[go: up one dir, main page]

DE9003623U1 - Device for dissipating waste heat from a circuit board - Google Patents

Device for dissipating waste heat from a circuit board

Info

Publication number
DE9003623U1
DE9003623U1 DE9003623U DE9003623U DE9003623U1 DE 9003623 U1 DE9003623 U1 DE 9003623U1 DE 9003623 U DE9003623 U DE 9003623U DE 9003623 U DE9003623 U DE 9003623U DE 9003623 U1 DE9003623 U1 DE 9003623U1
Authority
DE
Germany
Prior art keywords
circuit board
heat
casting compound
conductor tracks
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9003623U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE9003623U priority Critical patent/DE9003623U1/en
Publication of DE9003623U1 publication Critical patent/DE9003623U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Description

906906

Siemens AktiengesellschaftSiemens AG

Vorrichtung zum Abführen der Verlustwärme von einer Leiterplatte Device for dissipating waste heat from a circuit board

Die Neuerung betrifft eine Vorrichtung zum Abführen der Verlust^arme von einer Leiterplatts gemlS des Oberbegriff des Anspruchs 1.
TQThe innovation relates to a device for removing the loss arms from a printed circuit board according to the preamble of claim 1.
TQ

In des· DE-GM &bgr;&bgr; 15 Mo Lr* ein Infrarot-Scheinwerfer mit eine Vielzahl von «"atrixformiq auf jiner Kunststoffplatte angebräunten Infrar&t-Lumineszfcnzdioden ^.ls Lichtquelle beschrieben. Zur Kühlung der Lumin^szenzdioden ist die Ktr.ststoffplatte mit ihrer Rückseite mittels Silikonkautschuk auf einen KühlKörper geklebt, der einen Teil des Gehäuses bildet. Die Wärme der Lumineszenzdioden wird daher unmittelbar nach außen abgegeben.In DE-GM 15 Mo Lr* an infrared spotlight with a large number of infrared luminescent diodes browned in an atrix shape on a plastic plate is described as a light source. To cool the luminescent diodes, the plastic plate is glued with its back to a cooling body using silicone rubber, which forms part of the housing. The heat from the luminescent diodes is therefore released directly to the outside.

Ei ist üblich, elektronische Bauelemente auf die Vorderseite einer Leiterplatte aufzusetzen und die Anschlüsse mit Leiterbahnen, die auf der Rückseite der Leiterplatte verlaufen, zu verlöten. Defekte Bauelemente können ausgetauscht werden. Ist jedoch die Leiterplatte mit Silikonkautschuk auf einen Kühlkörper geklebt, ist der Austausch eines defekten Bauelementes praktisch nicht mehr möglich. It is common practice to place electronic components on the front of a circuit board and solder the connections to conductor tracks that run along the back of the circuit board. Defective components can be replaced. However, if the circuit board is glued to a heat sink with silicone rubber, replacing a defective component is practically impossible.

Der vorliegenden Neuerung liegt die Aufgabe zugrunde, eine Vorrichtung zum Abführen der Verlustwärme von Bauelementen, die auf einer Leiterplatte sitzen, zu schaffen, die bei guter Wärmeabfuhr das Austauschen einzelner Bauelemente gestattet.The aim of the present innovation is to create a device for dissipating the waste heat from components located on a circuit board, which allows the replacement of individual components while ensuring good heat dissipation.

Gemäß der Neuerung wird diese Aufgabe mit den im kennzeichnenden Teil des Anspruchs 1 angegebenen Maßnahmen gelöst. 35According to the innovation, this task is solved with the measures specified in the characterizing part of claim 1. 35

Die in den Bauelementen entstehende Verlustwiirme wird vorwiegend über deren Anschiuuarähte in die Lf iterbahnen der Leiterplatte abgeführt, nn welchen die Vergußmasse mi' gutem Wärmekontakt anliegt. Vorteilhaft sind daher die LeiterbahnenThe heat loss generated in the components is mainly dissipated via their connecting wires into the conductor tracks of the circuit board, where the casting compound is in good thermal contact. The conductor tracks are therefore advantageous

67y 02 01 67 and 02 01

90 G 441490 G4414

großflächig ausgeführt, d. h., sie sind breiter, als für die Stromführung erforderlich ist. Vor allem gilt dies für die Leiterbahnen, die mit den Elektroden der Bauelemente verbunden sind, ~n denen die Verlustwärme im wesentlichen auftritt. Im Falle von LumineszenzaiLoderT sind vxe? eren Apodenlarge area, ie they are wider than is necessary for the current conduction. This applies in particular to the conductor tracks that are connected to the electrodes of the components, where the heat loss occurs in the main. In the case of luminescence sensors, the apods

Ar»? i der Zeichnunq, in der Ausführungsbeispiele der Neuerung veranschaulicht sind, werden im folgenden die Neuerung sowie Ausgestaltungen und weitere Vorteile näher beschriebe': und erläutert. In the drawing, in which embodiments of the innovation are illustrated, the innovation as well as embodiments and further advantages are described and explained in more detail below.

Figur 1 zeigt einen Querschnitt einer als Lichtquelle fur einen Infrarot-Scheinwerfer geeigneten Schaltung mit einerFigure 1 shows a cross-section of a circuit suitable as a light source for an infrared spotlight with a

' Vorrichtung gemäß der Neuerung.' Device according to the innovation.

In Figur 2 ist die Aufsicht auf ein Ausführungsbeispiel dargestellt.Figure 2 shows a top view of an embodiment.

In Figur 1 ist mit 2 eine Leiterplatte bezeichnet, auf deren Vorderseite Lumineszenzdioden 1 sitzen. Ihre Anschlußdrähte sind durch Bohrungen der Leiterplatte gesteckt und auf deren Rückseite mit Leiterbahnen 5, 6 verlötet. Die Anschlußdrähte 3 sind mit den Anoden der Lumineszenzdioden 1 verbunden, also mit den Elektroden, an welchen die größte Verlustwärme entsteht. Demgemäß find die mit ihnen verlöteten Leiterbahnen 5 großflächiger ausgeführt als die Leiterbahnen 6, über welche derIn Figure 1, 2 denotes a circuit board on the front of which are light-emitting diodes 1. Their connecting wires are inserted through holes in the circuit board and soldered to conductor tracks 5, 6 on the back. The connecting wires 3 are connected to the anodes of the light-emitting diodes 1, i.e. to the electrodes at which the greatest heat loss occurs. Accordingly, the conductor tracks 5 soldered to them are designed to have a larger surface area than the conductor tracks 6, over which the

\ Strom zu den Kathoden der Lumineszenzdioden 1 geführt wird. Auf der Leiterplatte 2 sind ferner Bauelemente 7, 8 angebracht, die der Stromversorgung der Lumineszenzdioden dienen und die im Ausführungsbeispiel eine Konstantstromquelle bilden. Die Leiterplatte 2 ist mit ihrer Unterseite in eine wärmeleitende, aber elektrisch isolierende Vergußmasse 9 gebettet, die weichelastisch und von solcher Konsistenz 1st, daß die Leiterplatte 2 spannungsfrei in ihr gelagert ist und sich von ihr losen läßt. Fällt daher eine Lumineszenzdiode aus, kann die Leiterplatte vein der Vergußmasse abgehoben und das defekte Bauelement ausgetauscht werden. Danach kann die Leiterplatte wieder auf die Vergußmasse gesetzt werdeii Eine solche Vergußmasse ist z. °,. Silikonkautschuk mit einem geeignet gewählten Anteil an Härter. Im Falle der. Silikonkautschuks VP 7675 &Lgr; mit Current is supplied to the cathodes of the luminescent diodes 1. Components 7, 8 are also mounted on the circuit board 2, which serve to supply power to the luminescent diodes and which form a constant current source in the exemplary embodiment. The circuit board 2 is embedded with its underside in a heat-conducting but electrically insulating casting compound 9, which is soft and elastic and of such consistency that the circuit board 2 is supported in it without stress and can be detached from it. If a luminescent diode fails, the circuit board can be lifted off the casting compound and the defective component replaced. The circuit board can then be placed back on the casting compound. Such a casting compound is , for example, silicone rubber with a suitably selected proportion of hardener. In the case of the silicone rubber VP 7675 �Lgr; with

an &eegr; u u &igr; an &eegr; uu &igr;

J 'Jem Härter VP 7675 D der Firma Wacker Chemie hat sich einJ 'Jem Härter VP 7675 D from Wacker Chemie has a

Mischungsverhältnis von etwa h : 1 als günstig hr j. ausger-* >· 1 l t.Mixing ratio of about h : 1 is considered favorable hr j. equipped-* >· 1 l t.

Die Vergußmasse 9 ist in einem wannenförmig ausgebildeten wärmeableiter 10 enthalten, dessen lichte Weite etwas größer als die Abmessung der Leiterplatte 2 ist. In den Wärmeableiter 10 wird die Vergußmasse vor dem Aushärten gegossen, und es wird noch vor dem Aushärten die Leiterplatte 2 aufgesetzt. Da die Vergußmasse beim Aushärten nicht hart wird, sondern weichelastisch bleibt, ist die Leiterplatte nach dem Aushärten praktisch spannungsfrei in die Vergußmasse eingebettet. Die Leiterbahnen 5, 6 sind in engem Kontakt mit der Vergußmasse 9, so daß die in den Lumineszenzdioden 1 entstehende Wärme über die An-' schlußdrähte 3, 4 und die Leiterbahnen 5, 6 an die Vergußmasse 'j abgeführt wird, von wo sie an den Wärmeableiter 10 weitergegeben wird. Dieser kann mit einem Kühlkörper, zweckmäßig das Gehäuse eines Infrarot-Scheinwerfers, verbunden sein. Selbstverständlich kann die Neuerung auch zur Abführung der Wärme von sogenannten SMT-Schaltungen verwendet werden, bei denen die 3auelemente und Leiterbahnen auf derselben Seite einer Leiterplatte angebracht sind.The casting compound 9 is contained in a trough-shaped heat sink 10, the inside diameter of which is slightly larger than the dimensions of the circuit board 2. The casting compound is poured into the heat sink 10 before it hardens, and the circuit board 2 is placed on top before it hardens. Since the casting compound does not harden during hardening, but remains soft and elastic, the circuit board is embedded in the casting compound after hardening with practically no stress. The conductor tracks 5, 6 are in close contact with the casting compound 9, so that the heat generated in the light-emitting diodes 1 is dissipated via the connecting wires 3, 4 and the conductor tracks 5 , 6 to the casting compound, from where it is passed on to the heat sink 10. This can be connected to a heat sink, expediently the housing of an infrared spotlight. Of course, the innovation can also be used to dissipate heat from so-called SMT circuits, in which the components and conductor tracks are mounted on the same side of a circuit board.

In Figur 2 ist mit 13 ein wannenförmiger Wärmeableiter bezeichnet, der eine Vergußmasse 14 enthält, in die zwei Leiterplatten 11, 12 mit ihrer Leiterbahnenseite eingegossen sind. / Die auf den Leiterplatten sitzenden Bauelemente sind nicht dargestellt. Figur 2 verdeutlicht, daß die lichte Weite des wärmeableiters 13 etwas größer als die Abmessungen der Leiterplatten ist und daß mehrere Leiterplatten auf einem gemeinsamen Kühlkörper mit einer Vergußmasse und einem Wärmeableiter angebracht sein können.In Figure 2, 13 denotes a trough-shaped heat sink, which contains a casting compound 14 into which two circuit boards 11, 12 are cast with their conductor track side. / The components sitting on the circuit boards are not shown. Figure 2 shows that the clear width of the heat sink 13 is slightly larger than the dimensions of the circuit boards and that several circuit boards can be mounted on a common heat sink with a casting compound and a heat sink.

02 C302 C3

Claims (6)

30 &Pgr; &eegr; &eegr; 1 *» Schutzansprüche30 &Pgr;&eegr;&eegr; 1 *» Protection claims 1. Vorrichtung /um Abführen der Verlustwärme von einer Leiterplatte, die mit elektronischen Bauteilen bestückt ist, mit einem Kühlkörper, dadurch gekennzeichnet, daß auf der Leiterbahnseite der Leiterplatte (2) ein Kühlkörper angebracht ist, der aus einer weichelastischen, wärmeleitenden Vergußmasse (9), die an der Leiterbahnseite der Leiterplatte anliegt, und aus einem metallischen Wärmeableiter (10) besteht.1. Device for dissipating the waste heat from a circuit board, which is equipped with electronic components, with a heat sink, characterized in that a heat sink is attached to the conductor track side of the circuit board (2), which consists of a soft-elastic, heat-conducting casting compound (9), which lies on the conductor track side of the circuit board, and of a metallic heat dissipator (10). 2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet , daß der Wärmeableiter (10) wannenförmig ausgebildet ist und eine lichte Weite hat, die mindestens gleich der Abmessung der Leiterplatte (2) ist, und daß die weichelastische Vergußmasse (9) dadurch gebildet ist, daß sie in nichtgehärtetem Zustand in den Wärmeableiter (10) gefüllt wird und die Leiterplatte mit der Rückseite aufgelegt wird.2. Device according to claim 1, characterized in that the heat dissipator (10) is trough-shaped and has a clear width that is at least equal to the dimensions of the circuit board (2), and that the soft-elastic casting compound (9) is formed by filling it in the heat dissipator (10) in the uncured state and placing the circuit board on top with its back side. 3. Vorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet , daß die Vergußmasse (9) ein Zweikomponenten-Silikonkautschuk mit vorzugsweise einem Fünftel Anteil an Härter ist.3. Device according to claim 1 or 2, characterized in that the casting compound (9) is a two-component silicone rubber with preferably a fifth of hardener. 4. Vorrichtung nach Anspruch 1 bis 3, dadurch gekennzeichnet, daß die elektronischen Bauteile Lumineszenzdioden (1) sind.4. Device according to claims 1 to 3, characterized in that the electronic components are luminescent diodes (1). 5. Vorrichtung nach Anspruch 1 bis 4, dadurch g e kennzeichnet, daß die Leiterbahnen, insbesondere die mit den Anoden der Lumineszenzdioden verbundenen Leiterbahnen (5), großflächig ausgeführt sind.5. Device according to claims 1 to 4, characterized in that the conductor tracks, in particular the conductor tracks connected to the anodes of the light-emitting diodes (5), are designed to have a large surface area. 6. Verrichtung nach Anspruch 4 oder 5, dadurch g e kennzeichnet, daß auf der Leiterplatte (2) Bauelemente (7, 8) angebracht sind, die eine Schaltung zur Regelung des Stromes durch die Lumineszenzdioden bilden.6. Device according to claim 4 or 5, characterized in that components (7, 8) are mounted on the circuit board (2) which form a circuit for regulating the current through the light-emitting diodes. 03 0103 01
DE9003623U 1990-03-28 1990-03-28 Device for dissipating waste heat from a circuit board Expired - Lifetime DE9003623U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9003623U DE9003623U1 (en) 1990-03-28 1990-03-28 Device for dissipating waste heat from a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9003623U DE9003623U1 (en) 1990-03-28 1990-03-28 Device for dissipating waste heat from a circuit board

Publications (1)

Publication Number Publication Date
DE9003623U1 true DE9003623U1 (en) 1990-10-31

Family

ID=6852423

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9003623U Expired - Lifetime DE9003623U1 (en) 1990-03-28 1990-03-28 Device for dissipating waste heat from a circuit board

Country Status (1)

Country Link
DE (1) DE9003623U1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19528632A1 (en) * 1995-08-04 1997-02-06 Bosch Gmbh Robert Control unit consisting of at least two housing parts
DE19528459A1 (en) * 1995-08-03 1997-02-13 Garufo Gmbh LED display apparatus with carrier plate - has heat carrier plates connected to transfer heat from carrier plate to heat dissipation surface
DE10102353A1 (en) * 2001-01-19 2002-08-01 Osram Opto Semiconductors Gmbh LED signal module has dust-tight thermally conducting leadthroughs providing thermally conducting connection from conducting tracks on first main board surface to second main surface
DE10162404A1 (en) * 2001-12-19 2003-07-03 Hella Kg Hueck & Co Circuit arrangement for driving LEDs especially in motor vehicle, has power component and LED arranged on common circuit board or common conducting film
US8794797B2 (en) 2003-11-07 2014-08-05 Teknoware Oy Hybrid illuminator

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19528459A1 (en) * 1995-08-03 1997-02-13 Garufo Gmbh LED display apparatus with carrier plate - has heat carrier plates connected to transfer heat from carrier plate to heat dissipation surface
DE19528459C2 (en) * 1995-08-03 2001-08-23 Garufo Gmbh Cooling for a light unit equipped with LEDs
DE19528632A1 (en) * 1995-08-04 1997-02-06 Bosch Gmbh Robert Control unit consisting of at least two housing parts
DE10102353A1 (en) * 2001-01-19 2002-08-01 Osram Opto Semiconductors Gmbh LED signal module has dust-tight thermally conducting leadthroughs providing thermally conducting connection from conducting tracks on first main board surface to second main surface
DE10102353B4 (en) * 2001-01-19 2007-11-15 Siemens Ag LED signal module
DE10162404A1 (en) * 2001-12-19 2003-07-03 Hella Kg Hueck & Co Circuit arrangement for driving LEDs especially in motor vehicle, has power component and LED arranged on common circuit board or common conducting film
US8794797B2 (en) 2003-11-07 2014-08-05 Teknoware Oy Hybrid illuminator
DE102004053680B4 (en) * 2003-11-07 2015-12-24 Teknoware Oy lighting

Similar Documents

Publication Publication Date Title
DE4390783C1 (en) Device for connecting a heat sink to an electronic circuit
DE60007872T2 (en) MANUFACTURING METHOD OF AN ELECTRONIC PCB MODULE WITH HEAT EXTRACTION USING A CONVECTION-COOLED PCB
DE69828871T2 (en) COOLING BODY ASSEMBLY ASSEMBLY FOR SURFACE MOUNTED ELECTRONIC PACKS
DE69222714T2 (en) Heat sink
DE102008033465B4 (en) POWER SEMICONDUCTOR MODULE SYSTEM AND POWER SUB-LEAD MODULE WITH A HOUSING AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR ASSEMBLY
DE102007057533B4 (en) Heat sink, method for manufacturing a heat sink and printed circuit board with heat sink
DE3887801T2 (en) Printed circuit provided with a heat dissipation device.
DE19528459C2 (en) Cooling for a light unit equipped with LEDs
DE69005382T2 (en) Heat dissipation device for components of the type SMD for mounting on circuit boards.
DE102015102528B4 (en) A method of connecting a semiconductor package to a circuit board and a semiconductor package
DE102009002191A1 (en) Power semiconductor module, power semiconductor module assembly, and method of making a power semiconductor module assembly
EP2198196A1 (en) Lamp
DE102019200271B4 (en) Semiconductor device and method of manufacturing the same
DE3627372C2 (en)
DE3932213A1 (en) CONNECTING ARRANGEMENT WITH PCB
DE4332115A1 (en) Arrangement for extracting heat from a printed circuit board which has at least one heat sink
DE9003623U1 (en) Device for dissipating waste heat from a circuit board
DE2511010A1 (en) Cooling for electronic components - involves using components embedded in heat conductive mass of metal powder in resin which has large heat transfer surface
DE10234995A1 (en) Light diode arrangement including laser diodes for illumination and signaling has thermal chip connection and light diode module
DE60315469T2 (en) Heat dissipating insert, circuit with such an insert and method of manufacture
DE3829117A1 (en) Metal core printed circuit board
DE102008015785B4 (en) Electronic substrate mounting structure
DE19518521A1 (en) Vehicle brake valve electrical control device housing
DE10210041A1 (en) Heat dissipation device, for dissipating heat generated by an electrical component
DE3614086A1 (en) DEVICE AND METHOD FOR THERMALLY COUPLING A SEMICONDUCTOR BUILDING UNIT TO A COOLING PLATE AND FOR ELECTRICALLY COUPLING TO A CIRCUIT BOARD