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DK1772902T3 - Power semiconductor module with insulating intermediate layer and method of manufacture thereof - Google Patents

Power semiconductor module with insulating intermediate layer and method of manufacture thereof

Info

Publication number
DK1772902T3
DK1772902T3 DK06020798T DK06020798T DK1772902T3 DK 1772902 T3 DK1772902 T3 DK 1772902T3 DK 06020798 T DK06020798 T DK 06020798T DK 06020798 T DK06020798 T DK 06020798T DK 1772902 T3 DK1772902 T3 DK 1772902T3
Authority
DK
Denmark
Prior art keywords
power semiconductor
semiconductor module
manufacture
intermediate layer
insulating intermediate
Prior art date
Application number
DK06020798T
Other languages
Danish (da)
Inventor
Heinrich Dr Heilbronner
Harald Dr Kobolla
Original Assignee
Semikron Elektronik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh filed Critical Semikron Elektronik Gmbh
Application granted granted Critical
Publication of DK1772902T3 publication Critical patent/DK1772902T3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8384—Sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

Power semiconductor module comprises a housing, connecting elements and an electrically insulated substrate arranged within the housing and semiconductor components (70) with a connecting element and an insulating molded body (80). The substrate comprises an insulated body (54) and connecting pathways (52) facing the inside of the module. A connection between a semiconductor component and a connecting element or between the semiconductor component and the connecting pathway is a pressure sintered connection. An independent claim is also included for a method for the production of a power semiconductor module.
DK06020798T 2005-10-05 2006-10-04 Power semiconductor module with insulating intermediate layer and method of manufacture thereof DK1772902T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005047567A DE102005047567B3 (en) 2005-10-05 2005-10-05 Power semiconductor module comprises a housing, connecting elements and an electrically insulated substrate arranged within the housing and semiconductor components with a connecting element and an insulating molded body

Publications (1)

Publication Number Publication Date
DK1772902T3 true DK1772902T3 (en) 2009-01-19

Family

ID=37625994

Family Applications (1)

Application Number Title Priority Date Filing Date
DK06020798T DK1772902T3 (en) 2005-10-05 2006-10-04 Power semiconductor module with insulating intermediate layer and method of manufacture thereof

Country Status (6)

Country Link
EP (1) EP1772902B1 (en)
JP (1) JP5291872B2 (en)
AT (1) ATE408898T1 (en)
DE (2) DE102005047567B3 (en)
DK (1) DK1772902T3 (en)
ES (1) ES2314804T3 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007006706B4 (en) * 2007-02-10 2011-05-26 Semikron Elektronik Gmbh & Co. Kg Circuit arrangement with connecting device and manufacturing method thereof
DE102007022336A1 (en) 2007-05-12 2008-11-20 Semikron Elektronik Gmbh & Co. Kg Power semiconductor substrate with metal contact layer and manufacturing method thereof
DE102007057346B3 (en) * 2007-11-28 2009-06-10 Fachhochschule Kiel Laminated power electronics module
DE102008017454B4 (en) 2008-04-05 2010-02-04 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module with hermetically sealed circuit arrangement and manufacturing method for this purpose
DE102008033410B4 (en) * 2008-07-16 2011-06-30 SEMIKRON Elektronik GmbH & Co. KG, 90431 Power electronic connection device with a power semiconductor component and manufacturing method for this purpose
DE102008040488A1 (en) * 2008-07-17 2010-01-21 Robert Bosch Gmbh Electronic assembly and method of making the same
DE102009024371B4 (en) * 2009-06-09 2013-09-19 Semikron Elektronik Gmbh & Co. Kg Method for producing a converter arrangement with cooling device and converter arrangement
DE102009024385B4 (en) * 2009-06-09 2011-03-17 Semikron Elektronik Gmbh & Co. Kg Method for producing a power semiconductor module and power semiconductor module with a connection device
JP5842489B2 (en) * 2011-09-14 2016-01-13 三菱電機株式会社 Semiconductor device
DE102011083911A1 (en) * 2011-09-30 2013-04-04 Robert Bosch Gmbh Electronic assembly with high-temperature-stable substrate base material
DE102012222012B4 (en) 2012-11-30 2017-04-06 Semikron Elektronik Gmbh & Co. Kg Power semiconductor device and a method for producing a power semiconductor device
DE102013108185B4 (en) * 2013-07-31 2021-09-23 Semikron Elektronik Gmbh & Co. Kg Method for producing a power electronic switching device and power electronic switching device
DE102014109779A1 (en) * 2014-06-13 2015-12-17 Osram Opto Semiconductors Gmbh Method for producing an assembly with a component
DE102015109856A1 (en) * 2015-06-19 2016-12-22 Danfoss Silicon Power Gmbh Method for producing a suitable for the connection of an electrical conductor metallic contact surface for contacting a power semiconductor, power semiconductor, bond buffer and method for producing a power semiconductor
DE102019126623B4 (en) 2019-10-02 2024-03-14 Semikron Elektronik Gmbh & Co. Kg Patentabteilung Power electronic switching device with a casting compound

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3414065A1 (en) * 1984-04-13 1985-12-12 Siemens AG, 1000 Berlin und 8000 München Configuration comprising at least one electronic component fixed on a substrate, and process for fabricating a configuration of this type
US4657322A (en) * 1985-10-01 1987-04-14 Tektronix, Inc. Microwave interconnect
JPH08107266A (en) * 1994-10-04 1996-04-23 Cmk Corp Printed wiring board
DE19617055C1 (en) * 1996-04-29 1997-06-26 Semikron Elektronik Gmbh High-density multilayer prepreg semiconductor power module
DE10121970B4 (en) * 2001-05-05 2004-05-27 Semikron Elektronik Gmbh Power semiconductor module in pressure contact
DE10342295B4 (en) * 2003-09-12 2012-02-02 Infineon Technologies Ag Arrangement of an electrical component with an electrical insulation film on a substrate and method for producing the arrangement
EP1538667A3 (en) * 2003-12-06 2007-04-18 LuK Lamellen und Kupplungsbau Beteiligungs KG Electronic apparatus with electrically isolated metallic heat transfer body
DE102004019567B3 (en) * 2004-04-22 2006-01-12 Semikron Elektronik Gmbh & Co. Kg Securing electronic components to substrate by subjecting the electronic component, supporting film and paste-like layer to pressure and connecting the substrate and the component by sintering

Also Published As

Publication number Publication date
DE102005047567B3 (en) 2007-03-29
DE502006001588D1 (en) 2008-10-30
JP2007103948A (en) 2007-04-19
EP1772902A1 (en) 2007-04-11
JP5291872B2 (en) 2013-09-18
EP1772902B1 (en) 2008-09-17
ES2314804T3 (en) 2009-03-16
ATE408898T1 (en) 2008-10-15

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