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DE69807717D1 - Vorrichtung zur speicherung und zuführung von behältern - Google Patents

Vorrichtung zur speicherung und zuführung von behältern

Info

Publication number
DE69807717D1
DE69807717D1 DE69807717T DE69807717T DE69807717D1 DE 69807717 D1 DE69807717 D1 DE 69807717D1 DE 69807717 T DE69807717 T DE 69807717T DE 69807717 T DE69807717 T DE 69807717T DE 69807717 D1 DE69807717 D1 DE 69807717D1
Authority
DE
Germany
Prior art keywords
storing
feeding containers
containers
feeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69807717T
Other languages
English (en)
Other versions
DE69807717T2 (de
Inventor
Nobuya Matsumura
Hiroyuki Kiyomura
Kenichi Nishino
Kenji Takahashi
Shinji Kanayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69807717D1 publication Critical patent/DE69807717D1/de
Publication of DE69807717T2 publication Critical patent/DE69807717T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53317—Box or pallet assembly means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Pile Receivers (AREA)
  • De-Stacking Of Articles (AREA)
DE69807717T 1997-06-16 1998-06-15 Vorrichtung zur speicherung und zuführung von behältern Expired - Fee Related DE69807717T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15893397 1997-06-16
PCT/JP1998/002654 WO1998058401A1 (en) 1997-06-16 1998-06-15 Tray storing and feeding apparatus

Publications (2)

Publication Number Publication Date
DE69807717D1 true DE69807717D1 (de) 2002-10-10
DE69807717T2 DE69807717T2 (de) 2003-04-30

Family

ID=15682519

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69807717T Expired - Fee Related DE69807717T2 (de) 1997-06-16 1998-06-15 Vorrichtung zur speicherung und zuführung von behältern

Country Status (5)

Country Link
US (1) US6647616B1 (de)
EP (1) EP1012875B1 (de)
CN (1) CN1125483C (de)
DE (1) DE69807717T2 (de)
WO (1) WO1998058401A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050180844A1 (en) * 2004-02-18 2005-08-18 Delta Design, Inc. Device handling system and method
TWI399823B (zh) * 2005-07-09 2013-06-21 Tec Sem Ag 用以存放基板之裝置
US7544038B2 (en) * 2006-04-27 2009-06-09 National Optronics, Inc. Tray stacking and unstacking corner grippers and handler
JP4243646B2 (ja) * 2007-01-25 2009-03-25 パナソニック株式会社 段積みトレイの供給装置及び供給方法、並びに部品実装装置及び方法
JP4831028B2 (ja) * 2007-09-13 2011-12-07 パナソニック株式会社 部品実装用装置の台車位置決め機構及び部品実装用装置用の台車
KR100884329B1 (ko) * 2008-06-05 2009-02-18 안지영 포장제품 이송장치
FR2939421B1 (fr) * 2008-12-05 2011-01-14 Datacard Corp Dispositif ascenseur pour machine de personnalisation et machine de personnalisation munie d'un dispositif ascenseur
EP2466599A1 (de) 2010-12-15 2012-06-20 Eaton Industries (Netherlands) B.V. Elektromagnetischer Auslöser mit Unterspannungsfreigabe
JP5628099B2 (ja) * 2011-06-13 2014-11-19 株式会社 東京ウエルズ キャリアテープ巻取収納装置及びキャリアテープ巻取収納方法
CN102963753B (zh) * 2012-11-02 2016-03-30 无锡明珠增压器制造有限公司 电路基板堆叠机
CN103144797B (zh) * 2013-03-04 2014-09-17 江苏迅捷装具科技有限公司 用于发篮机的分取装置
US10537989B2 (en) 2015-05-11 2020-01-21 Sidel Canada Vertical accumulation in a treatment line
CN106185138B (zh) * 2015-07-20 2018-06-01 亚洲硅业（青海）有限公司 一种密闭式硅芯自动存取装置
CN105555117A (zh) * 2015-12-14 2016-05-04 苏州索力旺新能源科技有限公司 接线盒生产的导电片送料装置
US10227201B2 (en) * 2015-12-16 2019-03-12 Toshiba International Corporation Automated mail tray loading system and method
CN107319920A (zh) * 2017-08-14 2017-11-07 王晓杰 一种小型即食面条制售机
WO2019146093A1 (ja) * 2018-01-29 2019-08-01 株式会社Ｆｕｊｉ トレイ方式部品供給装置
WO2020241237A1 (ja) * 2019-05-28 2020-12-03 横浜ゴム株式会社 タイヤ
JP7507415B2 (ja) * 2020-07-01 2024-06-28 パナソニックＩｐマネジメント株式会社 部品装着装置、トレイフィーダおよびマガジン
US12198956B2 (en) 2020-07-31 2025-01-14 Taiwan Semiconductor Manufacturing Company Limited Semiconductor storage apparatus with integrated sorter
JP7619778B2 (ja) 2020-10-01 2025-01-22 ニデックインスツルメンツ株式会社 搬送システム
CN112520427B (zh) * 2020-11-09 2023-03-28 宁波阅荷思山智能科技有限公司 一种磁控式精密防磨损卡片送料装置
EP4534458A1 (de) * 2023-10-06 2025-04-09 Dimark Manufacture Spolka Akcyjna Vorrichtung zum trennen von behältern, insbesondere für behälter in sicherheitsinspektionssystemen und sicherheitsinspektionssystem

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3308977A (en) * 1965-10-04 1967-03-14 Ibm Automatic tray handler
WO1993002952A1 (en) * 1991-08-05 1993-02-18 Symtek Systems, Inc. Input/output apparatus for electronic device handlers
JPH0986666A (ja) * 1995-09-28 1997-03-31 Rohm Co Ltd 電子部品用トレイの分離装置
JPH09110170A (ja) * 1995-10-18 1997-04-28 Rohm Co Ltd 電子部品用トレイの分離装置
JP2962222B2 (ja) * 1996-03-22 1999-10-12 松下電器産業株式会社 電子部品実装装置
JP3711301B2 (ja) * 1996-05-29 2005-11-02 株式会社ルネサステクノロジ Ｉｃ着脱装置及びその着脱ヘッド

Also Published As

Publication number Publication date
EP1012875B1 (de) 2002-09-04
CN1125483C (zh) 2003-10-22
WO1998058401A1 (en) 1998-12-23
DE69807717T2 (de) 2003-04-30
EP1012875A1 (de) 2000-06-28
US6647616B1 (en) 2003-11-18
CN1260905A (zh) 2000-07-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee