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DE69922687D1 - Verfahren und vorrichtung zum montieren von bauteilen - Google Patents

Verfahren und vorrichtung zum montieren von bauteilen

Info

Publication number
DE69922687D1
DE69922687D1 DE69922687T DE69922687T DE69922687D1 DE 69922687 D1 DE69922687 D1 DE 69922687D1 DE 69922687 T DE69922687 T DE 69922687T DE 69922687 T DE69922687 T DE 69922687T DE 69922687 D1 DE69922687 D1 DE 69922687D1
Authority
DE
Germany
Prior art keywords
mounting components
mounting
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69922687T
Other languages
English (en)
Other versions
DE69922687T2 (de
Inventor
Osamu Nakao
Noriaki Yoshida
Takeshi Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69922687D1 publication Critical patent/DE69922687D1/de
Application granted granted Critical
Publication of DE69922687T2 publication Critical patent/DE69922687T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
DE69922687T 1998-10-27 1999-10-25 Verfahren und vorrichtung zum montieren von bauteilen Expired - Fee Related DE69922687T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP30488498 1998-10-27
JP10304884A JP2000133995A (ja) 1998-10-27 1998-10-27 部品装着方法とその装置
PCT/JP1999/005893 WO2000025564A2 (en) 1998-10-27 1999-10-25 Component mounting method and apparatus

Publications (2)

Publication Number Publication Date
DE69922687D1 true DE69922687D1 (de) 2005-01-20
DE69922687T2 DE69922687T2 (de) 2005-05-19

Family

ID=17938446

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69922687T Expired - Fee Related DE69922687T2 (de) 1998-10-27 1999-10-25 Verfahren und vorrichtung zum montieren von bauteilen

Country Status (7)

Country Link
US (1) US6513233B1 (de)
EP (1) EP1125484B1 (de)
JP (1) JP2000133995A (de)
KR (1) KR100618235B1 (de)
CN (1) CN1205848C (de)
DE (1) DE69922687T2 (de)
WO (1) WO2000025564A2 (de)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6640422B1 (en) * 1999-08-17 2003-11-04 Amp Deutschland Gmbh Device for the assembly of printed circuit boards
JP4172902B2 (ja) * 2000-07-14 2008-10-29 松下電器産業株式会社 電子部品実装方法および電子部品実装装置
JP2002176292A (ja) * 2000-12-05 2002-06-21 Juki Corp 電子部品装着装置
JP4637403B2 (ja) * 2001-06-06 2011-02-23 富士機械製造株式会社 電気部品装着システム
US7313860B2 (en) * 2001-12-28 2008-01-01 Matsushita Electric Industrial Co., Ltd. Mounting device
JP3817207B2 (ja) 2002-08-21 2006-09-06 Ｔｄｋ株式会社 実装処理装置及び該実装処理装置の制御装置
JP2004200386A (ja) * 2002-12-18 2004-07-15 Matsushita Electric Ind Co Ltd 部品実装機の配線配管装置
JP2004241595A (ja) * 2003-02-06 2004-08-26 Matsushita Electric Ind Co Ltd 部品実装機
JP3700135B2 (ja) * 2003-04-11 2005-09-28 日本航空電子工業株式会社 ボンディング装置
CH696103A5 (de) * 2003-06-06 2006-12-15 Esec Trading Sa Halbleiter-Montageeinrichtung.
WO2004108366A1 (ja) * 2003-06-06 2004-12-16 Advantest Corporation 搬送装置、電子部品ハンドリング装置および電子部品ハンドリング装置における搬送方法
NO326223B1 (no) * 2003-10-29 2008-10-20 Weatherford Lamb Apparat og fremgangsmate for a redusere borevibrasjon ved boring med fôringsror
JP2005218203A (ja) * 2004-01-28 2005-08-11 Shinkawa Ltd アクチュエータ及びボンディング装置
JP4576875B2 (ja) * 2004-04-30 2010-11-10 シンフォニアテクノロジー株式会社 リニアアクチュエータおよびチップマウンタ
JP4736355B2 (ja) * 2004-06-08 2011-07-27 パナソニック株式会社 部品実装方法
TW200604060A (en) * 2004-06-11 2006-02-01 Assembleon Nv Component placement apparatus, component feeding apparatus and method
JP2009200296A (ja) * 2008-02-22 2009-09-03 Osaki Engineering Co Ltd 半導体チップの受け渡しシステム
CN102142651B (zh) * 2010-01-28 2013-04-03 崧腾企业股份有限公司 自动化的插口生产系统及其自动化生产的方法
CN101847817B (zh) * 2010-03-31 2012-01-04 中航光电科技股份有限公司 一种电连接器自动装配方法及电连接器自动装配机
JP5597050B2 (ja) * 2010-07-15 2014-10-01 富士機械製造株式会社 基板停止位置制御方法および装置、ならびに基板装着位置制御方法
KR101044622B1 (ko) * 2011-01-14 2011-06-29 주식회사 아이. 피. 에스시스템 반도체 칩 본딩장치
JP5638978B2 (ja) * 2011-02-18 2014-12-10 Juki株式会社 マウンタ装置の加圧制御ヘッド
CN102500725B (zh) * 2011-11-16 2013-10-09 宁波市新泽谷机械有限公司 一种电子元件的运送机构
JP2013115229A (ja) * 2011-11-29 2013-06-10 Panasonic Corp 部品実装方法及び部品実装システム
JP2013135049A (ja) * 2011-12-26 2013-07-08 Samsung Techwin Co Ltd 電子部品実装装置
CN103182642B (zh) * 2011-12-29 2017-03-15 富泰华工业（深圳）有限公司 自动安装装置及带有该自动安装装置的电子设备
CN103249293B (zh) * 2012-02-08 2018-05-29 Juki株式会社 电子部件安装装置、电子部件安装系统以及电子部件安装方法
JP5925510B2 (ja) * 2012-02-08 2016-05-25 Juki株式会社 電子部品実装装置及び電子部品実装方法
TWI459165B (zh) * 2012-03-14 2014-11-01 Giga Byte Tech Co Ltd 零件辨識系統及零件辨識方法
JP2013240858A (ja) * 2012-05-21 2013-12-05 Azbil Corp 部品組み立て装置
JP2013240857A (ja) * 2012-05-21 2013-12-05 Azbil Corp 部品組み立て装置
CN102658532B (zh) * 2012-05-31 2014-04-23 中国科学院自动化研究所 薄壁圆柱筒形零件的内壁夹持装置和方法
TWI493201B (zh) * 2012-11-09 2015-07-21 Ind Tech Res Inst 電子零件腳位判斷與插件之方法與系統
US9036354B2 (en) * 2013-01-15 2015-05-19 Flextronics, Ap, Llc Heat sink thermal press for phase change heat sink material
EP2981163B1 (de) * 2013-03-26 2020-02-26 FUJI Corporation Komponentenmontagesystem für elektronische schaltungen
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
JP6574102B2 (ja) * 2014-07-11 2019-09-11 Juki株式会社 部品実装装置及び部品実装方法
JP6031544B2 (ja) 2015-03-02 2016-11-24 Thk株式会社 押付装置
JP6598011B2 (ja) * 2015-10-13 2019-10-30 Ｔｈｋ株式会社 リニアモータ装置及び制御方法
EP3379911B1 (de) * 2015-11-18 2021-10-27 Fuji Corporation Arbeitsmaschine für substrate und einsetzverfahren
JP6845671B2 (ja) * 2016-11-30 2021-03-24 川崎重工業株式会社 部品実装装置及びその制御方法
EP3648562B1 (de) * 2017-06-26 2022-02-16 Fuji Corporation Vorrichtung zur montage von elektronischen bauteilen
EP3716747B1 (de) * 2017-11-22 2023-03-29 Fuji Corporation Montagesystem für elektronische komponenten und montageverfahren für elektronische komponenten
KR102249225B1 (ko) 2017-12-28 2021-05-10 주식회사 고영테크놀러지 기판에 삽입된 커넥터에 포함된 복수의 핀의 삽입 상태를 검사하는 방법 및 기판 검사 장치
JP7084738B2 (ja) * 2018-02-14 2022-06-15 川崎重工業株式会社 実装装置及び実装方法
CN109018515B (zh) * 2018-10-10 2020-09-25 浙江光跃环保科技股份有限公司 一种电子芯片多工位智能传送排放机器人
CN113732660B (zh) * 2021-08-16 2022-12-27 东莞长盈精密技术有限公司 辅料压装装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6065629U (ja) * 1983-10-14 1985-05-09 横河電機株式会社 ワイヤドツトカラ−レコ−ダ
JP2541220B2 (ja) * 1987-05-19 1996-10-09 ソニー株式会社 電子部品装着装置
US5285946A (en) 1991-10-11 1994-02-15 Sanyo Electric Co., Ltd. Apparatus for mounting components
JP3404957B2 (ja) * 1995-01-17 2003-05-12 安藤電気株式会社 コネクタ圧入装置の圧入制御方法
US5850112A (en) * 1996-02-08 1998-12-15 Krauss-Maffei Ag Linear motor
JP4014271B2 (ja) * 1998-01-09 2007-11-28 富士機械製造株式会社 プリント基板支持方法，プリント基板支持装置の製作方法および製作用治具

Also Published As

Publication number Publication date
JP2000133995A (ja) 2000-05-12
CN1325612A (zh) 2001-12-05
WO2000025564A2 (en) 2000-05-04
EP1125484B1 (de) 2004-12-15
WO2000025564A3 (en) 2000-08-10
EP1125484A2 (de) 2001-08-22
KR100618235B1 (ko) 2006-09-01
CN1205848C (zh) 2005-06-08
US6513233B1 (en) 2003-02-04
KR20010075664A (ko) 2001-08-09
DE69922687T2 (de) 2005-05-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8339 Ceased/non-payment of the annual fee