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DE69638090D1 - Mehrschichtige Leiterplatte - Google Patents

Mehrschichtige Leiterplatte

Info

Publication number
DE69638090D1
DE69638090D1 DE69638090T DE69638090T DE69638090D1 DE 69638090 D1 DE69638090 D1 DE 69638090D1 DE 69638090 T DE69638090 T DE 69638090T DE 69638090 T DE69638090 T DE 69638090T DE 69638090 D1 DE69638090 D1 DE 69638090D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
multilayer printed
multilayer
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69638090T
Other languages
English (en)
Inventor
Motoo Asai
Akihito Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Application granted granted Critical
Publication of DE69638090D1 publication Critical patent/DE69638090D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE69638090T 1996-12-13 1996-12-13 Mehrschichtige Leiterplatte Expired - Lifetime DE69638090D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06010683A EP1696714B1 (de) 1996-12-13 1996-12-13 Mehrschichtige Leiterplatte
PCT/JP1996/003655 WO1998026639A1 (fr) 1995-06-16 1996-12-13 Circuit imprime multicouches

Publications (1)

Publication Number Publication Date
DE69638090D1 true DE69638090D1 (de) 2010-01-14

Family

ID=14154223

Family Applications (3)

Application Number Title Priority Date Filing Date
DE69637558T Expired - Lifetime DE69637558D1 (de) 1996-12-13 1996-12-13 Mehrlagen gedruckte Schaltungsplatte
DE69636329T Expired - Lifetime DE69636329T2 (de) 1996-12-13 1996-12-13 Mehrschichtige gedruckte leiterplatte
DE69638090T Expired - Lifetime DE69638090D1 (de) 1996-12-13 1996-12-13 Mehrschichtige Leiterplatte

Family Applications Before (2)

Application Number Title Priority Date Filing Date
DE69637558T Expired - Lifetime DE69637558D1 (de) 1996-12-13 1996-12-13 Mehrlagen gedruckte Schaltungsplatte
DE69636329T Expired - Lifetime DE69636329T2 (de) 1996-12-13 1996-12-13 Mehrschichtige gedruckte leiterplatte

Country Status (4)

Country Link
US (1) US6326556B1 (de)
EP (3) EP1701601B1 (de)
DE (3) DE69637558D1 (de)
WO (1) WO1998026639A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6613413B1 (en) 1999-04-26 2003-09-02 International Business Machines Corporation Porous power and ground planes for reduced PCB delamination and better reliability
EP1137332B1 (de) 1999-09-02 2006-11-22 Ibiden Co., Ltd. Leiterplatte, verfahren zu ihrer herstellung und kondensator zur integration in der leiterplatte
EP2265101B1 (de) * 1999-09-02 2012-08-29 Ibiden Co., Ltd. Leiterplatte und Verfahren zur Herstellung einer Leiterplatte
US6683260B2 (en) * 2000-07-04 2004-01-27 Matsushita Electric Industrial Co., Ltd. Multilayer wiring board embedded with transmission line conductor
EP1369139A1 (de) 2002-06-03 2003-12-10 3M Innovative Properties Company Dosis-Anzeigegeräte und Sprüheinrichtungen bestehend aus Kanister und Anzeigegerät
JP4665531B2 (ja) * 2005-01-27 2011-04-06 日立電線株式会社 配線板の製造方法
JP4468191B2 (ja) * 2005-01-27 2010-05-26 株式会社日立製作所 金属構造体及びその製造方法
CN102239753B (zh) * 2008-12-05 2013-11-06 揖斐电株式会社 多层印刷线路板和多层印刷线路板的制造方法
CN102293049B (zh) 2009-01-21 2013-08-07 Lg化学株式会社 发热体及其制备方法
JP6081693B2 (ja) * 2011-09-12 2017-02-15 新光電気工業株式会社 配線基板及び配線基板の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1502977A (en) * 1975-09-19 1978-03-08 Int Computers Ltd Multilayer printed circuit boards
JPS54113863A (en) 1978-02-24 1979-09-05 Univ Tokai Printed circuit board
JPS54149646U (de) * 1978-04-11 1979-10-18
JPS54149646A (en) 1978-05-16 1979-11-24 Ricoh Co Ltd Partially coloring zerography and apparatus therefor
JPS54150675A (en) 1978-05-19 1979-11-27 Hitachi Ltd Construction of transmission system for thick film board
US4575663A (en) 1984-09-07 1986-03-11 The Babcock & Wilcox Company Microprocessor based two speed motor control interface
JPS61106079U (de) * 1984-12-18 1986-07-05
US5061547A (en) * 1986-03-28 1991-10-29 Boris Plesinger Structure of conductive layers in multilayer substrates for minimizing blisters and delaminations
US4855537A (en) * 1987-09-25 1989-08-08 Kabushiki Kaisha Toshiba Wiring substrate having mesh-shaped earth line
DE3913966B4 (de) * 1988-04-28 2005-06-02 Ibiden Co., Ltd., Ogaki Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung
JPH0397973A (ja) 1989-09-05 1991-04-23 George Martin Textiles Ltd パイル織物の製造装置及びその製造方法
JPH0397973U (de) * 1990-01-29 1991-10-09
JPH06291216A (ja) * 1993-04-05 1994-10-18 Sony Corp 基板及びセラミックパッケージ
JPH07202359A (ja) 1993-12-30 1995-08-04 Sony Corp 回路基板
JPH07321463A (ja) 1994-05-25 1995-12-08 Toshiba Corp 薄膜多層配線基板
JPH098465A (ja) 1995-06-16 1997-01-10 Ibiden Co Ltd 多層プリント配線板

Also Published As

Publication number Publication date
EP1701601A2 (de) 2006-09-13
EP1696714A2 (de) 2006-08-30
DE69637558D1 (de) 2008-07-17
EP0949854B1 (de) 2006-07-05
EP1696714A3 (de) 2007-04-18
WO1998026639A1 (fr) 1998-06-18
EP1701601A3 (de) 2007-03-28
DE69636329T2 (de) 2006-11-02
EP1701601B1 (de) 2008-06-04
EP0949854A1 (de) 1999-10-13
EP0949854A4 (de) 2005-05-25
DE69636329D1 (de) 2006-08-17
US6326556B1 (en) 2001-12-04
EP1696714B1 (de) 2009-12-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition