DE69734537D1 - Micro relays and method for its manufacture - Google Patents

Micro relays and method for its manufacture

Info

Publication number: DE69734537D1
Authority: DE; Germany
Prior art keywords: manufacture; micro relays; relays; micro
Prior art date: 1996-08-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE69734537T

Other languages

German (de)

Other versions

DE69734537T2 (en

Inventor

Minoru Sakata

Takuya Nakajima

Tomonori Seki

Teruhiko Fujiwara

Masashi Takeuchi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Omron Corp

Original Assignee

Omron Corp

Omron Tateisi Electronics Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1996-08-27

Filing date

1997-08-26

Publication date

2005-12-08

1997-08-26 Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp

2005-12-08 Application granted granted Critical

2005-12-08 Publication of DE69734537D1 publication Critical patent/DE69734537D1/en

2006-08-10 Publication of DE69734537T2 publication Critical patent/DE69734537T2/en

2017-08-27 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H57/00—Electrostrictive relays; Piezoelectric relays
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/01—Switches
- B81B2201/012—Switches characterised by the shape
- B81B2201/016—Switches characterised by the shape having a bridge fixed on two ends and connected to one or more dimples
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/09—Packages
- B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
- B81B2207/094—Feed-through, via
- B81B2207/095—Feed-through, via through the lid
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
- H01H1/14—Contacts characterised by the manner in which co-operating contacts engage by abutting
- H01H1/20—Bridging contacts
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
- H01H2001/0042—Bistable switches, i.e. having two stable positions requiring only actuating energy for switching between them, e.g. with snap membrane or by permanent magnet
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
- H01H2001/0084—Switches making use of microelectromechanical systems [MEMS] with perpendicular movement of the movable contact relative to the substrate
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H57/00—Electrostrictive relays; Piezoelectric relays
- H01H2057/006—Micromechanical piezoelectric relay
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H61/00—Electrothermal relays
- H01H2061/006—Micromechanical thermal relay
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H59/00—Electrostatic relays; Electro-adhesion relays
- H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H61/00—Electrothermal relays
- H01H61/02—Electrothermal relays wherein the thermally-sensitive member is heated indirectly, e.g. resistively, inductively
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H67/00—Electrically-operated selector switches
- H01H67/22—Switches without multi-position wipers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/52—Cooling of switch parts

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Electromagnetism (AREA)
Computer Hardware Design (AREA)
Micromachines (AREA)
Contacts (AREA)
Thermally Actuated Switches (AREA)

DE69734537T 1996-08-27 1997-08-26 Micro-relay and method for its production Expired - Lifetime DE69734537T2 (en)

Applications Claiming Priority (6)

Application Number	Priority Date	Filing Date	Title
JP22484596		1996-08-27
JP22528696		1996-08-27
JP22528896		1996-08-27
JP22528896		1996-08-27
JP22528696		1996-08-27
JP22484596		1996-08-27

Publications (2)

Publication Number	Publication Date
DE69734537D1 true DE69734537D1 (en)	2005-12-08
DE69734537T2 DE69734537T2 (en)	2006-08-10

Family

ID=27330966

Family Applications (3)

Application Number	Title	Priority Date	Filing Date
DE69737798T Expired - Lifetime DE69737798D1 (en)	1996-08-27	1997-08-26	A matrix relay
DE69734537T Expired - Lifetime DE69734537T2 (en)	1996-08-27	1997-08-26	Micro-relay and method for its production
DE69735210T Active DE69735210T8 (en)	1996-08-27	1997-08-26	Micro-relay and method for its production

Family Applications Before (1)

Application Number	Title	Priority Date	Filing Date
DE69737798T Expired - Lifetime DE69737798D1 (en)	1996-08-27	1997-08-26	A matrix relay

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
DE69735210T Active DE69735210T8 (en)	1996-08-27	1997-08-26	Micro-relay and method for its production

Country Status (8)

Country	Link
US (2)	US6407482B2 (en)
EP (3)	EP0923099B1 (en)
JP (1)	JP3590872B2 (en)
KR (1)	KR100329246B1 (en)
CN (2)	CN1222972C (en)
DE (3)	DE69737798D1 (en)
TW (1)	TW379346B (en)
WO (1)	WO1998009312A1 (en)

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US8008739B2 (en)	2005-12-26	2011-08-30	Kyocera Corporation	Microelectromechanical apparatus and method for producing the same
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JP2008207306A (en) *	2007-02-28	2008-09-11	Fujitsu Ltd	Method for manufacturing packaged micro movable device and packaged micro movable device
EP2277185A1 (en) *	2008-05-12	2011-01-26	Nxp B.V.	Mems devices
JP4864152B2 (en) *	2009-07-23	2012-02-01	日本電波工業株式会社	Surface mount crystal unit
JP5471640B2 (en) *	2010-03-12	2014-04-16	富士通株式会社	Method for manufacturing MEMS device and substrate
GB2489186B (en)	2010-03-30	2017-05-24	Ibm	Integrated electro-mechanical actuator
DE102011108708A1 (en) *	2010-09-25	2012-03-29	Merck Patent Gmbh	Liquid crystal displays and liquid crystal media with homeotropic alignment
WO2013167176A1 (en) *	2012-05-08	2013-11-14	Peter Jeney	Thermal power cell and apparatus based thereon
US9589937B2 (en) *	2014-08-08	2017-03-07	Wuhan Xinxin Semiconductor Manufacturing Co., Ltd	Semiconductor cooling method and method of heat dissipation
CN110024172B (en) *	2016-12-05	2022-01-11	丰田自动车株式会社	Relay unit
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1997
- 1997-08-26 DE DE69737798T patent/DE69737798D1/en not_active Expired - Lifetime
- 1997-08-26 EP EP97936864A patent/EP0923099B1/en not_active Expired - Lifetime
- 1997-08-26 CN CNB011408774A patent/CN1222972C/en not_active Expired - Fee Related
- 1997-08-26 DE DE69734537T patent/DE69734537T2/en not_active Expired - Lifetime
- 1997-08-26 JP JP51146998A patent/JP3590872B2/en not_active Expired - Lifetime
- 1997-08-26 KR KR1019997001582A patent/KR100329246B1/en not_active IP Right Cessation
- 1997-08-26 US US09/254,030 patent/US6407482B2/en not_active Expired - Lifetime
- 1997-08-26 DE DE69735210T patent/DE69735210T8/en active Active
- 1997-08-26 WO PCT/JP1997/002964 patent/WO1998009312A1/en active IP Right Grant
- 1997-08-26 EP EP04028872A patent/EP1517344B1/en not_active Expired - Lifetime
- 1997-08-26 EP EP03023641A patent/EP1394826B1/en not_active Expired - Lifetime
- 1997-08-26 CN CN97198654A patent/CN1082237C/en not_active Expired - Fee Related
- 1997-08-26 TW TW086112243A patent/TW379346B/en not_active IP Right Cessation
2002
- 2002-04-24 US US10/128,542 patent/US6603238B2/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
DE69734537T2 (en)	2006-08-10
KR100329246B1 (en)	2002-03-18
EP1517344B1 (en)	2007-06-06
CN1222972C (en)	2005-10-12
EP0923099A1 (en)	1999-06-16
EP0923099A4 (en)	2000-08-16
EP1394826A2 (en)	2004-03-03
EP1517344A1 (en)	2005-03-23
KR20000035875A (en)	2000-06-26
EP1394826A3 (en)	2004-07-07
CN1378224A (en)	2002-11-06
JP3590872B2 (en)	2004-11-17
US20020117937A1 (en)	2002-08-29
US20020008444A1 (en)	2002-01-24
DE69737798D1 (en)	2007-07-19
DE69735210T2 (en)	2006-11-02
DE69735210D1 (en)	2006-04-13
EP0923099B1 (en)	2006-02-01
TW379346B (en)	2000-01-11
EP1394826B1 (en)	2005-11-02
WO1998009312A1 (en)	1998-03-05
CN1082237C (en)	2002-04-03
DE69735210T8 (en)	2007-03-08
US6407482B2 (en)	2002-06-18
US6603238B2 (en)	2003-08-05
CN1233343A (en)	1999-10-27

Publication	Publication Date	Title
DE69734537D1 (en)	2005-12-08	Micro relays and method for its manufacture
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Legal Events

Date	Code	Title	Description
2006-11-23	8364	No opposition during term of opposition