[go: up one dir, main page]

DK3426745T3 - Materialer til anvendelse som klæbemiddel og til overfladeforsegling - Google Patents

Materialer til anvendelse som klæbemiddel og til overfladeforsegling Download PDF

Info

Publication number
DK3426745T3
DK3426745T3 DK17709120.4T DK17709120T DK3426745T3 DK 3426745 T3 DK3426745 T3 DK 3426745T3 DK 17709120 T DK17709120 T DK 17709120T DK 3426745 T3 DK3426745 T3 DK 3426745T3
Authority
DK
Denmark
Prior art keywords
adhesive
materials
surface sealing
sealing
Prior art date
Application number
DK17709120.4T
Other languages
English (en)
Inventor
Heike Schneider
Stefan Pfeifer
Ralf Kockler
Klaus Endres
Original Assignee
Epg Eng Nanoprod Germany Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epg Eng Nanoprod Germany Ag filed Critical Epg Eng Nanoprod Germany Ag
Application granted granted Critical
Publication of DK3426745T3 publication Critical patent/DK3426745T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J187/00—Adhesives based on unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Paints Or Removers (AREA)
DK17709120.4T 2016-03-11 2017-03-10 Materialer til anvendelse som klæbemiddel og til overfladeforsegling DK3426745T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP16159974 2016-03-11
PCT/EP2017/055681 WO2017153576A1 (de) 2016-03-11 2017-03-10 Materialien zur verwendung als klebstoff und zur oberflächenversiegelung

Publications (1)

Publication Number Publication Date
DK3426745T3 true DK3426745T3 (da) 2022-03-07

Family

ID=55650104

Family Applications (1)

Application Number Title Priority Date Filing Date
DK17709120.4T DK3426745T3 (da) 2016-03-11 2017-03-10 Materialer til anvendelse som klæbemiddel og til overfladeforsegling

Country Status (8)

Country Link
US (1) US11505729B2 (da)
EP (1) EP3426745B1 (da)
CA (1) CA3016952A1 (da)
DK (1) DK3426745T3 (da)
MX (1) MX2018010934A (da)
SA (1) SA518392375B1 (da)
SI (1) SI3426745T1 (da)
WO (1) WO2017153576A1 (da)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110591471B (zh) * 2019-09-27 2021-06-08 新恒东薄膜材料（常州）有限公司 一种增强透明pi基材表面附着力的预涂液及其应用方法
CN112592666B (zh) * 2020-12-16 2022-11-25 康达新材料(集团)股份有限公司 一种耐360℃高温环氧胶黏剂及其制备方法及应用
CN113463397B (zh) * 2021-07-27 2022-04-08 哈尔滨工业大学 一种自修复环氧树脂及自修复环氧树脂/碳纤维复合材料的制备方法
CN114231228B (zh) * 2021-11-01 2022-10-25 北京理工大学 磁流变修复材料、其制备方法及输油管道修复方法
DE102021129372A1 (de) 2021-11-11 2023-05-11 Thyssenkrupp Steel Europe Ag Verfahren zum Verkleben von Blechbauteilen
CN116162432A (zh) * 2022-12-08 2023-05-26 北京天山新材料技术有限公司 双组分改性硅烷胶粘剂及其应用
CN116285879A (zh) * 2023-02-20 2023-06-23 佛山市恒洁凯乐德卫浴有限公司 封边胶、银镜封边工艺以及银镜

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5102960A (en) * 1989-09-11 1992-04-07 Bayer Aktiengesellschaft Silicon-epoxy resin composition
JPH0578622A (ja) 1991-03-22 1993-03-30 Toshiba Silicone Co Ltd プライマー組成物
JPH05179209A (ja) * 1991-12-26 1993-07-20 Sumitomo Bakelite Co Ltd 熱圧着可能な高熱伝導性フィルム状接着剤
DE19714949A1 (de) 1997-04-10 1998-10-15 Inst Neue Mat Gemein Gmbh Verfahren zum Versehen einer metallischen Oberfläche mit einer glasartigen Schicht
DE19924138A1 (de) 1999-05-26 2000-11-30 Henkel Kgaa Lösbare Klebeverbindungen
JP4378577B2 (ja) * 1999-06-08 2009-12-09 日立化成工業株式会社 耐熱性樹脂組成物、これを用いた接着フィルム及び接着層付ポリイミドフィルム
WO2001064804A1 (en) * 2000-02-28 2001-09-07 Adsil, Lc Silane-based, coating compositions, coated articles obtained therefrom and methods of using same
DE102004001097B4 (de) 2004-01-05 2014-06-05 Epg (Engineered Nanoproducts Germany) Ag Metallische Substrate mit verformbarer glasartiger Beschichtung
US7205049B2 (en) 2004-04-16 2007-04-17 Tioxoclean Inc. Metal peroxide films
US7790276B2 (en) * 2006-03-31 2010-09-07 E. I. Du Pont De Nemours And Company Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto
DE102006038593A1 (de) * 2006-08-17 2008-02-21 Siemens Ag Selbstreinigende Oberflächenbeschichtung (Photokatalyse)
DE102011001833B4 (de) 2011-04-06 2024-03-14 Elantas Gmbh Beschichtungsmaterial, dessen Verwendung und Verfahren zur Beschichtung von Feinstdrähten
JP5485945B2 (ja) 2011-06-03 2014-05-07 信越化学工業株式会社 接着性オルガノポリシロキサン組成物
CN102532556A (zh) * 2011-11-17 2012-07-04 杭州师范大学 一种制备有机硅改性环氧树脂的化学方法
CN102732209B (zh) * 2012-07-06 2014-01-08 郑州大学 常温固化耐高温柔性胶黏剂及其制备方法
CN104004482A (zh) * 2014-06-13 2014-08-27 江苏悦达新材料科技有限公司 一种环氧/有机硅/石墨烯杂化高导热胶粘剂及其制备方法
CN104893649A (zh) * 2015-07-02 2015-09-09 苏州云舒新材料科技有限公司 一种耐热固体复合胶
EP3461936A1 (en) * 2017-09-28 2019-04-03 Helmholtz-Zentrum Geesthacht Zentrum für Material- und Küstenforschung GmbH Highly elastic lactide-based polymer blend, object made from the polymer blend and method of producing the object

Also Published As

Publication number Publication date
CA3016952A1 (en) 2017-09-14
RU2018135695A3 (da) 2020-07-07
US20190023955A1 (en) 2019-01-24
US11505729B2 (en) 2022-11-22
SA518392375B1 (ar) 2022-09-18
RU2018135695A (ru) 2020-04-13
EP3426745A1 (de) 2019-01-16
EP3426745B1 (de) 2021-12-01
SI3426745T1 (sl) 2022-04-29
MX2018010934A (es) 2019-03-28
WO2017153576A1 (de) 2017-09-14

Similar Documents

Publication Publication Date Title
EP3675205A4 (en) WATERPROOF PLATE
DK3490565T3 (da) Azetidinderivater som chemokinreceptormodulatorer og anvendelser deraf
DK3484865T3 (da) Somatostatinmodulatorer og anvendelser deraf
DK3426745T3 (da) Materialer til anvendelse som klæbemiddel og til overfladeforsegling
EP3734123A4 (en) WATERPROOFING DEVICE
DK3131902T3 (da) Forbindelser som ROR-gamma-modulatorer
DK3538528T3 (da) Pyrrolamider som alpha v-integrinhæmmere
EP3401377A4 (en) PHOTOREVERSIBLE LIABILIZER
EP3546806A4 (en) WATERPROOFING DEVICE
EP3453905C0 (en) SEALING DEVICE
EP3527642A4 (en) Adhesive composition
EP3505799A4 (en) SEALING DEVICE
DK3227483T3 (da) Elastisk stof og fremgangsmåde til fremstilling
DK3091946T3 (da) Film til ledeplade til urostomipose og pose under anvendelse deraf
DK3596363T3 (da) Tætningsanordning
KR20180085009A (ko) 실리콘 감압 접착제 조성물
EP3719097A4 (en) WATERPROOFING SHEET
FI20155944A (fi) Pintakalvo ja pintakalvon käsittävä tarra
EP3587872A4 (en) WATERPROOFING DEVICE
DK2982821T3 (da) Tætningselement og fremgangsmåde til dets fremstilling
EP3536756A4 (en) LIABILITY
DK3411361T3 (da) Nrf2-aktiverende forbindelser og anvendelser deraf
DK3411368T3 (da) Nrf2-aktiverende forbindelser og anvendelser deraf
KR20180085013A (ko) 접착제 조성물
DK3712162T3 (da) Smac-mimetica anvendt som iap-inhibitorer og anvendelse deraf