiators (longer, thinner, more numerous filiform elements) than by known techniques. .
  • this process is suitable for the installation of filiform elements on supports of any shape (not necessarily planar) and easily lends itself to the production of radiators made "on demand" (non-standardized products). Finally, it easily lends itself to mass production and makes it possible to reduce the cost of cooling devices.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Processing (AREA)
  • Thermistors And Varistors (AREA)
  • General Induction Heating (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

1. A method for realising a cooling device, comprising a base support (1) and at least one coil (4) with non-adjacent windings (3) of a wire of good heat conductivity, fixed on the support by means of a soldering metal, comprising the following steps : - winding a layer of this wire onto mandrels, -fixing the ends of the mandrels to a frame, - placing the frame and the mandrels on the base support (1) in such a way that all the windings are in contact with said support, - fixing the windings (3) on the base support (1) by means of a soldering metal, - withdrawal of the frame and the mandrels after fixing of the windings.

Description

La présente invention concerne un procédé de réalisation de dispositif de refroidissement comportant un support de base et au moins une bobine à spires non jointives de fil de bonne conductibilité thermique, fixée sur le support par un métal de soudure. Le dispositif de refroidissement obtenu par ce procédé assure un bon couplage thermique entre un organe à refroidir et le miiieu ambiant et s'applique en particulier à des composants électriques à forte dissipation thermique.The present invention relates to a method for producing a cooling device comprising a base support and at least one coil with non-contiguous turns of wire of good thermal conductivity, fixed to the support by a weld metal. The cooling device obtained by this process ensures good thermal coupling between a member to be cooled and the ambient medium and applies in particular to electrical components with high heat dissipation.

En général de tels dispositifs de refroidissement sont associés à un générateur d'air pulsé qui augmente le refroidissement par convection forcée. Le refroidissement d'un tube à ondes progressives est un exemple typique d'application mettant en oeuvre de tels moyens. Les dispositifs de refroidissement connus utilisés pour de telles applications sont généralement des radiateurs dits "à picots" et comprennent un support de base pian sur lequel de nombreux petits éléments cylindriques sont disposés perpendiculairement à ce support. Il existe trois procédés de réalisation connus pour fabriquer de tels radiateurs à picots, ce sont le moulage, le fraisage et l'assemblage.In general, such cooling devices are associated with a forced air generator which increases cooling by forced convection. The cooling of a traveling wave tube is a typical example of an application using such means. The known cooling devices used for such applications are generally so-called "spike" radiators and include a base support pian on which many small cylindrical elements are arranged perpendicular to this support. There are three known production methods for manufacturing such pin radiators, these are molding, milling and assembly.

Dans la technique du moulage, les alliages de bonne conductibilité thermique présentent généralement une mauvaise coulabilité, ce qui conduit à réduire la longueur des picots et leur densité de répartition limitant de ce fait la surface de contact avec le fluide de refroidissement. De plus, le métal en fusion tend à se refroidir avant d'attein- dre le fond des cavités du moule si celles-ci sont profondes et de faible section; par ailleurs, lors du démoulage certains picots se brisent et restent à l'intérieur du moule. La nécessité de pouvoir démouler limite les formes que peut avoir un radiateur dont l'embase est, de ce fait, généralement plane, les picots étant perpendiculaires à cette embase. A ces inconvénients s'ajoutent le coût éievé d'un moule et les difficultés rencontrées pour obtenir des modifications des caractéristiques du radiateur.In the molding technique, alloys with good thermal conductivity generally have poor flowability, which leads to a reduction in the length of the pins and their distribution density, thereby limiting the contact surface with the cooling fluid. In addition, the molten metal tends to cool before reaching the bottom of the mold cavities if they are deep and of small section; moreover, during the demoulding, certain pins break and remain inside the mold. The need to be able to demold limits the forms that a radiator can have, the base of which is, therefore, generally planar, the pins being perpendicular to this base. To these drawbacks are added the high cost of a mold and the difficulties encountered in obtaining modifications of the characteristics of the radiator.

Le fraisage dans la masse introduit une perte importante de matière et demande un temps d'exécution relativement long. De plus les picots ont tendance à fléchir dans le sens où l'outil attaque le métal; pour limiter ce fléchissement les picots doivent être courts, de section importante et en conséquence peu nombreux, ce qui limite les performances du dispositif. La technique du fraisage est en outre mal adaptée à la production en série.Milling in the mass introduces a significant loss of material and requires a relatively long execution time. In addition, the pins tend to bend in the direction where the tool attacks the metal; to limit this deflection, the pins must be short, of large section and consequently few in number, which limits the performance of the device. The milling technique is also ill-suited to mass production.

Dans le cas d'une technique d'assemblage chaque picot est placé dans un trou borgne effectué dans le support, les picots et le support étant préalablement étamés. L'ensemble est porté à la température de fusion de l'étain puis refroidi. Les picots sont ainsi soudés sur le support. La technique de l'assemblage requiert un temps d'exécution long et n'est pas compatible avec des exigences d'une production en série.In the case of an assembly technique, each spike is placed in a blind hole made in the support, the pins and the support being previously tinned. The whole is brought to the melting temperature of the tin and then cooled. The pins are thus welded to the support. The assembly technique requires a long execution time and is not compatible with the requirements of mass production.

Un procédé de réalisation d'un dispositif de refroidissement, comportant un support de base et au moins une bobine à spires non jointives de fil de bonne conductibilité thermique, fixée sur le support par un métal de soudure, est commu du FR-A-1511618 qui décrit aussi les étapes suivantes:

  • - bobinage d'une couche de ce fil,
  • - mise en place de la bobine sur le support de base de façon que toutes les spires soient en contact avec ledit support,
  • - fixation des spires sur le support de base au moyen d'un métal de soudure.
A process for producing a cooling device, comprising a base support and at least one coil with non-contiguous turns of wire of good thermal conductivity, fixed to the support by a weld metal, is known from FR-A-1511618 which also describes the following steps:
  • - winding of a layer of this wire,
  • - positioning of the coil on the base support so that all the turns are in contact with said support,
  • - fixing of the turns on the base support by means of a welding metal.

L'invention a donc pour but de proposer un procédé simple de ce type assurant une position correcte et reproductible des bobinages sur le support, et se prètant à une automatisation.The invention therefore aims to provide a simple method of this type ensuring a correct and reproducible position of the windings on the support, and lending itself to automation.

Ce but est atteint selon l'invention par le procédé tel que défini dans la revendication 1. En ce qui concerne des caractéristiques de certains modes préférés de réalisation, référence est faite aux sous-revendications.This object is achieved according to the invention by the method as defined in claim 1. With regard to the characteristics of certain preferred embodiments, reference is made to the subclaims.

L'invention sera mieux comprise et les détails de réalisation apparaitront plus clairement à l'aide de la description qui suit, en référence aux figures annexées.

  • - la figure 1 illustre un exemple de radiateur à picots selon l'art connu;
  • - les figures 2 et 3 représentent deux variantes de dispositif obtenues par le procédé selon l'invention;
  • - la figure 4 illustre une étape d'un procédé permettant de réaliser simultanément deux dispositifs de refroidissement.
The invention will be better understood and the details of embodiment will appear more clearly with the aid of the description which follows, with reference to the appended figures.
  • - Figure 1 illustrates an example of studded radiator according to the known art;
  • - Figures 2 and 3 show two variant devices obtained by the method according to the invention;
  • - Figure 4 illustrates a step in a process for making two cooling devices simultaneously.

La figure 1 illustre un exemple de radiateur à picots selon l'art connu, tel qu'il pourrait être obtenu par une technique de moulage ou d'assemblage. Les picots 2 solidaires d'un support de base plan 1 sont, pour la clarté de la figure représentés avec une faible densité de répartition. En pratique, la distance bord à bord entre deux picots et le diamètre desdits picots sont du même ordre de grandeur.FIG. 1 illustrates an example of a radiator with pins according to the known art, as it could be obtained by a molding or assembly technique. The pins 2 secured to a flat base support 1 are, for the clarity of the figure shown with a low density of distribution. In practice, the edge to edge distance between two pins and the diameter of said pins are of the same order of magnitude.

La figure 2 représente une première variante de dispositif obtenue par le procédé selon l'invention. Du fil de bonne conductibilité thermique, dans cet exemple du fil en cuivre étamé, est bobiné à spires non jointives sur un mandrin à section rectangulaire. Le rectangle constituant la section du mandrin a, dans cette variante préférée, des petits côtés de longueur sensiblement supérieure au diamètre du fil et des grands côtés de longueur égale à environ quinze fois ledit diamètre. Pour la clarté du dessin ces proportions ne sont pas exactement respectées.FIG. 2 represents a first variant of the device obtained by the method according to the invention. Wire of good thermal conductivity, in this example tinned copper wire, is wound with non-contiguous turns on a mandrel with rectangular section. The rectangle constituting the section of the mandrel has, in this preferred variant, short sides of length substantially greater than the diameter of the wire and long sides of length equal to approximately fifteen times said diameter. For the clarity of the drawing these proportions are not exactly respected.

Plusieurs mandrins identiques ainsi bobinés comportant chacun un ensemble de spires 4 sont disposés côte à côte et parallèlement aux grands côtés d'un support pré-usiné 1 de préférence en cuivre étamé. Les extrémités des mandrins sont fixées sur un cadre qui assure la rigidité de l'ensemble. Les mandrins sont disposés de façon que chaque spire 3 soit dans un plan perpendiculaire au support 1 et en contact avec ce dernier par l'un de ses petits côtés. L'ensemble est alors porté à la température de fusion du métal d'apport, dans le cas présent de l'étain; après refroidissement le cadre et les mandrins sont éliminés conduisant au dispositif de refroidissement illustré par la figure 2.Several identical mandrels thus wound each having a set of turns 4 are arranged side by side and parallel to the long sides of a pre-machined support 1 preferably made of tinned copper. The ends of the mandrels are fixed on a frame which ensures the rigidity of the assembly. The mandrels are arranged so that each turn 3 is in a plane perpendicular to the support 1 and in contact with the latter by one of its short sides. The set is then worn at the melting temperature of the filler metal, in this case tin; after cooling the frame and the mandrels are eliminated leading to the cooling device illustrated in FIG. 2.

La figure 3 représente une deuxième variante de dispositif obtenue par le procédé selon l'invention. Les ensembles 5 de spires 6 sont obtenus en bobinant du fil de cuivre étamé sur des mandrins à section triangulaire. Chaque ensemble 5, disposé parallèlement aux grands côtés du support 1, a ses soires 6 en partie engagées entre les spires des ensembles 5 qui lui sont adjacents. Pour chacune des spires 6 un côté du triangle assure sur toute sa longueur le contact avec le support de base 1. Chaque spire est située dans un plan perpendiculaire au support 1 et fixée à ce dernier par un métal d'apport à bas point de fusion (étain, alliage plomb-étain). Les spires étant imbriquées, les mandrins à section triangulaire doivent être éliminés avant a la mise en place des ensembles 5 sur le support 1. Dans une variante préférée du procédé de réalisation, les ensembles 5 sont placés, en position imbriquée, dans les cavités d'un support de positionnement avant d'être rapprochés du support de base 1. Le support de positionnement est enlevé après fixation des spires 6 sur le support 1.FIG. 3 represents a second variant of the device obtained by the method according to the invention. The sets 5 of turns 6 are obtained by winding tinned copper wire on mandrels of triangular section. Each set 5, arranged parallel to the long sides of the support 1, has its evenings 6 partly engaged between the turns of the sets 5 which are adjacent to it. For each of the turns 6, one side of the triangle ensures contact over its entire length with the base support 1. Each turn is situated in a plane perpendicular to the support 1 and fixed to the latter by a filler metal with a low melting point. (tin, lead-tin alloy). The turns being nested, the mandrels of triangular section must be eliminated before the positioning of the assemblies 5 on the support 1. In a preferred variant of the embodiment, the assemblies 5 are placed, in the nested position, in the cavities 'a positioning support before being brought closer to the base support 1. The positioning support is removed after fixing the turns 6 on the support 1.

La figure 4 présente une étape d'un procédé permettant de réaliser simultanément deux dispositifs de refroidissement. Un premier dispositif est réalisé selon le procédé décrit pour la première variante correspondant à la figure 2. Toutefois avant l'élimination des mandrins un deuxième support de base 7, prenant appui sur l'autre petit côté des spires est superposé au premier support de base 1. Comme le premier support 1, le deuxième support 7 est soumis à un cycle thermique que le rend solidaire des spires par fusion d'un métal d'apport. Les mandrins sont éliminés et la figure 4 illustre le dispositif obtenu à ce stade. L'espace situé entre les supports 1 et 7 comprenant les spires est rempli de cire ou d'un autre produit solidifiable à la température ambiante. Après durcissement de la cire, l'ensemble est coupé selon un plan parallèle aux supports 1 et 7, situé à mi-distance entre ces deux supports et représenté sur la figure 4 par les deux orthogonaux 8 et 9. La cire est éliminée par élévation de température et les deux dispositifs de refroidissement obtenus constituent des refroidisseurs dits "à picots".FIG. 4 presents a step in a method allowing two cooling devices to be produced simultaneously. A first device is produced according to the method described for the first variant corresponding to FIG. 2. However before the removal of the mandrels a second base support 7, bearing on the other short side of the turns is superimposed on the first base support 1. Like the first support 1, the second support 7 is subjected to a thermal cycle which makes it integral with the turns by melting a filler metal. The mandrels are eliminated and FIG. 4 illustrates the device obtained at this stage. The space between the supports 1 and 7 comprising the turns is filled with wax or another product which can be solidified at room temperature. After hardening of the wax, the assembly is cut along a plane parallel to the supports 1 and 7, located midway between these two supports and represented in FIG. 4 by the two orthogonal 8 and 9. The wax is removed by elevation temperature and the two cooling devices obtained constitute so-called "spike" coolers.

L'invention n-est pas limitée aux trois variantes de réalisation qui viennent d'être décrites. Il est en effet possible d'agir séparément ou en combinaisons sur de nombreux paramètres tels que la nature du fil, la forme et la valeur de sa section, la forme et la dimension des spires; les spires peuvent, après fixation, être ouvertes et les éléments filiformes prendre toute configuration souhaitée. La densité de répartition des éléments filiformes peut être modulée en faisant varier le pas des spires, la distance entre les ensembles de spires, la dimension des spires et la section du fil de chacun des ensembles de spires afin d'optimiser les performances dans chaque cas d'application. Le matériau, la forme et les dimensions du support peuvent aussi contribuer à cette optimisation.The invention is not limited to the three variant embodiments which have just been described. It is indeed possible to act separately or in combinations on numerous parameters such as the nature of the wire, the shape and the value of its section, the shape and the size of the turns; the turns can, after fixing, be opened and the filiform elements take any desired configuration. The density of distribution of the filiform elements can be modulated by varying the pitch of the turns, the distance between the sets of turns, the dimension of the turns and the section of the wire of each of the sets of turns in order to optimize the performance in each case. of application. The material, shape and dimensions of the support can also contribute to this optimization.

Le procédé de fabrication du dispositif de refroidissement décrit ci-dessus a pour avantages de ne nécessiter aucun outillage élaboré et coûteux et de permettre l'obtention de radiateurs plus performants (éléments filiformes plus longs, plus minces, plus nombreux) que par les techniques connues. De plus ce procédé convient pour la mise en place d'éléments filiformes sur des supports de formes quelconques (pas nécessairement plans) et se prête aisément à la réalisation de radiateurs faits "à la demande" (produits non standardisés). Enfin il se prête facilement à une production en série et permet de réduire le coût des dispositifs de refroidissement.The manufacturing method of the cooling device described above has the advantages of not requiring any elaborate and expensive tooling and of making it possible to obtain more efficient radiators (longer, thinner, more numerous filiform elements) than by known techniques. . In addition, this process is suitable for the installation of filiform elements on supports of any shape (not necessarily planar) and easily lends itself to the production of radiators made "on demand" (non-standardized products). Finally, it easily lends itself to mass production and makes it possible to reduce the cost of cooling devices.

Claims (8)

1. A method for realising a cooling device, comprising a base support (1) and at least one coil (4) with non-adjacent windings (3) of a wire of good heat conductivity, fixed on the support by means of a soldering metal, comprising the following steps:
- winding a layer of this wire onto mandrels,
- fixing the ends of the mandrels to a frame,
- placing the frame and the mandreis on the base support (1) in such a way that all the windings are in contact with said support,
- fixing the windings (3) on the base support (1) by means of a soldering metal,
- withdrawal of the frame and the mandrels after fixing of the windings.
2. A realisation method according to claim 1, in which
- said placing of the mandrels is carried out on said support (1) and on a second base support (7) parallel to the first one in such a way that each winding is in contact with both supports.
- the windings are fixed on the two base supports by means of a soldering metal with a low point of fusion, and said mandrels are withdrawn,
-- the assembly thus obtained is cut according to a plane which is parallel to said base supports and situated in the middle between these two supports so as to simultaneously realise two cooling devices.
3. A realisation method according to claim 2, further comprising, after the step of withdrawing the frame and the mandrels, a step in which the space included between the two supports and containing the windings is filled with a product which hardens at ambient temperature in order to facilitate the cutting of the two cooling devices which have been obtained, this product being eliminated by rising of the temperature.
4. A method according to claim 1, according to which the form of the mandrels is chosen so as to realise rectangular windings, the large sides of each rectangular winding (3) being perpendicular to said base support.
5. A method according to claim 1, according to which the form of the mandrels is chosen so as to realise triangular windings, each triangular winding being in a plane which is perpendicular to the base support, one of the sides of the winding being in contact with said support.
6. A method according to one of the preceding claims, in which the base support (1) is made of copper.
7. A method according to any one of the preceding claims, in which the wire is made of copper and has a circular cross-section.
8. A method according to any one of the preceding claims, in which the soldering metal with a low point of fusion is tin or a lead-tin alloy.
EP82402215A 1981-12-11 1982-12-03 Process for realising a cooling device Expired EP0082051B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT82402215T ATE24818T1 (en) 1981-12-11 1982-12-03 METHOD OF MAKING A REFRIGERATION DEVICE.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8123212 1981-12-11
FR8123212A FR2518357A1 (en) 1981-12-11 1981-12-11 METHOD FOR PRODUCING A COOLING DEVICE WITH FILIFORED ELEMENTS FOR AN ELECTRONIC COMPONENT AND A COOLING DEVICE THUS OBTAINED

Publications (3)

Publication Number Publication Date
EP0082051A2 EP0082051A2 (en) 1983-06-22
EP0082051A3 EP0082051A3 (en) 1984-01-11
EP0082051B1 true EP0082051B1 (en) 1987-01-07

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EP82402215A Expired EP0082051B1 (en) 1981-12-11 1982-12-03 Process for realising a cooling device

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EP (1) EP0082051B1 (en)
AT (1) ATE24818T1 (en)
DE (1) DE3275053D1 (en)
FR (1) FR2518357A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19623677A1 (en) * 1996-06-14 1997-12-18 Univ Dresden Tech Equipment cabinet for electrical and electronic systems
DE10140328A1 (en) * 2001-08-16 2003-04-03 Siemens Ag Cooling device for electronic components has outer surface sections facing away from hollow volume in different directions, to each of which electronic component(s) can be attached

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5212625A (en) * 1988-12-01 1993-05-18 Akzo Nv Semiconductor module having projecting cooling fin groups
US5158136A (en) * 1991-11-12 1992-10-27 At&T Laboratories Pin fin heat sink including flow enhancement
FR2913765B1 (en) * 2007-03-16 2012-08-10 Pierre Vironneau FLUID CIRCULATION TABLE, METHOD FOR MAKING SUCH A TABLET AND USE OF SUCH PANELS FOR PRODUCING A HEAT EXCHANGER
NL2019792B1 (en) * 2017-10-24 2019-04-29 Micro Turbine Tech B V Heat exchanger comprising a stack of cells and method of manufacturing such a heat exchanger
SE1730353A1 (en) * 2017-12-28 2019-06-29 Andersson Inge Cooling installation

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Publication number Priority date Publication date Assignee Title
GB692885A (en) * 1949-12-28 1953-06-17 Brown Fintube Co Improvements in the manufacture of heat exchangers
US2879041A (en) * 1956-10-15 1959-03-24 Rca Corp Heat radiator
DE1132883B (en) * 1957-01-30 1962-07-12 Franciscus Roffelsen Process for the production of heat exchange elements
FR1511618A (en) * 1966-12-19 1968-02-02 Chausson Usines Sa Process for the manufacture of heat sinks of the resulting wire and sink type

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19623677A1 (en) * 1996-06-14 1997-12-18 Univ Dresden Tech Equipment cabinet for electrical and electronic systems
DE19623677C2 (en) * 1996-06-14 1999-09-16 Knuerr Mechanik Ag Equipment cabinet for electrical and electronic systems
DE10140328A1 (en) * 2001-08-16 2003-04-03 Siemens Ag Cooling device for electronic components has outer surface sections facing away from hollow volume in different directions, to each of which electronic component(s) can be attached
DE10140328B4 (en) * 2001-08-16 2006-02-02 Siemens Ag Cooling arrangement for cooling electronic components

Also Published As

Publication number Publication date
FR2518357B3 (en) 1984-12-14
EP0082051A2 (en) 1983-06-22
EP0082051A3 (en) 1984-01-11
ATE24818T1 (en) 1987-01-15
FR2518357A1 (en) 1983-06-17
DE3275053D1 (en) 1987-02-12

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