[go: up one dir, main page]

DK137382A - Elektrolyt og fremgangsmaade til elektroafsaetning af kobber - Google Patents

Elektrolyt og fremgangsmaade til elektroafsaetning af kobber Download PDF

Info

Publication number
DK137382A
DK137382A DK137382A DK137382A DK137382A DK 137382 A DK137382 A DK 137382A DK 137382 A DK137382 A DK 137382A DK 137382 A DK137382 A DK 137382A DK 137382 A DK137382 A DK 137382A
Authority
DK
Denmark
Prior art keywords
electroposition
electrolytes
copper
methods
Prior art date
Application number
DK137382A
Other languages
English (en)
Inventor
L J Mayer
S C Barbieri
Original Assignee
Hooker Chemicals Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hooker Chemicals Plastics Corp filed Critical Hooker Chemicals Plastics Corp
Publication of DK137382A publication Critical patent/DK137382A/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DK137382A 1981-03-26 1982-03-25 Elektrolyt og fremgangsmaade til elektroafsaetning af kobber DK137382A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/247,577 US4336114A (en) 1981-03-26 1981-03-26 Electrodeposition of bright copper

Publications (1)

Publication Number Publication Date
DK137382A true DK137382A (da) 1982-09-27

Family

ID=22935434

Family Applications (1)

Application Number Title Priority Date Filing Date
DK137382A DK137382A (da) 1981-03-26 1982-03-25 Elektrolyt og fremgangsmaade til elektroafsaetning af kobber

Country Status (14)

Country Link
US (1) US4336114A (da)
JP (1) JPS57188693A (da)
AU (1) AU530827B2 (da)
BE (1) BE892639A (da)
BR (1) BR8201708A (da)
CH (1) CH650278A5 (da)
DE (1) DE3210286A1 (da)
DK (1) DK137382A (da)
ES (1) ES510803A0 (da)
FR (1) FR2502648A1 (da)
GB (1) GB2097020B (da)
IT (1) IT1147927B (da)
NL (1) NL8201279A (da)
SE (1) SE8201310L (da)

Families Citing this family (107)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3323476A1 (de) * 1982-07-01 1984-01-05 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
AU554236B2 (en) * 1983-06-10 1986-08-14 Omi International Corp. Electrolyte composition and process for electrodepositing copper
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
DE3836521C2 (de) * 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades
EP0419845A3 (en) * 1989-09-05 1991-11-13 General Electric Company Method for preparing metallized polyimide composites
DE59700942D1 (de) * 1990-03-19 2000-02-10 Atotech Deutschland Gmbh Wässriges, saures Bad zur galvanischen Abscheidung von glänzenden und rissfreien Kupferüberzügen und Verwendung dieses Bades
US6375741B2 (en) * 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
US6203582B1 (en) * 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US6276072B1 (en) * 1997-07-10 2001-08-21 Applied Materials, Inc. Method and apparatus for heating and cooling substrates
US6936153B1 (en) 1997-09-30 2005-08-30 Semitool, Inc. Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face
US6454926B1 (en) 1997-09-30 2002-09-24 Semitool Inc. Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas
US7244677B2 (en) * 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
EP1019954B1 (en) 1998-02-04 2013-05-15 Applied Materials, Inc. Method and apparatus for low-temperature annealing of electroplated copper micro-structures in the production of a microelectronic device
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
DE69929967T2 (de) * 1998-04-21 2007-05-24 Applied Materials, Inc., Santa Clara Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten
US6113771A (en) 1998-04-21 2000-09-05 Applied Materials, Inc. Electro deposition chemistry
US6416647B1 (en) 1998-04-21 2002-07-09 Applied Materials, Inc. Electro-chemical deposition cell for face-up processing of single semiconductor substrates
US6994776B2 (en) * 1998-06-01 2006-02-07 Semitool Inc. Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device
US6183622B1 (en) 1998-07-13 2001-02-06 Enthone-Omi, Inc. Ductility additives for electrorefining and electrowinning
US6267853B1 (en) 1999-07-09 2001-07-31 Applied Materials, Inc. Electro-chemical deposition system
US6290865B1 (en) 1998-11-30 2001-09-18 Applied Materials, Inc. Spin-rinse-drying process for electroplated semiconductor wafers
US6258220B1 (en) 1998-11-30 2001-07-10 Applied Materials, Inc. Electro-chemical deposition system
US6254760B1 (en) 1999-03-05 2001-07-03 Applied Materials, Inc. Electro-chemical deposition system and method
US6228233B1 (en) 1998-11-30 2001-05-08 Applied Materials, Inc. Inflatable compliant bladder assembly
US6379522B1 (en) 1999-01-11 2002-04-30 Applied Materials, Inc. Electrodeposition chemistry for filling of apertures with reflective metal
US6544399B1 (en) 1999-01-11 2003-04-08 Applied Materials, Inc. Electrodeposition chemistry for filling apertures with reflective metal
US6136163A (en) * 1999-03-05 2000-10-24 Applied Materials, Inc. Apparatus for electro-chemical deposition with thermal anneal chamber
US7192494B2 (en) * 1999-03-05 2007-03-20 Applied Materials, Inc. Method and apparatus for annealing copper films
US7109408B2 (en) * 1999-03-11 2006-09-19 Eneco, Inc. Solid state energy converter
US6571657B1 (en) 1999-04-08 2003-06-03 Applied Materials Inc. Multiple blade robot adjustment apparatus and associated method
US6837978B1 (en) 1999-04-08 2005-01-04 Applied Materials, Inc. Deposition uniformity control for electroplating apparatus, and associated method
US6551488B1 (en) * 1999-04-08 2003-04-22 Applied Materials, Inc. Segmenting of processing system into wet and dry areas
US6582578B1 (en) 1999-04-08 2003-06-24 Applied Materials, Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
US6551484B2 (en) 1999-04-08 2003-04-22 Applied Materials, Inc. Reverse voltage bias for electro-chemical plating system and method
US6585876B2 (en) 1999-04-08 2003-07-01 Applied Materials Inc. Flow diffuser to be used in electro-chemical plating system and method
US6557237B1 (en) 1999-04-08 2003-05-06 Applied Materials, Inc. Removable modular cell for electro-chemical plating and method
US6662673B1 (en) 1999-04-08 2003-12-16 Applied Materials, Inc. Linear motion apparatus and associated method
US6444110B2 (en) * 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
US20030213772A9 (en) * 1999-07-09 2003-11-20 Mok Yeuk-Fai Edwin Integrated semiconductor substrate bevel cleaning apparatus and method
US6516815B1 (en) 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
US6406609B1 (en) 2000-02-25 2002-06-18 Agere Systems Guardian Corp. Method of fabricating an integrated circuit
US6913680B1 (en) 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
US6808612B2 (en) 2000-05-23 2004-10-26 Applied Materials, Inc. Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
US20040079633A1 (en) * 2000-07-05 2004-04-29 Applied Materials, Inc. Apparatus for electro chemical deposition of copper metallization with the capability of in-situ thermal annealing
US6576110B2 (en) 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
US20020112964A1 (en) * 2000-07-12 2002-08-22 Applied Materials, Inc. Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths
US6436267B1 (en) 2000-08-29 2002-08-20 Applied Materials, Inc. Method for achieving copper fill of high aspect ratio interconnect features
KR100801908B1 (ko) * 2000-10-19 2008-02-12 아토테크 도이칠란드 게엠베하 구리 조 및 매트한 구리 코팅의 침착 방법
DE10058896C1 (de) * 2000-10-19 2002-06-13 Atotech Deutschland Gmbh Elektrolytisches Kupferbad, dessen Verwendung und Verfahren zur Abscheidung einer matten Kupferschicht
US6776893B1 (en) * 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
US6610189B2 (en) 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
US20040020780A1 (en) * 2001-01-18 2004-02-05 Hey H. Peter W. Immersion bias for use in electro-chemical plating system
US6478937B2 (en) 2001-01-19 2002-11-12 Applied Material, Inc. Substrate holder system with substrate extension apparatus and associated method
US6824612B2 (en) 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers
US20030146102A1 (en) * 2002-02-05 2003-08-07 Applied Materials, Inc. Method for forming copper interconnects
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
US6911136B2 (en) * 2002-04-29 2005-06-28 Applied Materials, Inc. Method for regulating the electrical power applied to a substrate during an immersion process
US7189313B2 (en) * 2002-05-09 2007-03-13 Applied Materials, Inc. Substrate support with fluid retention band
JP4115240B2 (ja) * 2002-10-21 2008-07-09 日鉱金属株式会社 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
JP4294593B2 (ja) * 2002-12-18 2009-07-15 日鉱金属株式会社 銅電解液およびそれにより製造された電解銅箔
US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
US7025861B2 (en) 2003-02-06 2006-04-11 Applied Materials Contact plating apparatus
US6851200B2 (en) * 2003-03-14 2005-02-08 Hopkins Manufacturing Corporation Reflecting lighted level
US20040200725A1 (en) * 2003-04-09 2004-10-14 Applied Materials Inc. Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process
US20040211657A1 (en) * 2003-04-11 2004-10-28 Ingelbrecht Hugo Gerard Eduard Method of purifying 2,6-xylenol and method of producing poly(arylene ether) therefrom
US7205153B2 (en) 2003-04-11 2007-04-17 Applied Materials, Inc. Analytical reagent for acid copper sulfate solutions
US20040206373A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Spin rinse dry cell
US7311810B2 (en) * 2003-04-18 2007-12-25 Applied Materials, Inc. Two position anneal chamber
US20040206628A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Electrical bias during wafer exit from electrolyte bath
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
US20050092601A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a diffusion member
US20050092602A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a membrane stack
US20050218000A1 (en) * 2004-04-06 2005-10-06 Applied Materials, Inc. Conditioning of contact leads for metal plating systems
US20050230262A1 (en) * 2004-04-20 2005-10-20 Semitool, Inc. Electrochemical methods for the formation of protective features on metallized features
US7285195B2 (en) * 2004-06-24 2007-10-23 Applied Materials, Inc. Electric field reducing thrust plate
TW200613586A (en) 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
TWI400365B (zh) * 2004-11-12 2013-07-01 Enthone 微電子裝置上的銅電沈積
US20060102467A1 (en) * 2004-11-15 2006-05-18 Harald Herchen Current collimation for thin seed and direct plating
US20060175201A1 (en) * 2005-02-07 2006-08-10 Hooman Hafezi Immersion process for electroplating applications
US20070014958A1 (en) * 2005-07-08 2007-01-18 Chaplin Ernest R Hanger labels, label assemblies and methods for forming the same
US7662981B2 (en) * 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
US7851222B2 (en) * 2005-07-26 2010-12-14 Applied Materials, Inc. System and methods for measuring chemical concentrations of a plating solution
GB0520793D0 (en) * 2005-10-13 2005-11-23 Avecia Inkjet Ltd Phthalocyanine inks and their use in ink-jet printing
US20070178697A1 (en) * 2006-02-02 2007-08-02 Enthone Inc. Copper electrodeposition in microelectronics
US7887693B2 (en) * 2007-06-22 2011-02-15 Maria Nikolova Acid copper electroplating bath composition
JP5442188B2 (ja) * 2007-08-10 2014-03-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 銅めっき液組成物
JP2009041097A (ja) * 2007-08-10 2009-02-26 Rohm & Haas Electronic Materials Llc 銅めっき方法
US7905994B2 (en) 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
KR101247475B1 (ko) * 2008-03-17 2013-03-29 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 전해 동박 제조용 전해액
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
EP2465976B1 (en) 2010-12-15 2013-04-03 Rohm and Haas Electronic Materials LLC Method of electroplating uniform copper layer on the edge and walls of though holes of a substrate.
CN103397354B (zh) * 2013-08-08 2016-10-26 上海新阳半导体材料股份有限公司 一种用于减少硅通孔技术镀铜退火后空洞的添加剂
EP2899411A1 (de) 2013-12-06 2015-07-29 Ulrich Reif Anordnung zur Verbindung von Bauteilen, insbesondere von zwei Bauteilen einer Unterkonstruktion, insbesondere für Balkon- und Terrassenabdeckungen
US10519557B2 (en) 2016-02-12 2019-12-31 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
EP3504186A4 (en) 2016-09-22 2020-11-11 MacDermid Enthone Inc. COPPER DEPOSIT IN AN ENCAPSULATION AT THE TRENCH OF INTEGRATED CIRCUITS
ES2761883T3 (es) * 2017-06-16 2020-05-21 Atotech Deutschland Gmbh Baño de galvanoplastia de cobre ácido acuoso y método para depositar electrolíticamente un revestimiento de cobre
US12012667B2 (en) 2018-04-09 2024-06-18 Lam Research Corporation Copper electrofill on non-copper liner layers
CN112390947B (zh) * 2019-08-16 2023-04-28 位速科技股份有限公司 电极界面层材料、两性离子聚合物和有机光伏元件
US11512406B2 (en) 2019-10-17 2022-11-29 Rohm And Haas Electronic Materials Llc Method of enhancing copper electroplating

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL291575A (da) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
CA1050924A (en) * 1975-03-11 1979-03-20 Hans-Gerhard Creutz Electrodeposition of copper
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper

Also Published As

Publication number Publication date
AU8130782A (en) 1982-11-04
BR8201708A (pt) 1983-02-22
BE892639A (fr) 1982-09-27
CH650278A5 (de) 1985-07-15
JPS57188693A (en) 1982-11-19
DE3210286A1 (de) 1982-12-09
IT1147927B (it) 1986-11-26
GB2097020A (en) 1982-10-27
ES8305852A1 (es) 1983-04-16
US4336114A (en) 1982-06-22
FR2502648A1 (fr) 1982-10-01
IT8248069A0 (it) 1982-03-24
ES510803A0 (es) 1983-04-16
AU530827B2 (en) 1983-07-28
GB2097020B (en) 1984-06-27
SE8201310L (sv) 1982-09-27
NL8201279A (nl) 1982-10-18

Similar Documents

Publication Publication Date Title
DK137382A (da) Elektrolyt og fremgangsmaade til elektroafsaetning af kobber
DK410982A (da) Fremgangsmaade til fremstilling af ribbeformet substratelektrode og lignende
DK66884D0 (da) Fremgangsmade og indretning til flydende anlaeg af ark
IT8268174A0 (it) Apparecchiatura e metodo di elettro placcatura
DK350083A (da) Fremgangsmaade til fremstilling af phenylethanolaminer
DK33982A (da) Fremgangsmaade og udstyr til konstatering af dna-beskadigelse
DK582883A (da) Fremgangsmaade til fremstilling af modelis
DK28683D0 (da) Fremgangsmade til fremstilling af substituerede urinstoffer og thiourinstoffer
DK137582A (da) Praeparater i pulverform indeholdende pesticider og egnede til bahandling af bohave
DK598083A (da) Fremgangsmaade til depolymerisering og sulfatering af polysaccharider
DK39281A (da) Fremgangsmaade til fremstilling af 17alfa-acyloxy-5beta-corticoider og 17alfa-acyloxy-5alfa-corticoider
DK525583A (da) Batteriseparator og fremgangsmaade til fremstilling af samme
DK271582A (da) Fremgangsmaade og komposition til fremstilling af asbestfrie genstande
DK484983D0 (da) Telekommunikationskabel og fremgangsmade til fremstilling af dette
DK468083D0 (da) Telekommunikationskabel og fremgangsmade til fremstilling af dette
DK561683A (da) Elektrolytkondensator og fremgangsmaade til fremstilling af en elektrolytkondensator
DK205982A (da) Fremgangsmaade og middel til flegmatisering af hydroxy-benzotriazoler hydroxy-oxo-dihydro-benzotriaziner
DK40883A (da) Fremgangsmaade til fremstilling af benzothienylallylaminer
DK424083D0 (da) Fremgangsmade til fremstilling af anthracyclinglycosider
DK501582A (da) Fremgangsmaade til fremstilling af acylcyanider
DK105082A (da) Fremgangsmaade til fremstilling af substituerede trifluormethylphenyl-tetrahydropyridiner
DK548081A (da) Fremgangsmaade til fremstilling af buspiron
DK165985A (da) Fremgangsmaade til granulering af metal
DK161570C (da) Fremgangsmaade og apparat til korrugering af metalroer
DK76482A (da) Fremgangsmaade til fremstilling af antibiotikaene ll-b01208alfa og ll-b01208beta

Legal Events

Date Code Title Description
AHS Application shelved for other reasons than non-payment
PUP Patent expired