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DE9309973U1 - Printed circuit board with light-emitting components - Google Patents

Printed circuit board with light-emitting components

Info

Publication number
DE9309973U1
DE9309973U1 DE9309973U DE9309973U DE9309973U1 DE 9309973 U1 DE9309973 U1 DE 9309973U1 DE 9309973 U DE9309973 U DE 9309973U DE 9309973 U DE9309973 U DE 9309973U DE 9309973 U1 DE9309973 U1 DE 9309973U1
Authority
DE
Germany
Prior art keywords
circuit board
connection surfaces
light
daughter
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9309973U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blaupunkt Werke GmbH
Original Assignee
Blaupunkt Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blaupunkt Werke GmbH filed Critical Blaupunkt Werke GmbH
Priority to DE9309973U priority Critical patent/DE9309973U1/en
Publication of DE9309973U1 publication Critical patent/DE9309973U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Description

BLAUPUNKT-WERKE GMBHBLAUPUNKT-WERKE GMBH

PLI-Hi Pieper/Ja-2 - 1 - 1.7.1993PLI-Hi Pieper/Ja-2 - 1 - 1.7.1993

R.Nr. 2239R.No. 2239

Leiterplatte mit lichtemittierenden BauelementenPrinted circuit board with light-emitting components

Die Erfindung betrifft eine Leiterplatte mit darauf angeordneten lichtemittierenden Bauelementen, insbesondere Leuchtdioden.The invention relates to a circuit board with light-emitting components arranged thereon, in particular light-emitting diodes.

Der Erfindung liegt die Aufgabe zugrunde, eine Mutter-Leiterplatte eines Autoradios mit üblichen Leuchtdioden zu versehen, welche durch eine öffnung der Leiterplatte hindurch die Zunge einer in das Autoradio einführbaren KeyCard beleuchten sollen.The invention is based on the object of providing a mother circuit board of a car radio with conventional light-emitting diodes, which are intended to illuminate the tongue of a key card that can be inserted into the car radio through an opening in the circuit board.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß auf der Oberseite einer Mutter-Leiterplatte mindestens zwei in einem vorgegebenen Abstand voneinander angeordnete, verzinnte erste Anschlußflächen vorgesehen sind, daß auf der Unterseite einer Tochter-Leiterplatte den ersten Anschlußflächen zugeordnete, verzinnte zweite Anschlußflächen vorgesehen sind, daß die zweiten Anschlußflächen auf den ersten Anschlußflächen aufliegen und mit diesen verlötet sind und daß an der Tochter-Leiterplatte mindestens ein lichtemittierendes Bauelement mittels Lötstellen an Leiterbahnen befestigt ist, die mit den zweiten Anschlußflächen elektrisch verbunden sind.This object is achieved according to the invention in that at least two tinned first connection surfaces arranged at a predetermined distance from one another are provided on the top side of a mother circuit board, that tinned second connection surfaces assigned to the first connection surfaces are provided on the underside of a daughter circuit board, that the second connection surfaces rest on the first connection surfaces and are soldered to them, and that at least one light-emitting component is attached to the daughter circuit board by means of soldering points on conductor tracks that are electrically connected to the second connection surfaces.

Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, daß die Anordnung der Leuchtdioden auf einer Mutter-Leiterplatte eine kosten- und platzgünstige Lösung der mechanischen und elektrischen Verbindung ermöglicht. Zudem ist die Verbindung im Reparaturfall lösbar.The advantages achieved with the invention are in particular that the arrangement of the LEDs on a mother board enables a cost-effective and space-saving solution for the mechanical and electrical connection. In addition, the connection can be removed in the event of repairs.

Vorteilhafte Ausgestaltungen der Erfindungen sind in den Unteransprüchen angegeben. Eine besonders vorteilhafte Ausgestaltung ist im Anspruch 2 angegeben. Eine Ausgestaltung nach Anspruch 3 läßt im Reparaturfall ein problemloses Auslöten der Tochter-Leiterplatte zu.Advantageous embodiments of the inventions are specified in the subclaims. A particularly advantageous embodiment is specified in claim 2. An embodiment according to claim 3 allows the daughter circuit board to be desoldered without any problems in the event of repairs.

BLAUPUNKT-WERKE GMBHBLAUPUNKT-WERKE GMBH

PLI-Hi Pieper/Ja-2 - 2 - 1.7.1993PLI-Hi Pieper/Ja-2 - 2 - 1.7.1993

R.Nr. 2239R.No. 2239

Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und wird im folgenden näher erläutert.An embodiment of the invention is shown in the drawing and is explained in more detail below.

Es zeigen:Show it:

Fig. 1 Eine skizzierte geschnittene Seitenansicht eines Ausschnittes einer Mutter-Leiterplatte mit einer darauf angeordneten, mit zwei Leuchtdioden versehenen Tochter-Leiterplatte undFig. 1 A sketched, cut-away side view of a section of a mother circuit board with a daughter circuit board arranged on top and provided with two light-emitting diodes and

Fig. 2 Eine Unteransicht der Tochterleiterplatte.Fig. 2 A bottom view of the daughter board.

Auf der Oberseite einer Mutter-Leiterplatte 1 vorgesehene Leiterbahnen sind mit zwei in einem vorgegebenen Abstand voneinander angeordneten, verzinnten ersten Anschlußflächen 2, 2' versehen. Eine rechteckförmig ausgebildete Tochter-Leiterplatte 3 ist an ihrer Unterseite in beiden Endbereichen mit den ersten Anschlußflächen 2, 2' zugeordneten, als zweite Anschlußflächen 4, 4' ausgebildeten, verzinnten Leiterbahnen versehen. Jede der zweiten Anschlußflächen 4, 4' ist mit drei Durchkontaktierungen 5, 5' versehen, wobei die Anschlußflächen 4, 4' zwischen benachbarten Durchkontaktierungen Schlitze 6, 6' aufweisen, welche eine E-förmige Ausbildung der Anschlußflächen 4, 4' bewirken. Die zweiten Anschlußflächen 4, 4' der Tochter-Leiterplatte 3, die auf den ersten Anschlußflächen 2, 2' der Mutter-Leiterplatte 1 aufliegen, sind mit diesen verlötet. Das Mittelstück der Tochter-Leiterplatte 3 weist zwei an seiner Unterseite befestigte Leuchtdioden 7 auf, die mit ihren durch die Tochter-Leiterplatte 3 nach oben hindurchragenden Lötfahnen 8 mit auf der Oberseite der Tochter-Leiterplatte 3 angeordneten, mit den Durchkontaktierungen 5, 5' verbundenen Leiterbahnen 9, 9' über Lötstellen 10 verbunden sind. Ein zwischen der Mutter-Leiterplatte 1 undConductor tracks provided on the top of a mother circuit board 1 are provided with two tinned first connection surfaces 2, 2' arranged at a predetermined distance from one another. A rectangular daughter circuit board 3 is provided on its underside in both end areas with tinned conductor tracks assigned to the first connection surfaces 2, 2' and designed as second connection surfaces 4, 4'. Each of the second connection surfaces 4, 4' is provided with three through-contacts 5, 5', the connection surfaces 4, 4' having slots 6, 6' between adjacent through-contacts, which cause the connection surfaces 4, 4' to be E-shaped. The second connection surfaces 4, 4' of the daughter circuit board 3, which rest on the first connection surfaces 2, 2' of the mother circuit board 1, are soldered to them. The middle part of the daughter circuit board 3 has two light-emitting diodes 7 attached to its underside, which are connected with their soldering lugs 8 protruding upwards through the daughter circuit board 3 to conductor tracks 9, 9' arranged on the top side of the daughter circuit board 3 and connected to the through-contacts 5, 5' via soldering points 10. A between the mother circuit board 1 and

BLAUPUNKT-WERKE GMBHBLAUPUNKT-WERKE GMBH

PLI-Hi Pieper/Ja-2 - 3 - 1.7.1993PLI-Hi Pieper/Ja-2 - 3 - 1.7.1993

R.Nr. 2239R.No. 2239

der Tochter-Leiterplatte 3 lokal angeordneter SMD-Kleber 11 dient zur Fixierung beim Löten. Die Durchkontaktierungen 5, 5' sowie die eine unerwünschte Wärmeableitung verringernden Schlitze 6, 6' ermöglichen ein unkompliziertes Aus- und Wiedereinlöten im Reparaturfall. In der Mutter-Leiterplatte 1 ist eine den Leuchtdioden 7 zugeordnete Aussparung 12 vorgesehen, in welche die Leuchtdioden 7 hineinragen und die als Beleuchtungsfenster für eine zu beleuchtende KeyCard dient.SMD adhesive 11 arranged locally on the daughter circuit board 3 serves to fix it during soldering. The through-holes 5, 5' and the slots 6, 6' which reduce undesirable heat dissipation enable uncomplicated desoldering and re-soldering in the event of repairs. In the mother circuit board 1, a recess 12 is provided which is assigned to the light-emitting diodes 7, into which the light-emitting diodes 7 protrude and which serves as an illumination window for a key card to be illuminated.

Claims (4)

BLAUPUNKT-WERKE GMBH PLI-Hi Pieper/Ja-2 - 1 - 1.7.1993 R.Nr. 2239 AnsprücheBLAUPUNKT-WERKE GMBH PLI-Hi Pieper/Ja-2 - 1 - 1.7.1993 R.Nr. 2239 Claims 1. Leiterplatte mit darauf angeordneten lichtemittierenden Bauelementen, insbesondere Leuchtdioden,1. Printed circuit board with light-emitting components arranged thereon, in particular light-emitting diodes, dadurch gekennzeichnet,characterized, daß auf der Oberseite einer Mutter-Leiterplatte (1) mindestens zwei in einem vorgegebenen Abstand voneinander angeordnete, verzinnte erste Anschlußflächen (2, 2') vorgesehen sind, daß auf der Unterseite einer Tochter-Leiterplatte (3) den ersten Anschlußflächen (2, 2') zugeordnete, verzinnte zweite Anschlußflächen (4, 4') vorgesehen sind, daß die zweiten Anschlußflächen (4, 4') auf den ersten Anschlußflächen (2, 2') aufliegen und mit diesen verlötet sind und daß an der Tochter-Leiterplatte (3) mindestens ein lichtemittierendes Bauelement (7) mittels Lötstellen (10) an Leiterbahnen (9, 9') befestigt ist, die mit den zweiten Anschlußflächen (4, 4') elektrisch verbunden sind.that on the top side of a mother circuit board (1) at least two tinned first connection surfaces (2, 2') arranged at a predetermined distance from one another are provided, that on the bottom side of a daughter circuit board (3) tinned second connection surfaces (4, 4') assigned to the first connection surfaces (2, 2') are provided, that the second connection surfaces (4, 4') rest on the first connection surfaces (2, 2') and are soldered to them, and that on the daughter circuit board (3) at least one light-emitting component (7) is attached by means of soldering points (10) to conductor tracks (9, 9') that are electrically connected to the second connection surfaces (4, 4'). 2. Leiterplatte nach Anspruch 1,
dadurch gekennz e ichne t,2. Printed circuit board according to claim 1,
characterized, daß die Tochter-Leiterplatte (3) im Bereich der zweiten Anschlußflächen (4, 4') Durchkontaktierungen (5, 5') aufweist, daß auf der Oberseite der Tochter-Leiterplatte (3) Leiterbahnen (9, 9') vorgesehen sind, die einerseits mit den Durchkontaktierungen (5, 5') und andererseits mit den durch Bohrungen der Tochter-Leiterplatte (3) hindurchragenden Lötfahnen (8) des an der Unterseite der Tochter-Leiterplatte (3) angeordneten lichtemittierenden Bauelementes (7) elektrisch verbunden sind und daß in der Mutter-Leiterplatte (1) eine dem lichtemittierenden Bauelement (7) zugeordnete Aussparung (12) vorgesehen ist.that the daughter circuit board (3) has through-contacts (5, 5') in the area of the second connection surfaces (4, 4'), that on the top side of the daughter circuit board (3) conductor tracks (9, 9') are provided, which are electrically connected on the one hand to the through-contacts (5, 5') and on the other hand to the soldering lugs (8) of the light-emitting component (7) arranged on the underside of the daughter circuit board (3) projecting through holes in the daughter circuit board (3), and that a recess (12) associated with the light-emitting component (7) is provided in the mother circuit board (1). BLAUPUNKT-WERKE GMBHBLAUPUNKT-WERKE GMBH PLI-Hi Pieper/Ja-2 - 2 - 1.7.1993PLI-Hi Pieper/Ja-2 - 2 - 1.7.1993 R.Nr. 2239R.No. 2239 3. Leiterplatte nach Anspruch 2,
dadurch gekennzeichnet,3. Printed circuit board according to claim 2,
characterized, daß in jeder der Anschlußflächen (4, 4') der Tochter-Leiterplatte (3) mindestens zwei Durchkontaktierungen 5, 5') vorgesehen sind und daß zwischen zwei benachbarten Durchkontaktierungen (5, 5') jeweils ein die Anschlußfläche (4, 4') weitgehend unterbrechender Schlitz (6, 6') vorgesehen ist.that in each of the connection surfaces (4, 4') of the daughter circuit board (3) at least two through-contacts (5, 5') are provided and that between two adjacent through-contacts (5, 5') a slot (6, 6') is provided which largely interrupts the connection surface (4, 4'). 4. Leiterplatte nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet,4. Printed circuit board according to one of claims 1 to 3, characterized in daß die Tochter-Leiterplatte (3) rechteckförmig ausgebildet ist.that the daughter board (3) is rectangular.
DE9309973U 1993-07-05 1993-07-05 Printed circuit board with light-emitting components Expired - Lifetime DE9309973U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9309973U DE9309973U1 (en) 1993-07-05 1993-07-05 Printed circuit board with light-emitting components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9309973U DE9309973U1 (en) 1993-07-05 1993-07-05 Printed circuit board with light-emitting components

Publications (1)

Publication Number Publication Date
DE9309973U1 true DE9309973U1 (en) 1993-09-16

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19535705A1 (en) * 1995-09-26 1997-03-27 Bosch Gmbh Robert Double-sided circuit board with multiple connection pads
WO1999025163A1 (en) * 1997-11-10 1999-05-20 Caterpillar Inc. Modular circuit board construction and method of producing the same
DE19816794A1 (en) * 1998-04-16 1999-10-21 Bosch Gmbh Robert Printed circuit board system, for electronic combination instrument
EP1047291A1 (en) * 1999-04-24 2000-10-25 Diehl AKO Stiftung & Co. KG Solder bridge
WO2011003123A1 (en) 2009-07-10 2011-01-13 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board
WO2014202291A1 (en) * 2013-06-20 2014-12-24 Osram Opto Semiconductors Gmbh Optoelectronic arrangement

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19535705A1 (en) * 1995-09-26 1997-03-27 Bosch Gmbh Robert Double-sided circuit board with multiple connection pads
WO1999025163A1 (en) * 1997-11-10 1999-05-20 Caterpillar Inc. Modular circuit board construction and method of producing the same
DE19816794A1 (en) * 1998-04-16 1999-10-21 Bosch Gmbh Robert Printed circuit board system, for electronic combination instrument
EP1047291A1 (en) * 1999-04-24 2000-10-25 Diehl AKO Stiftung & Co. KG Solder bridge
WO2011003123A1 (en) 2009-07-10 2011-01-13 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board
US9491862B2 (en) 2009-07-10 2016-11-08 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board
US9980380B2 (en) 2009-07-10 2018-05-22 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Printed circuit board consisting of at least two printed circuit board regions
WO2014202291A1 (en) * 2013-06-20 2014-12-24 Osram Opto Semiconductors Gmbh Optoelectronic arrangement
CN105284194A (en) * 2013-06-20 2016-01-27 奥斯兰姆奥普托半导体有限责任公司 Optoelectronic arrangement
JP2016524331A (en) * 2013-06-20 2016-08-12 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ Optoelectronic equipment
US9991621B2 (en) 2013-06-20 2018-06-05 Osram Opto Semiconductors Gmbh Optoelectronic arrangement
CN105284194B (en) * 2013-06-20 2018-08-28 奥斯兰姆奥普托半导体有限责任公司 Photoelectron device

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