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DE69943071D1 - Digitaler magnetischer Signalkoppler - Google Patents

Digitaler magnetischer Signalkoppler

Info

Publication number
DE69943071D1
DE69943071D1 DE69943071T DE69943071T DE69943071D1 DE 69943071 D1 DE69943071 D1 DE 69943071D1 DE 69943071 T DE69943071 T DE 69943071T DE 69943071 T DE69943071 T DE 69943071T DE 69943071 D1 DE69943071 D1 DE 69943071D1
Authority
DE
Germany
Prior art keywords
magnetic signal
digital magnetic
signal coupler
coupler
digital
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69943071T
Other languages
English (en)
Inventor
James M Daughton
Robert T Fayfield
Theodore M Hermann
John F Stokes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NVE Corp
Original Assignee
NVE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NVE Corp filed Critical NVE Corp
Application granted granted Critical
Publication of DE69943071D1 publication Critical patent/DE69943071D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G01R15/205—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using magneto-resistance devices, e.g. field plates
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
    • H04B5/73—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for taking measurements, e.g. using sensing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
    • H04B5/75—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for isolation purposes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Measuring Magnetic Variables (AREA)
  • Hall/Mr Elements (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
  • Measurement Of Current Or Voltage (AREA)
  • Magnetic Heads (AREA)
  • Thin Magnetic Films (AREA)
DE69943071T 1998-03-04 1999-03-04 Digitaler magnetischer Signalkoppler Expired - Lifetime DE69943071D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7671698P 1998-03-04 1998-03-04
US09/261,899 US6300617B1 (en) 1998-03-04 1999-03-03 Magnetic digital signal coupler having selected/reversal directions of magnetization

Publications (1)

Publication Number Publication Date
DE69943071D1 true DE69943071D1 (de) 2011-02-03

Family

ID=26758411

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69943071T Expired - Lifetime DE69943071D1 (de) 1998-03-04 1999-03-04 Digitaler magnetischer Signalkoppler
DE69933440T Expired - Lifetime DE69933440T2 (de) 1998-03-04 1999-03-04 Digitaler magnetischer signalkoppler

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69933440T Expired - Lifetime DE69933440T2 (de) 1998-03-04 1999-03-04 Digitaler magnetischer signalkoppler

Country Status (7)

Country Link
US (1) US6300617B1 (de)
EP (1) EP1068541B1 (de)
JP (1) JP2003526083A (de)
AU (1) AU2897099A (de)
CA (1) CA2320311A1 (de)
DE (2) DE69943071D1 (de)
WO (1) WO1999045405A1 (de)

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US6376933B1 (en) * 1999-12-31 2002-04-23 Honeywell International Inc. Magneto-resistive signal isolator
US7046117B2 (en) * 2002-01-15 2006-05-16 Honeywell International Inc. Integrated magnetic field strap for signal isolator
US7259545B2 (en) * 2003-02-11 2007-08-21 Allegro Microsystems, Inc. Integrated sensor
SI21580A (sl) * 2003-07-15 2005-02-28 Iskraemeco Integrirano vezje, predvideno za merilnik električne energije
CN1898574B (zh) * 2003-12-23 2011-09-07 Nxp股份有限公司 高灵敏度磁性内置电流传感器
FR2870351B1 (fr) * 2004-05-14 2006-07-14 Alstom Transport Sa Dispositif de mesure d'un champ electromagnetique, systeme de commande utilisant ce dispositif et circuit electronique concu pour ce dispositif
US20060262593A1 (en) * 2004-07-27 2006-11-23 Stephane Aouba Magnetic memory composition and method of manufacture
CA2573406A1 (en) * 2004-07-27 2006-02-02 University Of Toronto Tunable magnetic switch
US7557562B2 (en) * 2004-09-17 2009-07-07 Nve Corporation Inverted magnetic isolator
US7777607B2 (en) * 2004-10-12 2010-08-17 Allegro Microsystems, Inc. Resistor having a predetermined temperature coefficient
US7839605B2 (en) * 2005-11-13 2010-11-23 Hitachi Global Storage Technologies Netherlands B.V. Electrical signal-processing device integrating a flux sensor with a flux generator in a magnetic circuit
US7701756B2 (en) 2005-12-21 2010-04-20 Governing Council Of The University Of Toronto Magnetic memory composition and method of manufacture
US7768083B2 (en) 2006-01-20 2010-08-03 Allegro Microsystems, Inc. Arrangements for an integrated sensor
US20080016653A1 (en) * 2006-07-19 2008-01-24 Amelia Baradzi Ergonomic handle for push tools
US20080278275A1 (en) * 2007-05-10 2008-11-13 Fouquet Julie E Miniature Transformers Adapted for use in Galvanic Isolators and the Like
US9105391B2 (en) 2006-08-28 2015-08-11 Avago Technologies General Ip (Singapore) Pte. Ltd. High voltage hold-off coil transducer
US8427844B2 (en) * 2006-08-28 2013-04-23 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Widebody coil isolators
US7791900B2 (en) * 2006-08-28 2010-09-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolator
US9019057B2 (en) * 2006-08-28 2015-04-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolators and coil transducers
US8385043B2 (en) 2006-08-28 2013-02-26 Avago Technologies ECBU IP (Singapoare) Pte. Ltd. Galvanic isolator
JP4194110B2 (ja) 2007-03-12 2008-12-10 オムロン株式会社 磁気カプラ素子および磁気結合型アイソレータ
US7795862B2 (en) 2007-10-22 2010-09-14 Allegro Microsystems, Inc. Matching of GMR sensors in a bridge
JP4458149B2 (ja) 2007-10-31 2010-04-28 Ｔｄｋ株式会社 磁気カプラ
US20090152356A1 (en) * 2007-12-14 2009-06-18 Honeywell International Inc. Non-contact magnetic pattern recognition sensor
US8258911B2 (en) * 2008-03-31 2012-09-04 Avago Technologies ECBU IP (Singapor) Pte. Ltd. Compact power transformer components, devices, systems and methods
US8102668B2 (en) * 2008-05-06 2012-01-24 International Rectifier Corporation Semiconductor device package with internal device protection
US7816905B2 (en) * 2008-06-02 2010-10-19 Allegro Microsystems, Inc. Arrangements for a current sensing circuit and integrated current sensor
WO2010032825A1 (ja) 2008-09-22 2010-03-25 アルプス電気株式会社 磁気結合型アイソレータ
JP5299675B2 (ja) * 2008-11-27 2013-09-25 Ｔｄｋ株式会社 信号伝送装置
JP5440837B2 (ja) * 2009-03-26 2014-03-12 Ｔｄｋ株式会社 信号伝達装置
JP2010258372A (ja) 2009-04-28 2010-11-11 Alps Green Devices Co Ltd 磁気結合型アイソレータ
JP2010258979A (ja) 2009-04-28 2010-11-11 Alps Green Devices Co Ltd 磁気結合型アイソレータ
JP5680287B2 (ja) 2009-05-27 2015-03-04 新科實業有限公司ＳＡＥ Ｍａｇｎｅｔｉｃｓ（Ｈ．Ｋ．）Ｌｔｄ． 電流センサ
US8380146B2 (en) * 2009-12-31 2013-02-19 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Multi-band, multi-mode RF transmit amplifier system with separate signal paths for linear and saturated operation
TWI434025B (zh) * 2010-02-11 2014-04-11 Geeng Jen Sheu Non - contact sensing device
US8395383B2 (en) 2010-03-11 2013-03-12 Alps Green Devices Co., Ltd. Current sensor including magnetic detecting element
TWI452743B (zh) * 2011-03-03 2014-09-11 Voltafield Technology Corp 磁阻感測器的製造方法
RU2495514C1 (ru) * 2012-05-03 2013-10-10 Открытое акционерное общество "Научно-производственное объединение измерительной техники" Магниторезистивный датчик
BR112015024277A2 (pt) * 2013-03-22 2017-07-18 Ppc Broadband Inc campo magnético corretivo para circuitos baseados em ferrite
DE102013014673A1 (de) * 2013-09-04 2015-03-05 Hydac Fluidtechnik Gmbh Lasthalteventil
JP2015187584A (ja) * 2014-03-27 2015-10-29 ヤマハ株式会社 電流センサ
US10270630B2 (en) 2014-09-15 2019-04-23 Analog Devices, Inc. Demodulation of on-off-key modulated signals in signal isolator systems
US9660848B2 (en) 2014-09-15 2017-05-23 Analog Devices Global Methods and structures to generate on/off keyed carrier signals for signal isolators
US10536309B2 (en) 2014-09-15 2020-01-14 Analog Devices, Inc. Demodulation of on-off-key modulated signals in signal isolator systems
US9998301B2 (en) 2014-11-03 2018-06-12 Analog Devices, Inc. Signal isolator system with protection for common mode transients
US10200073B2 (en) * 2014-12-09 2019-02-05 Northrop Grumman Systems Corporation Launchable communications device for a distributed communication system
KR102165935B1 (ko) * 2016-12-20 2020-10-14 한국전자기술연구원 전류센서 및 그의 제조방법
US10761120B2 (en) * 2017-02-17 2020-09-01 Allegro Microsystems, Llc Current sensor system
CN106871778B (zh) * 2017-02-23 2019-11-22 江苏多维科技有限公司 一种单芯片双轴磁电阻角度传感器
US10236932B1 (en) * 2017-11-02 2019-03-19 Allegro Microsystems, Llc Signal isolator having magnetic signal latching
US10884031B2 (en) 2018-08-17 2021-01-05 Allegro Microsystems, Llc Current sensor system
US10935612B2 (en) 2018-08-20 2021-03-02 Allegro Microsystems, Llc Current sensor having multiple sensitivity ranges
US11115244B2 (en) 2019-09-17 2021-09-07 Allegro Microsystems, Llc Signal isolator with three state data transmission
US11187764B2 (en) 2020-03-20 2021-11-30 Allegro Microsystems, Llc Layout of magnetoresistance element
US11226382B2 (en) 2020-04-07 2022-01-18 Allegro Microsystems, Llc Current sensor system
US11567108B2 (en) 2021-03-31 2023-01-31 Allegro Microsystems, Llc Multi-gain channels for multi-range sensor
US11656250B2 (en) 2021-09-07 2023-05-23 Allegro Microsystems, Llc Current sensor system
US11892476B2 (en) 2022-02-15 2024-02-06 Allegro Microsystems, Llc Current sensor package
US12112865B2 (en) 2022-03-15 2024-10-08 Allegro Microsystems, Llc Multiple branch bus bar for coreless current sensing application
US11994541B2 (en) 2022-04-15 2024-05-28 Allegro Microsystems, Llc Current sensor assemblies for low currents
US11940470B2 (en) 2022-05-31 2024-03-26 Allegro Microsystems, Llc Current sensor system
US12248039B2 (en) 2023-08-08 2025-03-11 Allegro Microsystems, Llc Interleaving sub-arrays of magnetoresistance elements based on reference directions to compensate for bridge offset

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Also Published As

Publication number Publication date
EP1068541B1 (de) 2006-10-04
WO1999045405A1 (en) 1999-09-10
CA2320311A1 (en) 1999-09-10
JP2003526083A (ja) 2003-09-02
AU2897099A (en) 1999-09-20
DE69933440T2 (de) 2007-08-23
EP1068541A1 (de) 2001-01-17
DE69933440D1 (de) 2006-11-16
US6300617B1 (en) 2001-10-09
EP1068541A4 (de) 2001-04-18

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