DE9210221U1 - Construction principle for power electronics devices with compact housings, e.g. for standard rails - Google Patents
Construction principle for power electronics devices with compact housings, e.g. for standard railsInfo
- Publication number
- DE9210221U1 DE9210221U1 DE9210221U DE9210221U DE9210221U1 DE 9210221 U1 DE9210221 U1 DE 9210221U1 DE 9210221 U DE9210221 U DE 9210221U DE 9210221 U DE9210221 U DE 9210221U DE 9210221 U1 DE9210221 U1 DE 9210221U1
- Authority
- DE
- Germany
- Prior art keywords
- housing
- circuit board
- power electronics
- components
- electronics devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
Aufbauprinzip für Geräte der
Le i s t ung s e 1 el<: t ar on i 1<: mit tcom—
pakten Gehäusen &zgr; - B - für Norm —Construction principle for devices of
Performance se 1 el<: t ar on i 1<: with tcom —
compact housings &zgr; - B - for standard —
schienen.rails.
Geräte der Leistungselektronik bis etwa 10 kW Ausgangsleistung werden vorwiegend auf Leiterplatten als Basis aufgebaut oder sie verwenden einen gemeinsamen Kühlkörper als Montagebasis bzw. sie verwenden bereits einen speziellen konstruktiven Aufbau.Power electronics devices with an output power of up to around 10 kW are mainly built on circuit boards as a basis or they use a common heat sink as a mounting base or they already use a special structural design.
Geräte kleinerer Leistung werden aber auch in handelsübliche dichte Bechergehäuse eingebaut, wobei der innere Aufbau auf Leiterplatten erfolgt, die an der Frontplatte des Gehäuses befestigt und in ein Gehäuse mit Führungsrillen eingeschoben werden. Selbst beim Einbau eines Kühlkörpers kann die Verlustleistung dabei nicht beliebig groß werden, weil die Wärmeabfuhr im dichten Gehäuse schlecht ist und die elektronischen Bauelemente im Innern stark erhitzt werden. Gibt man dem Gehäuse Lüftungsschlitze, entfällt der geforderte staubdichte Aufbau.However, devices with lower power are also installed in commercially available sealed can housings, whereby the internal structure is made on circuit boards that are attached to the front panel of the housing and inserted into a housing with guide grooves. Even when a heat sink is installed, the power loss cannot be arbitrarily high because heat dissipation in the sealed housing is poor and the electronic components inside become very hot. If ventilation slots are added to the housing, the required dust-tight structure is no longer necessary.
Der zum Schutz angemeldete Aufbau besitzt außenliegende Kühlkörper und ermöglicht die Montage weiterer isolierter Bauelemente außerhalb des dichten Gehäuses. Die empfindliche Steuerelektronik befindet sich im Inneren des Gehäuses, notwendige Bedienungselemente und die Anschlußklemmen sind von der Frontseite des Gerätes erreichbar.The design, which has been registered for protection, has external heat sinks and enables the installation of additional insulated components outside the sealed housing. The sensitive control electronics are located inside the housing, and the necessary operating elements and the connection terminals are accessible from the front of the device.
Wie Bild 1 zeigt, wird ein seitlich zu öffnendes Gehäuse (1) verwendet, welches die für die Normschienenbefestigung notwendigen Elemente (2) an der Unterseite sowie die für Bedienelemente benötigte Frontfläche (3) mit den Leistungsklemmen (4) an der Vorderseite besitzt.Die isoliert aufgebauten Leistungshalbleiter (5) befinden sich auf Kühlkörper (6). Die Anschlußdrähte (7) der Leistungshalbleiter ragen durch Bohrung der Gehäuseseitenwand ebenso wie die der z.B. verwendeten außenliegenden Relais und Kondensatoren in das Gehäuse-As shown in Figure 1, a housing (1) that can be opened from the side is used, which has the elements (2) required for standard rail mounting on the underside and the front surface (3) required for operating elements with the power terminals (4) on the front. The insulated power semiconductors (5) are located on heat sinks (6). The connecting wires (7) of the power semiconductors protrude through the hole in the housing side wall, as do those of the external relays and capacitors used, for example.
innere hinein. Eine erste Leiterplatte (8) verbindet diese Außenbauteile und weitere Bauteile im Gehäuseinneren. Mit Drähten wird die Verbindung dieser "Leistungsplatine" mit den Leistungsklemmen des Gehäuses hergestellt, mit Stiftleisten oder einfachen Drahtbrücken (9) - steck- oder lötbar- die Verbindung zu einer zweiten darüberliegenden Leiterplatte (10) erreicht. Diese "Steuerplatine" wie auch die Leistungsplatine können an der zur Frontseite liegenden Kante Elemente für die Bedienung, weitere Anschlüsse bzw. für Anzeigen (If) tragen die durch die Frontseite zugänglich sind. Schließlich wird alles durch einen Gehäusdeckel (12) verschlossen. Falls notwendig, kann auch dieser Gehäusedeckel weitere Bauteile (13) tragen.inside. A first circuit board (8) connects these external components and other components inside the housing. Wires are used to connect this "power board" to the power terminals of the housing, and pin strips or simple wire bridges (9) - pluggable or solderable - are used to connect it to a second circuit board (10) above. This "control board" as well as the power board can have elements for operation, other connections or displays (If) on the edge facing the front that are accessible through the front. Finally, everything is closed off by a housing cover (12). If necessary, this housing cover can also carry other components (13).
Ein hoher Aufbau auf der festen Gehäuseseitenwand, vorallem schwere Kühlkörper, erhalten eine zusätzliche Normschienenklemme (14) als zusätzliche Stütze z.B. am Kühlkörper.A high structure on the solid housing side wall, especially heavy heat sinks, receive an additional standard rail clamp (14) as additional support, e.g. on the heat sink.
Claims (4)
30can be operated or viewed.
30
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9210221U DE9210221U1 (en) | 1992-07-30 | 1992-07-30 | Construction principle for power electronics devices with compact housings, e.g. for standard rails |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9210221U DE9210221U1 (en) | 1992-07-30 | 1992-07-30 | Construction principle for power electronics devices with compact housings, e.g. for standard rails |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9210221U1 true DE9210221U1 (en) | 1992-10-01 |
Family
ID=6882173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9210221U Expired - Lifetime DE9210221U1 (en) | 1992-07-30 | 1992-07-30 | Construction principle for power electronics devices with compact housings, e.g. for standard rails |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE9210221U1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE29506766U1 (en) * | 1995-04-21 | 1995-06-22 | MAN Roland Druckmaschinen AG, 63075 Offenbach | Attachment of an assembly to a top hat rail |
DE19915836A1 (en) * | 1999-04-08 | 2000-11-09 | Dold & Soehne Kg E | Modular housing system for control and power electronics has hood together with power module and control module, in which supply terminals are connectable to each other via pluggable electrical connectors |
US6791170B1 (en) | 1999-04-22 | 2004-09-14 | Mitsubishi Denki Kabushiki Kaisha | Onboard semiconductor device |
DE202006008045U1 (en) * | 2006-05-19 | 2007-10-04 | Weidmüller Interface GmbH & Co. KG | Cover portion of a device housing, in particular a drive housing |
DE102008059320A1 (en) * | 2008-11-27 | 2010-06-02 | Knick Elektronische Messgeräte GmbH & Co. KG | Electronic equipment arrangement has mounting rail, electronic equipment mounted on mounting rail, and cooling element outside electronic equipment |
DE102015104044A1 (en) * | 2015-03-18 | 2016-09-22 | R. Stahl Schaltgeräte GmbH | Modular system |
-
1992
- 1992-07-30 DE DE9210221U patent/DE9210221U1/en not_active Expired - Lifetime
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE29506766U1 (en) * | 1995-04-21 | 1995-06-22 | MAN Roland Druckmaschinen AG, 63075 Offenbach | Attachment of an assembly to a top hat rail |
DE19915836A1 (en) * | 1999-04-08 | 2000-11-09 | Dold & Soehne Kg E | Modular housing system for control and power electronics has hood together with power module and control module, in which supply terminals are connectable to each other via pluggable electrical connectors |
DE19915836C2 (en) * | 1999-04-08 | 2002-03-07 | Dold & Soehne Kg E | Modular housing system for the installation of control and power electronics |
US6791170B1 (en) | 1999-04-22 | 2004-09-14 | Mitsubishi Denki Kabushiki Kaisha | Onboard semiconductor device |
DE19955100B4 (en) * | 1999-04-22 | 2006-07-06 | Mitsubishi Denki K.K. | Semiconductor device integrated on a printed circuit board |
DE202006008045U1 (en) * | 2006-05-19 | 2007-10-04 | Weidmüller Interface GmbH & Co. KG | Cover portion of a device housing, in particular a drive housing |
DE102008059320A1 (en) * | 2008-11-27 | 2010-06-02 | Knick Elektronische Messgeräte GmbH & Co. KG | Electronic equipment arrangement has mounting rail, electronic equipment mounted on mounting rail, and cooling element outside electronic equipment |
DE102008059320B4 (en) * | 2008-11-27 | 2013-11-21 | Knick Elektronische Messgeräte GmbH & Co. KG | Electronic device assembly and heat sink for this |
DE102015104044A1 (en) * | 2015-03-18 | 2016-09-22 | R. Stahl Schaltgeräte GmbH | Modular system |
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