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EP0017216B1 - Ultrasonic transducer - Google Patents

Ultrasonic transducer Download PDF

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Publication number
EP0017216B1
EP0017216B1 EP80101743A EP80101743A EP0017216B1 EP 0017216 B1 EP0017216 B1 EP 0017216B1 EP 80101743 A EP80101743 A EP 80101743A EP 80101743 A EP80101743 A EP 80101743A EP 0017216 B1 EP0017216 B1 EP 0017216B1
Authority
EP
European Patent Office
Prior art keywords
layer
ultrasonic transducer
receiving layer
receiving
transmitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP80101743A
Other languages
German (de)
French (fr)
Other versions
EP0017216A2 (en
EP0017216A3 (en
Inventor
Jaques Dr. Dipl.-Ing. Borburgh
Ingmar Dr. Dipl.-Phys. Feigt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to AT80101743T priority Critical patent/ATE2293T1/en
Publication of EP0017216A2 publication Critical patent/EP0017216A2/en
Publication of EP0017216A3 publication Critical patent/EP0017216A3/en
Application granted granted Critical
Publication of EP0017216B1 publication Critical patent/EP0017216B1/en
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0688—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/02—Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S310/00—Electrical generator or motor structure
    • Y10S310/80—Piezoelectric polymers, e.g. PVDF

Definitions

  • the invention relates to an ultrasound transducer, consisting of a transmission layer and a reception layer, both of which are connected to one another in hybrid technology lying flat on one another.
  • the object of the present invention is to develop such an ultrasound transducer in such a way that, with an optimally compact structure, optimal results are simultaneously obtained for the transmission and reception case.
  • the transmission layer consists of material with a relatively high dielectric constant and high sound impedance and the receiving layer consists of material with a relatively low dielectric constant and low sound impedance.
  • the invention enables optimal conditions in the case of transmission and reception.
  • a receiving layer made of material with a relatively low dielectric constant and low impedance ensures optimal reception quality.
  • the transmission case then remains unaffected, since the energy output during transmission, as known per se, remains unchanged due to the use of a transmission layer made of material with a relatively high dielectric constant and high acoustic impedance.
  • the invention can also be designed in such a way that the receiving layer is at the same time an adaptation layer for the transmission case.
  • the receiving layer is designed in the form of an adaptation layer for adaptation to body tissue or, if a water section is connected upstream, for adaptation to water.
  • the transmitting layer consists, as has also been customary hitherto, of piezoceramic, while the receiving layer consists of piezoelectric plastic film, in particular of polyvinyl difluoride (PVF 2 ) or polyvinyl chloride or polycarbonate.
  • PVF 2 polyvinyl difluoride
  • Theta arrays are ultrasound transducers which are constructed from an outer ring-shaped transmission array and from a reception array arranged inside the ring.
  • the ultrasonic transducer in a sandwich construction consists of a carrier body 1 with a transmission layer 2 and a reception layer 3. All of the layers are interconnected over a large area using hybrid technology.
  • a material with a relatively high dielectric constant and high sound impedance e.g. B. a piezoceramic material.
  • the transmission layer made of lead zirconate titanate or lead metaniobate is preferred.
  • the receiving layer 3 consists of a material with a low dielectric constant and low sound impedance. It also serves as an adaptation layer for the transmission case.
  • piezoelectric plastic films with an impedance of approximately 3 are available for this purpose. 10 6 Pas / m and a quality of about 15 to.
  • the preferred material for the piezoelectric plastic film serving as the receiving layer 3 is polyvinyl difluoride (PVF 2 ).
  • PVF 2 polyvinyl difluoride
  • films made of polyvinyl chloride or polycarbonate can also be used.
  • the carrier body 1 can consist of epoxy resin.
  • elastic rubber can also be used as a suitable “backing” material for this purpose, so that in connection with the elastic piezoplastic film and suitably divided piezoceramic material, an elastic, conformable transducer structure is possible.
  • the transmission layer 2 has a contact connection for a transmission amplifier 4 on the surface facing away from the reception layer 3.
  • the electrical radio-frequency pulses for excitation of the transmission layer 2 in the sense of the transmission of ultrasound pulses are thus supplied to the transmission layer 2 via this transmission amplifier.
  • the reception amplifier 6 there is a switch 5 with which the reception amplifier 6 can be short-circuited in the case of transmission.
  • the receiving layer 3 also has a connection 7 for ground potential on the surface facing away from the transmitting layer.
  • the converter in FIG. 2 shows a modification of the exemplary embodiment in FIG. 1.
  • This converter in turn consists of that of FIG. 1 from the carrier material 1, transmission layer 2 and reception layer 3 in a hybrid construction.
  • components 8 of the receiving circuit in particular receiving amplifiers, are incorporated in an IC design in the manner of a sandwich between the transmitting layer 2 and the receiving layer 3. This type of integrated structure leads to a particularly compact design.
  • the IC components 8 are switched on between the transmission layer 2 and the reception layer 3 via the signal line 9.
  • the ultrasonic transducers shown only in cross section in FIGS. 1 and 2 preferably have a cuboid shape in the present case.
  • Arrays in this form are shown, for example, in FIGS. 1 and 2 of DE-AS-2 628 492.
  • other shaped transducer arrays can be used, such as.
  • B. transducer arrays with a matrix-like arrangement of the individual elements, the surface shape of the overall arrangement being again cuboid or even round or dg! can be.
  • ultrasound arrays with fine division of the individual elements can also be used.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Mechanical Engineering (AREA)
  • Multimedia (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Surgical Instruments (AREA)

Abstract

In exemplary embodiments, a transmitting layer of material having a relatively high dielectric constant and high acoustic impedance, and a receiving layer of material having a relatively low dielectric constant and low acoustic impedance are superimposed such that an optimum construction is provided which simultaneously creates optimum results for the instance of transmission and reception. The two layers are interconnected by means of hybrid techniques such that they mate in a laminar manner.

Description

Die Erfindung bezieht sich auf einen Ultraschallwandler, bestehend aus einer Sendeschicht und einer Empfangsschicht, die beide in Hybridtechnik flächig aufeinanderliegend miteinander verbunden sind.The invention relates to an ultrasound transducer, consisting of a transmission layer and a reception layer, both of which are connected to one another in hybrid technology lying flat on one another.

Ein Ultraschallwandler dieser Art ist aus der US-PS 2 625 035 vorbekannt.An ultrasonic transducer of this type is previously known from US Pat. No. 2,625,035.

Aufgabe vorliegender Erfindung ist es, einen solchen Ultraschallwandler dahingehend weiterzubilden, daß bei optimal kompaktem Aufbau gleichzeitig optimale Ergebnisse für den Sende-und Empfangsfall geschaffen werden.The object of the present invention is to develop such an ultrasound transducer in such a way that, with an optimally compact structure, optimal results are simultaneously obtained for the transmission and reception case.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß die Sendeschicht aus Material mit relativ hoher dielektrischer Konstante und hoher Schallimpedanz und die Empfangsschicht aus Material mit relativ niedriger dielektrischer Konstante und niedriger Schallimpedanz besteht.This object is achieved in that the transmission layer consists of material with a relatively high dielectric constant and high sound impedance and the receiving layer consists of material with a relatively low dielectric constant and low sound impedance.

Die Erfindung ermöglicht bei äußerst kompaktem Aufbau des Wandlers optimale bedingungen im Sende- und im Empfangsfall. Eine Empfangsschicht aus Material mit relativ niedriger dielektrischer Konstante und niedriger Schaihmpedanz gewährleistet optimale Empfangsgüte. Der Sendefall bleibt dann unbeeinflußt, da die Energieabgabe beim Senden, wie an sich bekannt, durch die Verwendung einer Sendeschicht aus Material mit relativ hoher dielektrischer Konstante und hoher Schallimpedanz unverändert stark bleibt.With an extremely compact construction of the converter, the invention enables optimal conditions in the case of transmission and reception. A receiving layer made of material with a relatively low dielectric constant and low impedance ensures optimal reception quality. The transmission case then remains unaffected, since the energy output during transmission, as known per se, remains unchanged due to the use of a transmission layer made of material with a relatively high dielectric constant and high acoustic impedance.

Ein Ultraschallwandler, der aus zwei piezoelektrischen Schichten aufgebaut ist, von denen die eine eine relativ hohe und die andere eine relativ niedrige Schallimpedanz aufweisen, ist an sich schon aus der US-PS 2 875 354 vorbekannt. Die beiden Schichten dieses vorbekannten Wandlers sind aber nicht, wie es vorliegende Erfindung fordert, gleichzeitig Sende- und Empfangsschicht. Vielmehr ist im Gegensatz dazu jede der beiden Schichten sowohl Sendeschicht als auch Empfangsschicht. Darüber hinaus ist auch keine Aussage darüber gemacht, daß die Sende-/Empfangsschicht mit relativ hoher Schallimpedanz gleichzeitig auch eine relativ hohe dielektrische Konstante bzw. die zweite Sende-/Empfangsschicht mit relativ niedriger Schallimpedanz auch gleichzeitig noch eine relativ niedrige dielektrische Konstante hat.An ultrasonic transducer which is constructed from two piezoelectric layers, one of which has a relatively high and the other a relatively low acoustic impedance, is already known per se from US Pat. No. 2,875,354. However, the two layers of this known converter are not, as required by the present invention, the transmitting and receiving layers at the same time. In contrast, each of the two layers is both the transmission layer and the reception layer. Furthermore, no statement is made that the transmission / reception layer with a relatively high sound impedance also has a relatively high dielectric constant and the second transmission / reception layer with a relatively low sound impedance also has a relatively low dielectric constant.

Die Erfindung läßt sich in vorteilhafter Ausgestaltung auch dahingehend ausbilden, daß die Empfangsschicht gleichzeitig Anpassungsschicht für den Sendefall ist. Durch Ausnutzung des Empfängers gleichzeitig als Anpassungsschicht wird der Aufbau weiter vereinfacht; außerdem lassen sich hierdurch kurze Pulsanregungen besonders gut bewältigen. Die Empfangsschicht sollte in Ausbildung als Anpassungsschicht zur Anpassung an Körpergewebe oder bei Vorschaltung einer Wasserstrecke zur Anpassung an Wasser ausgebildet sein.In an advantageous embodiment, the invention can also be designed in such a way that the receiving layer is at the same time an adaptation layer for the transmission case. By using the receiver as an adaptation layer at the same time, the structure is further simplified; In addition, short pulse excitations can be coped with particularly well. The receiving layer should be designed in the form of an adaptation layer for adaptation to body tissue or, if a water section is connected upstream, for adaptation to water.

In weiterer vorteilhafter Ausgestaltung der Erfindung besteht die Sendeschicht, wie bisher auch schon üblich, aus Piezokeramik, während die Empfangsschicht jedoch aus piezoelektrischer Kunststoffolie, insbesondere aus Polyvinyldifluorid (PVF2) oder Polyvinylchlorid oder Polycarbonat, besteht.In a further advantageous embodiment of the invention, the transmitting layer consists, as has also been customary hitherto, of piezoceramic, while the receiving layer consists of piezoelectric plastic film, in particular of polyvinyl difluoride (PVF 2 ) or polyvinyl chloride or polycarbonate.

Zwar ist schon aus dem Aufsatz »EXPERIMEN-TAL BROADBAND ULTRASONIC TRANSDU-CERS USING PVF2 PIEZOELECTRIC FILM« in der Zeitschrift »ELECTRONIC LETTERS« 5. August 1976, Vol. 12, Nr. 16, Seiten 393 und 394 ein Ultraschallwandler in PVF2-Ausbildung vorbekannt; es ist jedoch so, daß sowohl der Sendewandler als auch der Empfangswandler aus PVF2 gefertigt sind und beide Wandler außerdem auch noch getrennt voneinander angeordnet sind. Sende- und Empfangswandler liegen also nicht in Hybridtechnik flächig aufeinander. Zwar wird in dieser speziellen Ausbildung des Standes der Technik die Güte des Empfangs verbessert; gleichzeitig verschlechtert sich aber der Sendefall, da die Energieabgabe beim Senden wegen der niedrigen Güte der die Sendeschicht bildenden PVF2-Schicht zu gering ist.From the article "EXPERIMEN-TAL BROADBAND ULTRASONIC TRANSDU-CERS USING PVF 2 PIEZOELECTRIC FILM" in the magazine "ELECTRONIC LETTERS" August 5, 1976, Vol. 12, No. 16, pages 393 and 394 an ultrasonic transducer in PVF 2 -Education already known; however, it is the case that both the transmitter converter and the receiver converter are made of PVF 2 and both converters are also arranged separately from one another. Transmitter and receiver converters are therefore not flat on top of one another in hybrid technology. It is true that the quality of reception is improved in this special configuration of the prior art; At the same time, however, the transmission case deteriorates, since the energy output during transmission is too low due to the low quality of the PVF 2 layer forming the transmission layer.

Aus dem Aufsatz »MONOLITHIC SILICON-PVF2 PIEZOELECTRIC ARRAYS FOR ULTRASONIC IMAGING« der Autoren R. G. Swartz und J. D. Plummer, erstmals vorgetragen zwischen dem 29. Mai und 2. Juni 1978 auf dem »Eighth International Symposium on Acoustic Imaging« in Key Biscayne, Florida, bzw. dann veröffentlicht in der Zeitschrift »Acoustical Imaging« Vol. 8, 1978, Seiten 69 bis 95, ist auch noch ein Vorschlag bekannt, gemäß dem bei einem sogenannten »Theta«-Array als »inneres Array« ein 32 x 1 linear array von POSFET-Wandlern verwendet werden soll. POSFET-Wandler, die zwar ebenfalls mit PVF2 arbeiten, die jedoch ansonsten zum vorliegenden erfindungsgemäßen Wandler unterschiedlich aufgebaut sind, sind in dem Aufsatz in verschiedenen Ausführungsformen beschrieben. »Theta«-Arrays sind hingegen in dem Aufsatz »High-Resolution B-Scan Systems Using a Circular Array« von A. Macovski und S. J. Norton aus »Acoustical Holography« Vol. 6, 1978, Seiten 69 bis 95 vorbekannt. Demgemäß sind »Theta«-Arrays Ultraschallwandler, die aus einem äußeren ringförmigen Sende-Array und aus einem innerhalb des Ringes angeordneten Empfangs-Array aufgebaut sind.From the essay "MONOLITHIC SILICON-PVF 2 PIEZOELECTRIC ARRAYS FOR ULTRASONIC IMAGING" by the authors RG Swartz and JD Plummer, first presented between May 29 and June 2, 1978 at the "Eighth International Symposium on Acoustic Imaging" in Key Biscayne, Florida , or then published in the magazine "Acoustical Imaging" Vol. 8, 1978, pages 69 to 95, a proposal is also known according to which a 32 x 1 linear as "inner array" in a so-called "theta" array array of POSFET converters to be used. POSFET converters, which also work with PVF 2 , but which are otherwise constructed differently from the present converter according to the invention, are described in various versions in the article. "Theta" arrays, on the other hand, are previously known in the article "High-Resolution B-Scan Systems Using a Circular Array" by A. Macovski and SJ Norton from "Acoustical Holography" Vol. 6, 1978, pages 69 to 95. Accordingly, “theta” arrays are ultrasound transducers which are constructed from an outer ring-shaped transmission array and from a reception array arranged inside the ring.

Weitere Vorteile und Einzelheiten der Erfindung ergeben sich aus der nachfolgenden Beschreibung zweier Ausführungsbeispiele anhand der Zeichnung und in Verbindung mit den Unteransprüchen.Further advantages and details of the invention emerge from the following description of two exemplary embodiments with reference to the drawing and in conjunction with the subclaims.

Es zeigt

  • Fig. 1 einen Ultraschallwandler gemäß der Erfindung im Querschnitt,
  • Fig. 2 einen im' Aufbau modifizierten Ultraschallwandler.
It shows
  • 1 shows an ultrasonic transducer according to the invention in cross section,
  • Fig. 2 a modified in the 'structure sound converter.

In der Fig. 1 besteht der Ultraschallwandler in Sandwich-Bauweise aus einem Trägerkörper 1 mit Sendeschicht 2 und Empfangsschicht 3. Sämtliche Schichten sind großflächig untereinander in Hybridtechnik miteinander verbunden. Als Sendeschicht dient ein Material mit relativ hoher dielektrischer Konstante und hoher Schallimpedanz, z. B. ein Piezokeramik-Material. Zu bevorzugen sind hierbei die Sendeschicht aus Blei-Zirkonat-Titanat oder Blei-Metaniobat. Die Empfangsschicht 3 besteht demgegenüber aus einem Material mit niedriger dielektrischer Konstante und niedriger Schallimpedanz. Sie dient gleichzeitig als Anpassungsschicht für den Sendefall. Hierzu bieten sich in bevorzugter Ausführungsform piezoelektrische Kunststofffolien mit einer Impedanz von etwa 3 . 106 Pas/m und einer Güte von etwa 15 an. Bevorzugtes Material für die als Empfangsschicht 3 dienende piezoelektrische Kunststoffolie ist Polyvinyldifluorid (PVF2). Anstelle dieses Materials können auch Folien aus Polyvinylchlorid oder aus Polycarbonat Verwendung finden. Der Trägerkörper 1 kann aus Epoxydharz bestehen. Es kann jedoch hierfür als geeignetes »backing«-Material auch elastischer Gummi verwendet werden, so daß in Zusammenhang mit der elastischen Piezokunststoffolie und geeignet geteiltem Piezokeramikmaterial ein elastischer, anschmiegsamer Wandleraufbau möglich ist.In FIG. 1, the ultrasonic transducer in a sandwich construction consists of a carrier body 1 with a transmission layer 2 and a reception layer 3. All of the layers are interconnected over a large area using hybrid technology. A material with a relatively high dielectric constant and high sound impedance, e.g. B. a piezoceramic material. The transmission layer made of lead zirconate titanate or lead metaniobate is preferred. In contrast, the receiving layer 3 consists of a material with a low dielectric constant and low sound impedance. It also serves as an adaptation layer for the transmission case. In a preferred embodiment, piezoelectric plastic films with an impedance of approximately 3 are available for this purpose. 10 6 Pas / m and a quality of about 15 to. The preferred material for the piezoelectric plastic film serving as the receiving layer 3 is polyvinyl difluoride (PVF 2 ). Instead of this material, films made of polyvinyl chloride or polycarbonate can also be used. The carrier body 1 can consist of epoxy resin. However, elastic rubber can also be used as a suitable “backing” material for this purpose, so that in connection with the elastic piezoplastic film and suitably divided piezoceramic material, an elastic, conformable transducer structure is possible.

In der Ausführungsform des Wandlers der Fig. 1 weist die Sendeschicht 2 auf der der Empfangsschicht 3 abgewandten Fläche einen Kontaktanschluß für einen Sendeverstärker 4 auf. Über diesen Sendeverstärker werden also der Sendeschicht 2 die elektrischen Hochfrequenzimpulse zur Erregung der Sendeschicht 2 im Sinne der Aussendung von Ultraschallimpulsen zugeleitet. Zwischen Empfangsschicht 3 und Sendeschicht 2 ist eine weitere Kontaktierung, z. B. dünne Kontaktschicht oder Bahnen in gedruckter Schaltungstechnik, zwischengelagert, die einen elektrischen Empfangsanschluß zum Empfänger 6 für die von der Empfangsschicht 3 empfangenen Echoimpulse eines Sendeimpulses aufweist. Parallel zum Empfangsverstärker 6 liegt ein Schalter 5, mit dem im Sendefall der Empfangsverstärker 6 kurzgeschlossen werden kann. In diesem Falle liegt zwischen Sendeschicht 2 und Empfangsschicht 3 Massepotential. Die Empfangsschicht 3 weist schließlich noch auf der der Sendeschicht abgewandten Fläche einen Anschluß 7 für Massepotential auf.In the embodiment of the converter in FIG. 1, the transmission layer 2 has a contact connection for a transmission amplifier 4 on the surface facing away from the reception layer 3. The electrical radio-frequency pulses for excitation of the transmission layer 2 in the sense of the transmission of ultrasound pulses are thus supplied to the transmission layer 2 via this transmission amplifier. A further contact, z. B. thin contact layer or webs in printed circuit technology, which has an electrical receiving connection to the receiver 6 for the echo pulses received by the receiving layer 3 of a transmission pulse. In parallel to the reception amplifier 6 there is a switch 5 with which the reception amplifier 6 can be short-circuited in the case of transmission. In this case there is a ground potential between transmission layer 2 and reception layer 3. Finally, the receiving layer 3 also has a connection 7 for ground potential on the surface facing away from the transmitting layer.

Eine Modifikation des Ausführungsbeispiels der Fig. 1 zeigt der Wandler in der Fig. 2.The converter in FIG. 2 shows a modification of the exemplary embodiment in FIG. 1.

Dieser Wandler besteht wiederum entsprechend jenem der Fig. 1 aus Trägermaterial 1, Sendeschicht 2 und Empfangsschicht 3 in Hybrid-Bauweise. Im Unterschied zum Wandler der Fig. 1 sind jedoch nach Sandwich-Art zwischen Sendeschicht 2 und Empfangsschicht 3 Bauteile 8 der Empfangsschaltung, insbesondere Empfangsverstärker, in IC-Bauweise eingelagert. Diese Art des integrierten Aufbaus führt zu besonders kompakter Bauform. Die Anschaltung der IC-Bauelemente 8 zwischen Sendeschicht 2 und Empfangsschicht 3 erfolgt über die Signalleitung 9.This converter in turn consists of that of FIG. 1 from the carrier material 1, transmission layer 2 and reception layer 3 in a hybrid construction. In contrast to the converter of FIG. 1, however, components 8 of the receiving circuit, in particular receiving amplifiers, are incorporated in an IC design in the manner of a sandwich between the transmitting layer 2 and the receiving layer 3. This type of integrated structure leads to a particularly compact design. The IC components 8 are switched on between the transmission layer 2 and the reception layer 3 via the signal line 9.

Die in den Fig. 1 und 2 lediglich im Querschnitt dargestellten Ultraschallwandler weisen im vorliegenden Fall bevorzugt quaderförmige Gestalt auf. Arrays in dieser Form sind beispielsweise in den Fig. 1 und 2 der DE-AS-2 628 492 dargestellt. Selbstverständlich können auch anders geformte Wandler-Arrays Verwendung finden, wie z. B. Wandler-Arrays mit matrixförmiger Anordnung der Einzeielemente, wobei die Flächenform der Gesamtanordnung beliebig wieder quaderförmig oder auch rund od. dg! sein kann. Entsprechend können auch Ultraschall-Arrays mit Feinteilung der Einzelelemente Verwendung finden.The ultrasonic transducers shown only in cross section in FIGS. 1 and 2 preferably have a cuboid shape in the present case. Arrays in this form are shown, for example, in FIGS. 1 and 2 of DE-AS-2 628 492. Of course, other shaped transducer arrays can be used, such as. B. transducer arrays with a matrix-like arrangement of the individual elements, the surface shape of the overall arrangement being again cuboid or even round or dg! can be. Correspondingly, ultrasound arrays with fine division of the individual elements can also be used.

Claims (13)

1. An ultrasonic transducer consisting of a transmitting layer and a receiving layer which lie face-toface in the hybrid technique one on top of the other, characterised in that the transmitting layer (2) consists of a material having a relatively high dielectric constant and a high acoustic impedance and the receiving layer (3) consists of a material having a relatively low dielectric constant and a low acoustic impedance.
2. An ultrasonic transducer as claimed in Claim 1, characterised in that the receiving layer (3) simultaneously is an matching layer for the transmitting case.
3. An ultrasonic transducer as claimed in Claim 2, characterised in that the receiving layer (3) is formed for matching to body textures, or in the event of the connection of a strech of water, for matching to water.
4. An ultrasonic transducer as claimed in one of Claims 1 to 3, characterised in that the receiving layer (3) is applied to, preferably stuck to, the transmitting layer (2), with the interposition of a contact, e. g. a thin contact layer or conductor paths using the printed circuit technique.
5. An ultrasonic transducer as claimed in Claim 4, characterised in that the contact has an electric receiving connection to the receiver (6).
6. An ultrasonic transducer as claimed in one of Claims 1 to 5, characterised in that the face of the receiving layer (3) which faces away from the transmitting layer (2) has a connection (7) for earth potential.
7. An ultrasonic transducer as claimed in one of Claims 1 to 6, characterised in that the transmitting layer (2) is provided with a connection for the transmitter (4) on the face which faces away from the receiving layer (3).
8. An ultrasonic transducer as claimed in one of Claims 1 to 7, characterised in that in sandwichconstruction, components (8) of the receiving circuit, in particular receiving amplifiers, are interposed using IC-construction between the transmitting layer (2) and the receiving layer (3).
9. An ultrasonic transducer as claimed in one of Claims 1 to 8, characterised in that the transmitting layer (2) is made of piezo-ceramic and the receiving layer (3) of piezo-electric synthetic resin film.
10. An ultrasonic transducer as claimed in Caim 9, characterised in that the receiving layer (3) is made of piezo-electric synthetic resin film having an impedance of about 3 - 106 Pas/m and a grade of about 15.
11. An ultrasonic transducer as claimed in Claim 9 or Claim 10, characterised in that the transmitting layer is made of lead-zirconate-titanate or lead-metaniobate.
12. An ultrasonic transducer as claimed in one of Claims 9 to 11, characterised in that the piezoelectric synthetic resin film of the receiving layer (3) consists of polyvinyl difluoride (PVF2) or polyvinyl chloride or polycarbonate.
13. An ultrasonic transducer as claimed in one of Claims 1 to 12, characterised in that the transmitting layer (2) and the receiving layer (3), which are connected to one another using the hybrid-technique, are also applied, preferably also using the hybridtechnique, on an attenuation carrier body (1), which is preferably made of elastic rubber orthe like.
EP80101743A 1979-04-06 1980-04-01 Ultrasonic transducer Expired EP0017216B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT80101743T ATE2293T1 (en) 1979-04-06 1980-04-01 ULTRASONIC TRANSDUCER.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2914031A DE2914031C2 (en) 1979-04-06 1979-04-06 Ultrasonic transducer
DE2914031 1979-04-06

Publications (3)

Publication Number Publication Date
EP0017216A2 EP0017216A2 (en) 1980-10-15
EP0017216A3 EP0017216A3 (en) 1980-11-12
EP0017216B1 true EP0017216B1 (en) 1983-01-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP80101743A Expired EP0017216B1 (en) 1979-04-06 1980-04-01 Ultrasonic transducer

Country Status (7)

Country Link
US (1) US4354132A (en)
EP (1) EP0017216B1 (en)
JP (1) JPS5856320B2 (en)
AT (1) ATE2293T1 (en)
AU (1) AU5715680A (en)
CA (1) CA1154861A (en)
DE (2) DE2914031C2 (en)

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Also Published As

Publication number Publication date
JPS55140392A (en) 1980-11-01
EP0017216A2 (en) 1980-10-15
ATE2293T1 (en) 1983-02-15
DE2914031C2 (en) 1981-01-15
CA1154861A (en) 1983-10-04
DE2914031B1 (en) 1980-05-14
DE3061665D1 (en) 1983-02-24
EP0017216A3 (en) 1980-11-12
AU5715680A (en) 1980-10-09
JPS5856320B2 (en) 1983-12-14
US4354132A (en) 1982-10-12

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