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DE69841678D1 - Gelenkroboter - Google Patents

Gelenkroboter

Info

Publication number
DE69841678D1
DE69841678D1 DE69841678T DE69841678T DE69841678D1 DE 69841678 D1 DE69841678 D1 DE 69841678D1 DE 69841678 T DE69841678 T DE 69841678T DE 69841678 T DE69841678 T DE 69841678T DE 69841678 D1 DE69841678 D1 DE 69841678D1
Authority
DE
Germany
Prior art keywords
articulated robot
articulated
robot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69841678T
Other languages
English (en)
Inventor
Haruhiro Tsuneda
Yasuyuki Kitahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Instruments Corp
Original Assignee
Nidec Sankyo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP29914597A external-priority patent/JPH11129175A/ja
Priority claimed from JP30472097A external-priority patent/JP3539537B2/ja
Application filed by Nidec Sankyo Corp filed Critical Nidec Sankyo Corp
Application granted granted Critical
Publication of DE69841678D1 publication Critical patent/DE69841678D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20341—Power elements as controlling elements
    • Y10T74/2036—Pair of power elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69841678T 1997-10-30 1998-10-21 Gelenkroboter Expired - Lifetime DE69841678D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29914597A JPH11129175A (ja) 1997-10-30 1997-10-30 多関節ロボット
JP30472097A JP3539537B2 (ja) 1997-11-06 1997-11-06 多関節ロボット

Publications (1)

Publication Number Publication Date
DE69841678D1 true DE69841678D1 (de) 2010-07-01

Family

ID=26561808

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69841678T Expired - Lifetime DE69841678D1 (de) 1997-10-30 1998-10-21 Gelenkroboter
DE69806326T Expired - Lifetime DE69806326T2 (de) 1997-10-30 1998-10-21 Gelenkroboter

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69806326T Expired - Lifetime DE69806326T2 (de) 1997-10-30 1998-10-21 Gelenkroboter

Country Status (3)

Country Link
US (2) US6491491B1 (de)
EP (2) EP0913236B1 (de)
DE (2) DE69841678D1 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6491491B1 (en) 1997-10-30 2002-12-10 Sankyo Seiki Mfg. Co., Ltd. Articulated robot
US6162008A (en) * 1999-06-08 2000-12-19 Varian Semiconductor Equipment Associates, Inc. Wafer orientation sensor
US8768516B2 (en) * 2009-06-30 2014-07-01 Intuitive Surgical Operations, Inc. Control of medical robotic system manipulator about kinematic singularities
US6570356B2 (en) * 2000-04-07 2003-05-27 Kawasaki Jukogyo Kabushiki Kaisha Robot system
WO2001078114A1 (en) 2000-04-07 2001-10-18 Varian Semiconductor Equipment Associates, Inc. WAFER ORIENTATION SENSOR FOR GaAs WAFERS
KR100428781B1 (ko) * 2001-04-16 2004-04-27 삼성전자주식회사 웨이퍼 이송 장치 및 그 이송 방법
FI112848B (fi) * 2002-07-12 2004-01-30 Finn Power Oy Valmistussolu sekä siirto- ja käsittelylaitteisto työkappaleita varten
US7572092B2 (en) * 2002-10-07 2009-08-11 Brooks Automation, Inc. Substrate alignment system
US6748293B1 (en) * 2003-03-24 2004-06-08 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for high speed object handling
US6944517B2 (en) * 2003-07-03 2005-09-13 Brooks Automation, Inc. Substrate apparatus calibration and synchronization procedure
JP3999712B2 (ja) * 2003-07-14 2007-10-31 川崎重工業株式会社 多関節ロボット
US7905960B2 (en) * 2004-03-24 2011-03-15 Jusung Engineering Co., Ltd. Apparatus for manufacturing substrate
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7255747B2 (en) 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7771151B2 (en) * 2005-05-16 2010-08-10 Muratec Automation Co., Ltd. Interface between conveyor and semiconductor process tool load port
US9248568B2 (en) 2005-07-11 2016-02-02 Brooks Automation, Inc. Unequal link SCARA arm
US7374525B2 (en) * 2006-01-25 2008-05-20 Protedyne Corporation SCARA-type robotic system
JP5044138B2 (ja) * 2006-04-17 2012-10-10 川崎重工業株式会社 搬送システムおよび加工設備
EP2021807B1 (de) * 2006-04-24 2013-06-12 Protedyne Corporation Robotersystem mit autonom bedienbaren werkzeugen
ATE504868T1 (de) * 2006-05-31 2011-04-15 Panasonic Corp Verfahren zur berechnung eines rotationsmittelpunktes, verfahren zur berechnung einer rotationsachse, verfahren zur erstellung eines programms, betriebsverfahren und robotergerät
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7950407B2 (en) 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
US8562271B2 (en) * 2007-05-18 2013-10-22 Brooks Automation, Inc. Compact substrate transport system
DE102011077546A1 (de) * 2011-06-15 2012-12-20 Technische Universität Berlin Verfahren zum Betreiben eines Roboters, Roboter und Robotersystem
US8768513B2 (en) * 2011-08-08 2014-07-01 Applied Materials, Inc. Systems having multi-linkage robots and methods to correct positional and rotational alignment in multi-linkage robots
JP5713047B2 (ja) * 2013-04-18 2015-05-07 株式会社安川電機 移動ロボット、移動ロボットの位置決めシステム、及び、移動ロボットの位置決め方法
EP3124185B1 (de) * 2014-03-27 2021-03-17 Panasonic Intellectual Property Management Co., Ltd. Robotersteuerungsverfahren
SG10201809399VA (en) 2014-06-12 2018-11-29 Play I Inc System and method for reinforcing programming education through robotic feedback
US10279470B2 (en) * 2014-06-12 2019-05-07 Play-i, Inc. System and method for facilitating program sharing
DE102016118462A1 (de) * 2016-09-29 2018-03-29 Asys Automatic Systems Gmbh & Co. Kg Handhabungsvorrichtung für Substrate, insbesondere Halbleitersubstrate
US12076854B2 (en) * 2021-03-18 2024-09-03 Applied Materials, Inc. Increased number of load ports on factory interface with robot that moves on track
JP2023138118A (ja) * 2022-03-18 2023-09-29 株式会社ダイヘン 搬送ロボット

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2554260B1 (fr) 1983-10-27 1987-10-30 Flonic Sa Appareil de lecture de cartes a memoire electronique
US4693663A (en) 1984-10-05 1987-09-15 Donaldson Company, Inc. Robot with articulated arm
EP0244202B1 (de) 1986-04-28 1994-09-21 Varian Associates, Inc. Transfersystem für Halbleiterscheiben
JPH04254351A (ja) * 1991-02-06 1992-09-09 Ishikawajima Harima Heavy Ind Co Ltd ハンドリングロボット
JP3030160B2 (ja) * 1992-04-28 2000-04-10 東京エレクトロン株式会社 真空処理装置
GB9306177D0 (en) 1993-03-25 1993-05-19 Amp Gmbh Smart card connector
US5587637A (en) * 1994-01-10 1996-12-24 Tatsumo Kabushiki Kaisha Robot arm device capable of conveying an article in circumferential and radial directions
EP0774732B1 (de) 1995-11-17 2006-01-18 Kabushiki Kaisha Toshiba Vorrichtung zur Kartenverarbeitung
US5746565A (en) * 1996-01-22 1998-05-05 Integrated Solutions, Inc. Robotic wafer handler
JPH09234681A (ja) * 1996-02-29 1997-09-09 Sony Corp 搬送装置
US5944476A (en) * 1997-03-26 1999-08-31 Kensington Laboratories, Inc. Unitary specimen prealigner and continuously rotatable multiple link robot arm mechanism
US6491491B1 (en) 1997-10-30 2002-12-10 Sankyo Seiki Mfg. Co., Ltd. Articulated robot
FR2774791B1 (fr) 1998-02-09 2000-03-03 Schlumberger Ind Sa Lecteur de cartes a memoire electronique protege contre le vandalisme

Also Published As

Publication number Publication date
US6491491B1 (en) 2002-12-10
US20010041129A1 (en) 2001-11-15
EP1219394A2 (de) 2002-07-03
EP1219394A3 (de) 2008-12-03
EP1219394B1 (de) 2010-05-19
EP0913236B1 (de) 2002-07-03
EP0913236A3 (de) 2000-05-10
DE69806326D1 (de) 2002-08-08
US20020048505A1 (en) 2002-04-25
EP0913236A2 (de) 1999-05-06
DE69806326T2 (de) 2003-03-06

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Legal Events

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8364 No opposition during term of opposition