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DK596887A - Fotofoelsomt laminat og dets anvendelse - Google Patents

Fotofoelsomt laminat og dets anvendelse

Info

Publication number
DK596887A
DK596887A DK596887A DK596887A DK596887A DK 596887 A DK596887 A DK 596887A DK 596887 A DK596887 A DK 596887A DK 596887 A DK596887 A DK 596887A DK 596887 A DK596887 A DK 596887A
Authority
DK
Denmark
Prior art keywords
photo
sensitive laminate
laminate
sensitive
Prior art date
Application number
DK596887A
Other languages
English (en)
Other versions
DK596887D0 (da
Inventor
Shing Kang Chang
Leo Roos
Original Assignee
Thiokol Morton Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thiokol Morton Inc filed Critical Thiokol Morton Inc
Publication of DK596887D0 publication Critical patent/DK596887D0/da
Publication of DK596887A publication Critical patent/DK596887A/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/092—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
DK596887A 1986-11-14 1987-11-13 Fotofoelsomt laminat og dets anvendelse DK596887A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US93139686A 1986-11-14 1986-11-14

Publications (2)

Publication Number Publication Date
DK596887D0 DK596887D0 (da) 1987-11-13
DK596887A true DK596887A (da) 1988-05-15

Family

ID=25460721

Family Applications (1)

Application Number Title Priority Date Filing Date
DK596887A DK596887A (da) 1986-11-14 1987-11-13 Fotofoelsomt laminat og dets anvendelse

Country Status (6)

Country Link
EP (1) EP0267807A3 (da)
JP (1) JPS63197942A (da)
KR (1) KR880006965A (da)
AU (1) AU599166B2 (da)
DK (1) DK596887A (da)
IL (1) IL84298A0 (da)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1205802A4 (en) 1999-06-24 2009-07-15 Hitachi Chemical Co Ltd PHOTOSENSITIVE ELEMENT, PHOTOSENSITIVE ELEMENT ROLL, RESIN PATTERN MANUFACTURING METHOD, RESIN PATTERN, SUBSTRATE WITH RESILIENT RESIN PATTERN, WIRING PATTERN MANUFACTURING METHOD, AND WIRING PATTERN THEREFOR
FR2803246B1 (fr) * 1999-12-31 2002-11-29 Rollin Sa Plaque d'impression presentee en rouleau et procede d'obtention
TWI341788B (en) * 2004-07-06 2011-05-11 Fujifilm Corp Apparatus for and method of manufacturing photosensitive laminated body
WO2008075575A1 (ja) 2006-12-19 2008-06-26 Hitachi Chemical Company, Ltd. 感光性エレメント
US8092980B2 (en) 2007-01-31 2012-01-10 Hitachi Chemical Company, Ltd. Photosensitive element
MY167509A (en) * 2007-10-25 2018-09-04 Kolon Inc Film tyoe transfer material
WO2009054705A2 (en) * 2007-10-25 2009-04-30 Kolon Industries, Inc. Film type transfer material
CN107422606A (zh) 2010-12-16 2017-12-01 日立化成株式会社 感光性元件、抗蚀图案的形成方法以及印刷布线板的制造方法
CN102799070B (zh) * 2012-08-27 2014-03-05 珠海市能动科技光学产业有限公司 双层涂布的负性光致抗蚀干膜
JP6043693B2 (ja) * 2012-10-19 2016-12-14 富士フイルム株式会社 保護膜形成用の樹脂組成物、保護膜、パターン形成方法、電子デバイスの製造方法及び電子デバイス
CN110312965A (zh) * 2017-03-30 2019-10-08 富士胶片株式会社 感光性转印材料以及电路配线的制造方法
WO2019187365A1 (ja) * 2018-03-29 2019-10-03 富士フイルム株式会社 感光性転写材料、感光性転写材料の製造方法、レジストパターンの製造方法、回路配線の製造方法、タッチパネル、及び、タッチパネル表示装置
JP7011046B2 (ja) * 2018-03-29 2022-01-26 富士フイルム株式会社 感光性転写材料、レジストパターンの製造方法、回路配線の製造方法、タッチパネル、及び、タッチパネル表示装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3388995A (en) * 1964-08-10 1968-06-18 Gen Aniline & Film Corp Photopolymer offset printing plates
DE2106574A1 (de) * 1970-03-03 1971-09-23 Shpley Co Inc Lichtempfindliches Laminat
JPS56140341A (en) * 1980-04-04 1981-11-02 Muromachi Kagaku Kogyo Kk Photosensitive laminate

Also Published As

Publication number Publication date
AU599166B2 (en) 1990-07-12
EP0267807A3 (en) 1990-08-01
KR880006965A (ko) 1988-07-25
IL84298A0 (en) 1988-03-31
AU8120887A (en) 1988-05-19
DK596887D0 (da) 1987-11-13
JPS63197942A (ja) 1988-08-16
EP0267807A2 (en) 1988-05-18

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Legal Events

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