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DK56288D0 - RESINTS THAT CAN BE CURRENTLY RADIATED, METHOD OF PRODUCING THEREOF AND THEIR USE - Google Patents

RESINTS THAT CAN BE CURRENTLY RADIATED, METHOD OF PRODUCING THEREOF AND THEIR USE

Info

Publication number
DK56288D0
DK56288D0 DK56288A DK56288A DK56288D0 DK 56288 D0 DK56288 D0 DK 56288D0 DK 56288 A DK56288 A DK 56288A DK 56288 A DK56288 A DK 56288A DK 56288 D0 DK56288 D0 DK 56288D0
Authority
DK
Denmark
Prior art keywords
resints
producing
radiated
currently
currently radiated
Prior art date
Application number
DK56288A
Other languages
Danish (da)
Other versions
DK56288A (en
Inventor
Alfred Mathes
Original Assignee
Ruetgerswerke Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ruetgerswerke Ag filed Critical Ruetgerswerke Ag
Publication of DK56288D0 publication Critical patent/DK56288D0/en
Publication of DK56288A publication Critical patent/DK56288A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
DK56288A 1987-02-11 1988-02-04 RESINTS THAT CAN BE CURRENTLY RADIATED, METHOD OF PRODUCING THEREOF AND THEIR USE DK56288A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873704149 DE3704149A1 (en) 1987-02-11 1987-02-11 Radiation-curable resins, process for their preparation, and their use

Publications (2)

Publication Number Publication Date
DK56288D0 true DK56288D0 (en) 1988-02-04
DK56288A DK56288A (en) 1988-08-12

Family

ID=6320703

Family Applications (1)

Application Number Title Priority Date Filing Date
DK56288A DK56288A (en) 1987-02-11 1988-02-04 RESINTS THAT CAN BE CURRENTLY RADIATED, METHOD OF PRODUCING THEREOF AND THEIR USE

Country Status (4)

Country Link
DE (1) DE3704149A1 (en)
DK (1) DK56288A (en)
NO (1) NO169720C (en)
SE (2) SE469474B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0365844A3 (en) * 1988-10-28 1991-02-06 Siemens Aktiengesellschaft Easily curable photoresist
DE4038895C2 (en) * 1990-12-06 1998-07-02 Harald Dr Mueller Mixtures sensitive to light and radiation
JP3331222B2 (en) * 1992-02-27 2002-10-07 ジャパンエポキシレジン株式会社 Epoxy resin and epoxy resin composition
KR100342950B1 (en) * 1997-11-11 2002-10-19 가부시키가이샤 닛폰 쇼쿠바이 Curable Resin and Resin Composition
CN100358953C (en) * 2005-05-23 2008-01-02 容大油墨（惠州）有限公司 A kind of liquid photosensitive solder resist ink and its circuit board
JP6557155B2 (en) 2015-02-02 2019-08-07 株式会社日本触媒 Curable resin and method for producing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3230560A1 (en) * 1981-08-20 1983-05-05 Hussain Kashif Dr. 8003 Zürich El-Ghatta Polymers, and a process for their preparation
DE3565546D1 (en) * 1984-06-29 1988-11-17 Siemens Ag Thermostable and irradiation-curable polymer system based on bisphenol and epichlorohydrine, and method for its preparation

Also Published As

Publication number Publication date
NO880592D0 (en) 1988-02-10
NO169720B (en) 1992-04-21
SE9102977D0 (en) 1991-10-14
DE3704149A1 (en) 1988-08-25
NO880592L (en) 1988-08-12
SE8800023D0 (en) 1988-01-07
DE3704149C2 (en) 1990-09-27
SE469474B (en) 1993-07-12
NO169720C (en) 1992-07-29
DK56288A (en) 1988-08-12
SE9102977L (en) 1993-04-15

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Legal Events

Date Code Title Description
AHB Application shelved due to non-payment