DE98294T1 - HOLDER ARRANGEMENT FOR AN INTEGRATED CIRCUIT CHIP. - Google Patents

Claims (10)

Dipl.-Ιηη K. '"Λ- Μ'. I" R ■ European patent application 83900511.3. 3244 / EPC NCR Corporation, World Headquarters, January 30, 1984 Dayton, Ohio 45479 (USA) Translation of the claims 1. Holding device for an integrated circuit chip (60) with a socket device (22) for removably attaching the chip (60), characterized by a thermally conductive member (20) suitable for heat exchange with the attached Chip (60), thermoelectric devices (14, 15, 18) in heat exchange with the thermally conductive member (20) and adapted to selectively heat or cool the thermally conductive member (20) and gas flow devices (27, 29, 30), which are suitable to direct a gas flow in the vicinity of the attached chip (60). 2. Apparatus according to claim 1, characterized in that the thermoelectric devices first and second thermoelectric stages (14, 15; 18), the second thermoelectric Stage (.18) in heat exchange with the thermally conductive member (20) and with a thermally conductive connection panel (16) and the first thermoelectric stage (14, 15) in heat exchange with the thermally conductive connection panel (16) are. 3. Apparatus according to claim 2, characterized in that the first thermoelectric stage a pair of thermoelectric modules (14, 15). 4. Apparatus according to claim 3, marked p. net by a body member (10) made of thermally conductive Material, wherein the body member (10) has a recess (12) in which the thermoelectric devices (14, 15; 18) are arranged. 5. Apparatus according to claim 4, characterized in that the gas flow devices a within the limb (10) arranged gas chamber (50), an inlet device (30) which is suitable, To supply gas to the gas chamber (50), and a directional _n _ control device (29) capable of controlling the gas from 15 to direct the chamber (50) in the direction of the chip (60), exhibit. 6. Device according to claim 5, characterized by · a slotted member (27) with a Slot having access for mounting the chip (60) in the socket device (22), the directional control device being provided by inclined edges (29) of the Slit is formed. 7. Apparatus according to claim 6, characterized in that g e k e η η 25 z-eichnet that the gas chamber (50) between the slotted member (27) and a thermally insulating Member (24) is attached with a slot (26) which allows a portion of the thermally conductive Link (20). Passed through, wherein the recess (12) 30th arranged below the thermally insulating member (24) is. ". 8. Apparatus according to claim 7, characterized in that the thermally conductive connection ' field (16) rigid, by screws (17A, 17B) on an un- lower surface of the recess (12) is attached that the Change the thermally conductive member (20) by means of screws (19a, 19b) thermally conductive connection panel (16) rigidly attached is that the socket device (22) by means of screws (23a. C- 23b) rigidly attached to the thermally insulating member (24) is brought, and that the slotted member (27) and the thermally insulating member (2 ¹ J) are rigidly attached to the body member (10) by means of screws (28A, 28B, 25A, 25B). 9. Apparatus according to claim 8, characterized in that temperature monitoring devices on the body member (10) adjacent the lower surface of the recess (12) on the thermally conductive Connection panel (16) and on the thermally conductive member (20) are provided. 10. Device according to one of the preceding claims, : characterized in that the gas is a dry nitrogen gas.