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DK3414367T3 - Fosfordoteret siliciumenkeltkrystal - Google Patents

Fosfordoteret siliciumenkeltkrystal Download PDF

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Publication number
DK3414367T3
DK3414367T3 DK17703166.3T DK17703166T DK3414367T3 DK 3414367 T3 DK3414367 T3 DK 3414367T3 DK 17703166 T DK17703166 T DK 17703166T DK 3414367 T3 DK3414367 T3 DK 3414367T3
Authority
DK
Denmark
Prior art keywords
phosphoroused
single crystal
silicone single
silicone
crystal
Prior art date
Application number
DK17703166.3T
Other languages
English (en)
Inventor
Theis Leth Sveigaard
Christian Gammeltoft Hindrichsen
Sune Bo Duun
Anders Lei
Martin Græsvænge
Original Assignee
Topsil Globalwafers As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Topsil Globalwafers As filed Critical Topsil Globalwafers As
Application granted granted Critical
Publication of DK3414367T3 publication Critical patent/DK3414367T3/da

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Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/08Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state the diffusion materials being a compound of the elements to be diffused
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/20Doping by irradiation with electromagnetic waves or by particle radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/261Bombardment with radiation to produce a nuclear reaction transmuting chemical elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/60Impurity distributions or concentrations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Toxicology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
DK17703166.3T 2016-02-08 2017-02-08 Fosfordoteret siliciumenkeltkrystal DK3414367T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP16154695 2016-02-08
PCT/EP2017/052754 WO2017137438A1 (en) 2016-02-08 2017-02-08 A phosphorus doped silicon single crystal

Publications (1)

Publication Number Publication Date
DK3414367T3 true DK3414367T3 (da) 2020-05-25

Family

ID=55411172

Family Applications (1)

Application Number Title Priority Date Filing Date
DK17703166.3T DK3414367T3 (da) 2016-02-08 2017-02-08 Fosfordoteret siliciumenkeltkrystal

Country Status (5)

Country Link
EP (1) EP3414367B1 (da)
JP (1) JP6808757B2 (da)
CN (1) CN108699724B (da)
DK (1) DK3414367T3 (da)
WO (1) WO2017137438A1 (da)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10468148B2 (en) * 2017-04-24 2019-11-05 Infineon Technologies Ag Apparatus and method for neutron transmutation doping of semiconductor wafers
JP7010179B2 (ja) * 2018-09-03 2022-01-26 株式会社Sumco 単結晶の製造方法及び装置及びシリコン単結晶インゴット
US11739437B2 (en) * 2018-12-27 2023-08-29 Globalwafers Co., Ltd. Resistivity stabilization measurement of fat neck slabs for high resistivity and ultra-high resistivity single crystal silicon ingot growth
CN111341838B (zh) * 2020-03-09 2021-05-07 华东师范大学 硅同位素Si-30在抗中高能中子辐射半导体材料或半导体器件的应用
CN115279954A (zh) * 2020-03-12 2022-11-01 尤米科尔公司 重掺杂n型锗
JP7342845B2 (ja) * 2020-11-25 2023-09-12 株式会社Sumco シリコン単結晶の製造方法
CN114990693A (zh) * 2022-04-02 2022-09-02 天津中环领先材料技术有限公司 一种ntd单晶硅退火工艺
EP4350055A1 (de) * 2022-10-06 2024-04-10 Siltronic AG Verfahren zur herstellung eines einkristalls aus silizium und halbleiterscheibe aus einkristallinem silizium
CN118422319A (zh) * 2024-05-27 2024-08-02 宁夏中欣晶圆半导体科技有限公司 高电阻率单晶材料的制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5904767A (en) * 1996-08-29 1999-05-18 Industrial Technology Research Institute Neutron transmutation doping of silicon single crystals
DE19738732A1 (de) * 1997-09-04 1999-03-18 Wacker Siltronic Halbleitermat Neutronendotierte Siliciumscheiben
DE10137856B4 (de) 2001-08-02 2007-12-13 Siltronic Ag Durch tiegelloses Zonenziehen hergestellter Einkristall aus Silicium
JP2005012090A (ja) * 2003-06-20 2005-01-13 Toshiba Corp 半導体ウェーハの製造方法及び半導体装置の製造方法
JP2005035816A (ja) * 2003-07-17 2005-02-10 Shin Etsu Handotai Co Ltd シリコン単結晶製造方法及びシリコン単結晶
CN1325701C (zh) * 2006-04-26 2007-07-11 天津市环欧半导体材料技术有限公司 气相预掺杂和中子辐照掺杂组合的区熔硅单晶的生产方法
WO2008125104A1 (en) 2007-04-13 2008-10-23 Topsil Simiconductor Materials A/S Method and apparatus for producing a single crystal
JP2008308383A (ja) * 2007-06-18 2008-12-25 Covalent Materials Corp シリコン単結晶の製造方法
JP5283543B2 (ja) * 2009-03-09 2013-09-04 株式会社Sumco シリコン単結晶の育成方法
JP5201077B2 (ja) * 2009-05-15 2013-06-05 株式会社Sumco シリコンウェーハの製造方法
JP5194146B2 (ja) * 2010-12-28 2013-05-08 ジルトロニック アクチエンゲゼルシャフト シリコン単結晶の製造方法、シリコン単結晶、およびウエハ
CN102534752A (zh) * 2012-03-08 2012-07-04 天津市环欧半导体材料技术有限公司 一种制造区熔硅单晶的直拉区熔气掺法
JP5880353B2 (ja) 2012-08-28 2016-03-09 信越半導体株式会社 シリコン単結晶の育成方法
JP5921498B2 (ja) 2013-07-12 2016-05-24 グローバルウェーハズ・ジャパン株式会社 シリコン単結晶の製造方法

Also Published As

Publication number Publication date
JP6808757B2 (ja) 2021-01-06
EP3414367A1 (en) 2018-12-19
JP2019504817A (ja) 2019-02-21
EP3414367B1 (en) 2020-02-26
WO2017137438A1 (en) 2017-08-17
CN108699724B (zh) 2021-05-04
CN108699724A (zh) 2018-10-23

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