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DK2350357T3 - SUBSTRATE HOLDS TO KEEP A LEADING SUBSTRATE DURING PLATING THEREOF - Google Patents

SUBSTRATE HOLDS TO KEEP A LEADING SUBSTRATE DURING PLATING THEREOF Download PDF

Info

Publication number
DK2350357T3
DK2350357T3 DK08875022T DK08875022T DK2350357T3 DK 2350357 T3 DK2350357 T3 DK 2350357T3 DK 08875022 T DK08875022 T DK 08875022T DK 08875022 T DK08875022 T DK 08875022T DK 2350357 T3 DK2350357 T3 DK 2350357T3
Authority
DK
Denmark
Prior art keywords
substrate
keep
leading
during plating
holds
Prior art date
Application number
DK08875022T
Other languages
Danish (da)
Inventor
Mikael Fredenberg
Patrik Möller
Original Assignee
Luxembourg Institute Of Science And Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Luxembourg Institute Of Science And Tech filed Critical Luxembourg Institute Of Science And Tech
Application granted granted Critical
Publication of DK2350357T3 publication Critical patent/DK2350357T3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
DK08875022T 2008-11-14 2008-11-14 SUBSTRATE HOLDS TO KEEP A LEADING SUBSTRATE DURING PLATING THEREOF DK2350357T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2008/009658 WO2010054677A1 (en) 2008-11-14 2008-11-14 A system for plating a conductive substrate, and a substrate holder for holding a conductive substrate during plating thereof

Publications (1)

Publication Number Publication Date
DK2350357T3 true DK2350357T3 (en) 2019-11-25

Family

ID=40810546

Family Applications (1)

Application Number Title Priority Date Filing Date
DK08875022T DK2350357T3 (en) 2008-11-14 2008-11-14 SUBSTRATE HOLDS TO KEEP A LEADING SUBSTRATE DURING PLATING THEREOF

Country Status (8)

Country Link
US (1) US20110278162A1 (en)
EP (1) EP2350357B1 (en)
JP (1) JP5469178B2 (en)
KR (1) KR20110088571A (en)
CN (1) CN102257186B (en)
DK (1) DK2350357T3 (en)
TW (1) TWI468552B (en)
WO (1) WO2010054677A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009021561A1 (en) * 2009-05-15 2010-11-18 Rolls-Royce Deutschland Ltd & Co Kg Method and apparatus for surface etching of integrally bladed rotors
US9653339B2 (en) 2010-02-16 2017-05-16 Deca Technologies Inc. Integrated shielding for wafer plating
ES2592708T3 (en) * 2010-07-15 2016-12-01 Luxembourg Institute Of Science And Technology (List) A contact sheet for the arrangement between a clamp and a master electrode in an ECPR process
KR101181983B1 (en) 2010-08-04 2012-09-11 삼성전기주식회사 Jig for electroplating of printed circuit board and method of electro plating using the same
US8317987B2 (en) * 2010-09-23 2012-11-27 Sunpower Corporation Non-permeable substrate carrier for electroplating
TWI580814B (en) 2010-10-21 2017-05-01 荏原製作所股份有限公司 Substrate processing apparatus, and plating apparatus and plating method
JP5750327B2 (en) * 2010-10-21 2015-07-22 株式会社荏原製作所 Plating apparatus, plating processing method, and attitude changing method of substrate holder for plating apparatus
JP2014080645A (en) * 2012-10-15 2014-05-08 I Plant:Kk Substrate holding device
US10373839B2 (en) * 2013-09-11 2019-08-06 Infineon Technologies Ag Wafer contacting device, and arrangement and method for electrochemical etching of a wafer
US20150147883A1 (en) * 2013-11-22 2015-05-28 Taiwan Semiconductor Manufacturing Company, Ltd. Post-CMP Cleaning and Apparatus for Performing the Same
CN104975338B (en) * 2014-04-02 2018-09-07 盛美半导体设备（上海）有限公司 The metal anode and its sealing structure of electrochemical polish
EP3156523B1 (en) * 2014-06-11 2019-03-27 Shanghai Meishan Iron & steel Co., Ltd. Continuous electroplating test device simulating different linear speeds of band steel
PT3034657T (en) * 2014-12-19 2019-05-31 Atotech Deutschland Gmbh Substrate holder for vertical galvanic metal deposition
TWI570280B (en) * 2015-12-16 2017-02-11 茂迪股份有限公司 Electroplating cathode fixture and electroplating device for a solar cell
JP6596372B2 (en) * 2016-03-22 2019-10-23 株式会社荏原製作所 Substrate holder and plating apparatus
JP6713863B2 (en) * 2016-07-13 2020-06-24 株式会社荏原製作所 Substrate holder and plating apparatus using the same
JP6621721B2 (en) * 2016-08-31 2019-12-18 株式会社多加良製作所 Flat plate jig, resin molding apparatus and resin molding method
JP6963524B2 (en) * 2018-03-20 2021-11-10 キオクシア株式会社 Electroplating equipment
CN111663161B (en) * 2020-07-16 2024-03-12 合肥微睿科技股份有限公司 Hanger for anodic oxidation of large-size upper electrode plate
CN113882004B (en) * 2021-10-28 2023-04-21 京东方科技集团股份有限公司 Substrate carrier and electrochemical deposition apparatus
TWI863231B (en) * 2023-04-24 2024-11-21 天虹科技股份有限公司 Method of replacing periodic maintenance with plasma assisted process

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2737416B2 (en) * 1991-01-31 1998-04-08 日本電気株式会社 Plating equipment
JPH05166815A (en) * 1991-12-16 1993-07-02 Matsushita Electron Corp Plating bump formation method and wafer plating jigs adopted
US6322678B1 (en) * 1998-07-11 2001-11-27 Semitool, Inc. Electroplating reactor including back-side electrical contact apparatus
US6106680A (en) * 1999-01-26 2000-08-22 Amd Apparatus for forming a copper interconnect
JP2001316870A (en) * 2000-05-08 2001-11-16 Tokyo Electron Ltd Apparatus and method for liquid treatment
SE523309E (en) * 2001-06-15 2010-03-02 Replisaurus Technologies Ab Method, electrode and apparatus for creating micro- and nanostructures in conductive materials by patterning with master electrode and electrolyte
JP2003268594A (en) * 2002-03-12 2003-09-25 Hitachi Kyowa Engineering Co Ltd Method and equipment for electroplating onto substrate, and substrate
US7067045B2 (en) * 2002-10-18 2006-06-27 Applied Materials, Inc. Method and apparatus for sealing electrical contacts during an electrochemical deposition process
JP2005133113A (en) * 2003-10-28 2005-05-26 Fujitsu Ltd Plating equipment
JP4937655B2 (en) * 2006-07-18 2012-05-23 株式会社東設 Electroplating equipment

Also Published As

Publication number Publication date
WO2010054677A1 (en) 2010-05-20
US20110278162A1 (en) 2011-11-17
KR20110088571A (en) 2011-08-03
JP2012508814A (en) 2012-04-12
EP2350357A1 (en) 2011-08-03
CN102257186B (en) 2014-10-15
CN102257186A (en) 2011-11-23
TW201020344A (en) 2010-06-01
JP5469178B2 (en) 2014-04-09
TWI468552B (en) 2015-01-11
EP2350357B1 (en) 2019-08-21

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