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DE69637838D1 - System und Verfahren zur Beschichtung der Unterseite von Flip-Chips - Google Patents

System und Verfahren zur Beschichtung der Unterseite von Flip-Chips

Info

Publication number
DE69637838D1
DE69637838D1 DE69637838T DE69637838T DE69637838D1 DE 69637838 D1 DE69637838 D1 DE 69637838D1 DE 69637838 T DE69637838 T DE 69637838T DE 69637838 T DE69637838 T DE 69637838T DE 69637838 D1 DE69637838 D1 DE 69637838D1
Authority
DE
Germany
Prior art keywords
underside
coating
flip chips
flip
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69637838T
Other languages
English (en)
Inventor
Carlos E Bouras
Andre S Gamelin
Mark S Meier
Duong T La
Alan R Lewis
Alec J Babiarz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nordson Corp
Original Assignee
Nordson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24166389&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69637838(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nordson Corp filed Critical Nordson Corp
Application granted granted Critical
Publication of DE69637838D1 publication Critical patent/DE69637838D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B05C11/101—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to weight of a container for liquid or other fluent material; responsive to level of liquid or other fluent material in a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B05C11/1018—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to distance of target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B05C11/1021—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to presence or shape of target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Coating Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE69637838T 1995-10-13 1996-10-08 System und Verfahren zur Beschichtung der Unterseite von Flip-Chips Expired - Lifetime DE69637838D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54305295A 1995-10-13 1995-10-13

Publications (1)

Publication Number Publication Date
DE69637838D1 true DE69637838D1 (de) 2009-04-02

Family

ID=24166389

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69637838T Expired - Lifetime DE69637838D1 (de) 1995-10-13 1996-10-08 System und Verfahren zur Beschichtung der Unterseite von Flip-Chips
DE69631428T Expired - Lifetime DE69631428T2 (de) 1995-10-13 1996-10-08 System und verfahren zur beschichtung der unterseite von flip chips

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69631428T Expired - Lifetime DE69631428T2 (de) 1995-10-13 1996-10-08 System und verfahren zur beschichtung der unterseite von flip chips

Country Status (7)

Country Link
US (3) US5906682A (de)
EP (2) EP1256387B1 (de)
JP (2) JP3280385B2 (de)
AU (1) AU7262496A (de)
CA (2) CA2232973C (de)
DE (2) DE69637838D1 (de)
WO (1) WO1997013586A1 (de)

Families Citing this family (127)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69637838D1 (de) * 1995-10-13 2009-04-02 Nordson Corp System und Verfahren zur Beschichtung der Unterseite von Flip-Chips
US6412328B1 (en) 1996-10-25 2002-07-02 Speedline Technologies, Inc. Method and apparatus for measuring the size of drops of a viscous material dispensed from a dispensing system
US5918648A (en) * 1997-02-21 1999-07-06 Speedline Techologies, Inc. Method and apparatus for measuring volume
US6093251A (en) * 1997-02-21 2000-07-25 Speedline Technologies, Inc. Apparatus for measuring the height of a substrate in a dispensing system
US5957343A (en) * 1997-06-30 1999-09-28 Speedline Technologies, Inc. Controllable liquid dispensing device
US6085943A (en) 1997-06-30 2000-07-11 Speedline Technologies, Inc. Controllable liquid dispensing device
US6260407B1 (en) * 1998-04-03 2001-07-17 Symyx Technologies, Inc. High-temperature characterization of polymers
US6324440B1 (en) * 1998-12-29 2001-11-27 Lek Technologies, Llc Apparatus for fabricating surface structures
US6220503B1 (en) 1999-02-02 2001-04-24 International Business Machines Corporation Rework and underfill nozzle for electronic components
US6330485B1 (en) * 1999-02-03 2001-12-11 Industrial Technology Research Institute High-speed multi-task system
US20020014688A1 (en) * 1999-03-03 2002-02-07 Suresh Ramalingam Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials
GB2354528B (en) * 1999-09-25 2004-03-10 Trikon Holdings Ltd Delivery of liquid precursors to semiconductor processing reactors
US6692572B1 (en) 1999-09-13 2004-02-17 Precision Valve & Automation, Inc. Active compensation metering system
US6541063B1 (en) * 1999-11-04 2003-04-01 Speedline Technologies, Inc. Calibration of a dispensing system
JP3992893B2 (ja) * 1999-12-02 2007-10-17 富士通株式会社 半導体装置のアンダーフィル方法
US6444035B1 (en) * 2000-01-28 2002-09-03 Speedline Technologies, Inc. Conveyorized vacuum injection system
US6660086B1 (en) * 2000-03-06 2003-12-09 Innovative Coatings, Inc. Method and apparatus for extruding a coating upon a substrate surface
JP3678974B2 (ja) * 2000-03-29 2005-08-03 富士通ディスプレイテクノロジーズ株式会社 液晶表示装置の製造方法
JP4456234B2 (ja) * 2000-07-04 2010-04-28 パナソニック株式会社 バンプ形成方法
US6506671B1 (en) * 2000-06-08 2003-01-14 Micron Technology, Inc. Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad
JP2002096013A (ja) * 2000-09-26 2002-04-02 Fujitsu Ltd 樹脂塗布方法
ATE486663T1 (de) * 2001-06-01 2010-11-15 Ulvac Inc Wellengenerator für ein mikroabscheidungs- steuersystem
US10683494B2 (en) * 2001-11-01 2020-06-16 Pthera LLC Enhanced stem cell therapy and stem cell production through the administration of low level light energy
US7303578B2 (en) 2001-11-01 2007-12-04 Photothera, Inc. Device and method for providing phototherapy to the brain
TWI285563B (en) * 2002-01-24 2007-08-21 Three Bond Co Ltd Material coating device
US6861278B2 (en) 2002-04-11 2005-03-01 Nordson Corporation Method and apparatus for underfilling semiconductor devices
US6645547B1 (en) * 2002-05-02 2003-11-11 Labcoat Ltd. Stent coating device
US6991825B2 (en) * 2002-05-10 2006-01-31 Asm Assembly Automation Ltd. Dispensation of controlled quantities of material onto a substrate
US7256833B2 (en) * 2002-05-22 2007-08-14 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Method and apparatus for automatically optimizing optical contrast in automated equipment
US20030236489A1 (en) 2002-06-21 2003-12-25 Baxter International, Inc. Method and apparatus for closed-loop flow control system
US20040023439A1 (en) * 2002-07-03 2004-02-05 Kazunari Kimino Apparatus and method for manufacturing semiconductor device
CA2520368C (en) * 2002-11-07 2012-09-25 Abbott Laboratories Method of loading beneficial agent to a prosthesis by fluid-jet application
KR100618576B1 (ko) * 2002-11-13 2006-08-31 엘지.필립스 엘시디 주식회사 액정 표시패널의 디스펜서 및 이를 이용한 디스펜싱 방법
KR100724475B1 (ko) * 2002-11-13 2007-06-04 엘지.필립스 엘시디 주식회사 액정 표시패널의 실 디스펜서 및 이를 이용한 실 패턴의단선 검출방법
US20040148763A1 (en) * 2002-12-11 2004-08-05 Peacock David S. Dispensing system and method
JP4200758B2 (ja) * 2002-12-26 2008-12-24 株式会社日立ハイテクノロジーズ パネルの樹脂塗布方法、ディスプレイ用パネルの製造方法及び樹脂塗布装置
US7204960B2 (en) * 2003-03-03 2007-04-17 Asm Assembly Automation Ltd. Apparatus and method for calibration of a dispensing system
US20040186621A1 (en) * 2003-03-19 2004-09-23 Nordson Corporation Method of implementing multiple pump speeds for dispensing a viscous material
EP1463342A1 (de) * 2003-03-27 2004-09-29 Dialog Semiconductor GmbH Testsystem für Kameramodule
US20040224541A1 (en) * 2003-05-09 2004-11-11 Murata Co., Ltd. Apparatus and method for forming solder wicking prevention zone and electronic part
US20050001869A1 (en) * 2003-05-23 2005-01-06 Nordson Corporation Viscous material noncontact jetting system
US20040247775A1 (en) * 2003-06-06 2004-12-09 Boulais Dennis R. Positive displacement coating deposition apparatus and method
EP1654072A4 (de) * 2003-07-14 2007-10-03 Nordson Corp Vorrichtung und verfahren zur abgabe einzelner mengen von viskosem material
US7964237B2 (en) * 2003-08-21 2011-06-21 International Business Machines Corporation Fully automated paste dispense process for dispensing small dots and lines
US20050095367A1 (en) * 2003-10-31 2005-05-05 Babiarz Alec J. Method of noncontact dispensing of viscous material
US20050095366A1 (en) * 2003-10-31 2005-05-05 Liang Fang Method of conformal coating using noncontact dispensing
JP4320266B2 (ja) * 2004-01-22 2009-08-26 シスメックス株式会社 分注装置およびそれを備えた分析装置
TWI547431B (zh) * 2004-06-09 2016-09-01 史密斯克萊美占公司 生產藥物之裝置及方法
US8101244B2 (en) * 2004-06-09 2012-01-24 Smithkline Beecham Corporation Apparatus and method for producing or processing a product or sample
US20060029724A1 (en) * 2004-08-06 2006-02-09 Nordson Corporation System for jetting phosphor for optical displays
WO2006029017A1 (en) * 2004-09-03 2006-03-16 Symyx Technologies, Inc. System and method for rapid chromatography with fluid temperature and mobile phase composition control
US20060065671A1 (en) * 2004-09-24 2006-03-30 Nordson Corporation Self-contained adhesive metering apparatus
EP1648181A1 (de) * 2004-10-12 2006-04-19 Dialog Semiconductor GmbH Einzelbildabspeichervorrichtung
US7510895B2 (en) * 2004-10-29 2009-03-31 Nordson Corporation Inferential temperature control system
US20060249542A1 (en) * 2005-04-26 2006-11-09 Allen Randall E Dispensing device for materials, method and system of use thereof
US7575633B2 (en) * 2005-05-17 2009-08-18 Nordson Corporation Fluid dispenser with positive displacement pump
JP4477062B2 (ja) * 2005-05-17 2010-06-09 パナソニック株式会社 フリップチップ実装方法
US20070020475A1 (en) * 2005-07-21 2007-01-25 Prince Kendall W Primed substrate and method for making the same
JP4914589B2 (ja) * 2005-08-26 2012-04-11 三菱電機株式会社 半導体製造装置、半導体製造方法および半導体装置
DE102005058852B4 (de) * 2005-12-09 2009-12-24 Daimler Ag Verfahren und Vorrichtung zum Auftrag einer pastösen Masse
US20070145164A1 (en) * 2005-12-22 2007-06-28 Nordson Corporation Jetting dispenser with multiple jetting nozzle outlets
US20070164089A1 (en) * 2006-01-19 2007-07-19 Nordson Corporation Method of dispensing small amounts of liquid material
US20070226995A1 (en) * 2006-03-30 2007-10-04 Gregory Alan Bone System and method for adhering large semiconductor applications to pcb
TW200800411A (en) * 2006-06-28 2008-01-01 Nordson Corp Conformal coating system with closed loop control
US8110438B2 (en) * 2006-08-11 2012-02-07 Texas Instruments Incorporated Thermal method to control underfill flow in semiconductor devices
JP4868515B2 (ja) * 2006-11-01 2012-02-01 武蔵エンジニアリング株式会社 液体材料の充填方法、装置およびプログラム
US7963246B1 (en) * 2007-08-14 2011-06-21 Henline Adhesive Equipment Co., Inc. Apparatus for controlled application of an adhesive bead to a workpiece
JP2011507675A (ja) * 2007-11-29 2011-03-10 ノードソン コーポレーション 粘性材料を吐出する方法
US8740013B2 (en) * 2008-04-01 2014-06-03 Pfp Control Technologies, Llc Variable flow air flow controller
US8272537B2 (en) * 2008-04-17 2012-09-25 Nordson Corporation Valveless liquid dispenser
US9289795B2 (en) 2008-07-01 2016-03-22 Precision Coating Innovations, Llc Pressurization coating systems, methods, and apparatuses
US20100021622A1 (en) * 2008-07-24 2010-01-28 National Chiao Tung University Apparatus and method for forming multilayer polymer thin film
US20100062169A1 (en) * 2008-09-08 2010-03-11 JN Machinery Coating high temperature parts with polymer
KR101615509B1 (ko) 2008-09-18 2016-04-26 노드슨 코포레이션 자동화 진공 이용 밸브 프라이밍 시스템 및 사용 방법
KR20120004441A (ko) * 2009-03-19 2012-01-12 다즈모 가부시키가이샤 기판용 도포 장치
MY147815A (en) * 2009-04-30 2013-01-31 Freescale Semiconductor Inc Underfill dispensing system for integrated circuits
WO2011123503A1 (en) 2010-04-01 2011-10-06 B & H Manufacturing Company, Inc. Extrusion application system
US9309019B2 (en) 2010-05-21 2016-04-12 Adhezion Biomedical, Llc Low dose gamma sterilization of liquid adhesives
US8389041B2 (en) 2010-06-17 2013-03-05 Abbott Cardiovascular Systems, Inc. Systems and methods for rotating and coating an implantable device
US8550737B2 (en) 2010-09-20 2013-10-08 Adhezion Biomedical, Llc Applicators for dispensing adhesive or sealant material
US8689732B1 (en) * 2011-04-29 2014-04-08 Glasscraft Door Company Automated system for making a component with a wood grained appearance
US9061316B2 (en) * 2011-10-28 2015-06-23 Nordson Corporation Mountable device for dispensing heated adhesive
US9066711B2 (en) 2011-11-02 2015-06-30 Adhezion Biomedical, Llc Applicators for storing sterilizing, and dispensing an adhesive
US20130136850A1 (en) * 2011-11-29 2013-05-30 Illinois Tool Works Inc. Method for depositing materials on a substrate
JP5840959B2 (ja) 2012-01-16 2016-01-06 エムテックスマート株式会社 塗布方法及び装置
EP2843419A4 (de) * 2012-04-24 2016-03-30 Microjet Corp Entladungssystem und verfahren zur entladung durch ein entladungssystem
US9616457B2 (en) 2012-04-30 2017-04-11 Innovative Coatings, Inc. Pressurization coating systems, methods, and apparatuses
US9847265B2 (en) 2012-11-21 2017-12-19 Nordson Corporation Flow metering for dispense monitoring and control
US9393586B2 (en) * 2012-11-21 2016-07-19 Nordson Corporation Dispenser and method of dispensing and controlling with a flow meter
US11673155B2 (en) 2012-12-27 2023-06-13 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
US9352561B2 (en) 2012-12-27 2016-05-31 Kateeva, Inc. Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances
US9832428B2 (en) 2012-12-27 2017-11-28 Kateeva, Inc. Fast measurement of droplet parameters in industrial printing system
KR102039808B1 (ko) 2012-12-27 2019-11-01 카티바, 인크. 정밀 공차 내로 유체를 증착하기 위한 인쇄 잉크 부피 제어를 위한 기법
US11141752B2 (en) 2012-12-27 2021-10-12 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
US9700908B2 (en) 2012-12-27 2017-07-11 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
EP2826972B1 (de) * 2013-07-15 2016-04-20 Inergy Automotive Systems Research (Société Anonyme) Verfahren zur Überwachung der Harnstoffqualität eines SCR-Systems
US8944001B2 (en) 2013-02-18 2015-02-03 Nordson Corporation Automated position locator for a height sensor in a dispensing system
TW201434535A (zh) * 2013-03-05 2014-09-16 Genesis Photonics Inc 噴塗裝置
JP6295053B2 (ja) * 2013-09-27 2018-03-14 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
CN107878058B (zh) 2013-12-12 2020-04-24 科迪华公司 形成电子产品层的方法和设备
US9579678B2 (en) 2015-01-07 2017-02-28 Nordson Corporation Dispenser and method of dispensing and controlling with a flow meter
US9653325B2 (en) * 2015-02-17 2017-05-16 Powertech Technology Inc. Underfill process and processing machine thereof
JP6649409B2 (ja) 2015-06-11 2020-02-19 ノードソン コーポレーションＮｏｒｄｓｏｎ Ｃｏｒｐｏｒａｔｉｏｎ カートリッジ型流体分注装置
US10169499B2 (en) 2015-07-14 2019-01-01 International Business Machines Corporation Thermoset resin flow models for printed circuit board laminates
US10881005B2 (en) * 2016-06-08 2020-12-29 Nordson Corporation Methods for dispensing a liquid or viscous material onto a substrate
US9789497B1 (en) * 2016-06-20 2017-10-17 Nordson Corporation Systems and methods for applying a liquid coating to a substrate
CN109475897A (zh) * 2016-07-08 2019-03-15 麦克唐纳德特威勒联合公司 使用自动人工视觉引导分配粘性流体以用于填隙和密封操作的系统和方法
US10675653B2 (en) 2017-02-07 2020-06-09 Nordson Corporation Motorized cartridge type fluid dispensing apparatus and system
US10933483B2 (en) 2017-12-05 2021-03-02 Illinois Tool Works Inc. IR non-contact temperature sensing in a dispenser
US11343949B2 (en) * 2018-03-13 2022-05-24 Asm Technology Singapore Pte Ltd Apparatus and method for dispensing a viscous adhesive
CN112005185A (zh) 2018-04-12 2020-11-27 诺信公司 用于分配多组分材料的系统和方法
EP3572903A1 (de) * 2018-05-24 2019-11-27 Covestro Deutschland AG Verfahren zur herstellung von duroplastischen polymeren und niederdruckdosier- und -mischmaschine zur durchführung des verfahrens
KR102091935B1 (ko) * 2018-08-29 2020-03-20 주식회사 프로텍 3차원 스캐너를 이용한 점성 용액 디스펜싱 방법
JP7620383B2 (ja) * 2018-10-11 2025-01-23 株式会社Subaru シール剤吐出装置
US20220087083A1 (en) * 2019-01-04 2022-03-17 Jabil Inc. Apparatus, system, and method of providing a dispenser of circuit board component underfill
EP3911449A1 (de) * 2019-01-14 2021-11-24 Illinois Tool Works Inc. Kontaktlose ir-temperaturmessung in einem spender
JP7415955B2 (ja) * 2019-01-31 2024-01-17 ソニーグループ株式会社 塗料の製造方法、磁気記録媒体の製造方法、塗料の分散性の測定方法および撹拌装置
JP7342315B2 (ja) * 2019-10-25 2023-09-12 株式会社ヒラノテクシード 塗工装置
KR102196378B1 (ko) * 2020-04-13 2020-12-30 제엠제코(주) 반도체 부품 부착 장비
CN112547424A (zh) * 2020-12-03 2021-03-26 厦门特盈自动化科技股份有限公司 一种全自动五轴点胶机
CH718540B1 (fr) * 2021-04-15 2024-08-30 Ciposa Sa Dispositif de dispense de matériau et méthode associée
US12005467B2 (en) * 2021-10-05 2024-06-11 The Boeing Company End effectors and methods for adhesively attaching a first part to a second part
US12005468B2 (en) * 2021-10-05 2024-06-11 The Boeing Company End effectors and methods for adhesively attaching a first part to a second part
US12246522B2 (en) 2021-10-05 2025-03-11 The Boeing Company Nozzles and systems for adhesively attaching a first part to a second part
DE102021214251A1 (de) 2021-12-13 2023-06-15 Robert Bosch Gesellschaft mit beschränkter Haftung Anlage zur Durchführung von Arbeitsprozessen an Werkstücken oder dgl.
CN115318565B (zh) * 2022-10-14 2022-12-09 高能瑞泰(山东)电子科技有限公司 一种倒装芯片封装设备
CN116493195B (zh) * 2023-05-23 2023-11-28 苏州锐智航智能科技有限公司 一种在线式真空灌胶机及其控制方法

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3994256A (en) * 1973-06-04 1976-11-30 Moen Lenard E Universal fluid dispenser apparatus
US4271092A (en) * 1976-10-13 1981-06-02 Risdon Enterprises, Inc. Apparatus for inducing air flow past a product capable of being vaporized
US4431690A (en) * 1982-04-23 1984-02-14 Nordson Corporation Controller for uniform fluid dispensing
US4470369A (en) * 1982-07-12 1984-09-11 Energy Conversion Devices, Inc. Apparatus for uniformly heating a substrate
US4406247A (en) * 1982-07-30 1983-09-27 Eastman Kodak Company Adhesive dispensing system
FR2550044B1 (fr) * 1983-07-05 1986-11-21 Parrens Pierre Appareil de traitement par plasma de substrats en forme de plaquettes
EP0135922A3 (de) * 1983-09-29 1987-09-30 Nordson Corporation Vorrichtung zum Aufbereiten und Auftragen von Kunststoff
JPS61146541A (ja) 1984-12-21 1986-07-04 Toshiba Corp 識別インク付着装置
DE3506110A1 (de) * 1985-02-22 1986-09-04 ASEA GmbH, 5340 Bad Honnef Verfahren zur regelung oder steuerung des flusses einer zaehen fluessigkeit, die von einer maschine selbstaetig als naht aufgetragen wird
US4682711A (en) * 1985-04-08 1987-07-28 Nordson Corporation Method and apparatus for sealing welded seams of automobiles
US4787332A (en) * 1986-02-12 1988-11-29 Robotics, Inc. Adhesive dispensing pump control system
US4682710A (en) * 1986-04-15 1987-07-28 Nordson Corporation Multi-station viscous liquid distribution system
US4922852A (en) * 1986-10-30 1990-05-08 Nordson Corporation Apparatus for dispensing fluid materials
JPS63141240A (ja) 1986-12-01 1988-06-13 Mitsubishi Electric Corp フリツトガラス懸濁液塗布装置
US4891249A (en) * 1987-05-26 1990-01-02 Acumeter Laboratories, Inc. Method of and apparatus for somewhat-to-highly viscous fluid spraying for fiber or filament generation, controlled droplet generation, and combinations of fiber and droplet generation, intermittent and continuous, and for air-controlling spray deposition
JPS63299191A (ja) 1987-05-29 1988-12-06 Hitachi Ltd 厚膜回路描画装置
JPH01184078A (ja) 1988-01-18 1989-07-21 Konica Corp 分散液の塗布方法
US5173864A (en) * 1988-08-20 1992-12-22 Kabushiki Kaisha Toshiba Standard cell and standard-cell-type integrated circuit
US4935261A (en) * 1988-10-17 1990-06-19 Micro Robotics Systems Inc. Method for controlling accurate dispensing of adhesive droplets
US4987854A (en) * 1988-12-12 1991-01-29 Nordson Corporation Apparatus for gas-aided dispensing of liquid materials
JPH02184366A (ja) 1989-01-07 1990-07-18 Fujitsu Ltd 接着剤塗布装置
US4967933A (en) 1989-02-27 1990-11-06 Asymptotic Technologies, Inc. Method and apparatus for dispensing viscous materials
US5175018A (en) * 1989-03-29 1992-12-29 Robotic Vision Systems, Inc. Automated masking device for robotic painting/coating
JP2865310B2 (ja) * 1989-05-15 1999-03-08 三洋電機株式会社 ディスペンサ装置及びディスペンサ制御方法
US5065695A (en) * 1989-06-16 1991-11-19 Nordson Corporation Apparatus for compensating for non-linear flow characteristics in dispensing a coating material
JPH085644B2 (ja) 1989-11-27 1996-01-24 石川島播磨重工業株式会社 プレート型改質器
US5052338A (en) * 1990-01-31 1991-10-01 Asymptotic Technologies, Inc. Apparatus for dispensing viscous materials a constant height above a workpiece surface
SE465713B (sv) * 1990-02-12 1991-10-21 Mydata Automation Ab Anordning foer att utlaegga pastor och lim
JP2572289B2 (ja) 1990-04-12 1997-01-16 セイコー電子工業株式会社 高粘度液体定量吐出装置
CA2052699A1 (en) * 1990-10-19 1992-04-20 Stephen L. Merkel Method and apparatus for monitoring parameters of coating material dispensing systems and processes by analysis of swirl pattern dynamics
US5271521A (en) * 1991-01-11 1993-12-21 Nordson Corporation Method and apparatus for compensating for changes in viscosity in a two-component dispensing system
JPH04244257A (ja) 1991-01-28 1992-09-01 Toshiba Corp 液体塗布装置及び液体塗布方法
US5419930A (en) * 1991-03-27 1995-05-30 Sca Schucker Gmbh Method and device for applying a paste
KR930001365A (ko) 1991-03-27 1993-01-16 빈센트 죠셉 로너 복합 플립 칩 반도체 소자와 그 제조 및 번-인(burning-in) 방법
US5263608A (en) * 1991-06-04 1993-11-23 Philip Morris Incorporated Method and apparatus for dispensing a constant controlled volume of adhesive
JPH057815A (ja) 1991-06-28 1993-01-19 Olympus Optical Co Ltd 液体材料定量吐出装置
JP2740588B2 (ja) * 1991-07-24 1998-04-15 日立テクノエンジニアリング株式会社 塗布描画装置
US5208064A (en) * 1991-11-04 1993-05-04 Nordson Corporation Method and apparatus for optically monitoring and controlling a moving fiber of material
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
US5218234A (en) 1991-12-23 1993-06-08 Motorola, Inc. Semiconductor device with controlled spread polymeric underfill
JP2990920B2 (ja) * 1992-01-22 1999-12-13 日本ケミコン株式会社 半導体素子の封止装置
JP2671720B2 (ja) 1992-07-13 1997-10-29 松下電工株式会社 半導体装置の実装方法
JPH0669286A (ja) 1992-08-19 1994-03-11 Hitachi Ltd ボンディング装置
JP3148413B2 (ja) 1992-09-29 2001-03-19 三洋電機株式会社 塗布装置
JPH06170301A (ja) 1992-12-03 1994-06-21 Hitachi Ltd ディスペンサおよびそれを用いたポッティング装置
US5348604A (en) * 1993-01-29 1994-09-20 Neff Craig A Method and apparatus for applying a heated composition to a substrate
US5377961A (en) * 1993-04-16 1995-01-03 International Business Machines Corporation Electrodynamic pump for dispensing molten solder
JP3509138B2 (ja) 1993-09-06 2004-03-22 株式会社デンソー 半田ペ−スト塗布システム
US5554224A (en) * 1994-03-31 1996-09-10 Foltyn; Steve R. Substrate heater for thin film deposition
JP3296461B2 (ja) 1994-06-17 2002-07-02 富士写真フイルム株式会社 ハロゲン化銀カラー写真感光材料の処理方法及びそれに用いられる漂白液再生剤
DE69637838D1 (de) * 1995-10-13 2009-04-02 Nordson Corp System und Verfahren zur Beschichtung der Unterseite von Flip-Chips
JPH1050769A (ja) * 1996-07-30 1998-02-20 Toshiba Corp 半導体パッケージの製造装置および製造方法
JPH11345837A (ja) * 1998-05-06 1999-12-14 Texas Instr Inc <Ti> アンダフィリングのフリップチップ電子デバイスの歪み低減方法及びその装置
US6173864B1 (en) * 1999-04-23 2001-01-16 Nordson Corporation Viscous material dispensing system and method with feedback control

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DE69631428D1 (de) 2004-03-04
EP0854759A1 (de) 1998-07-29
DE69631428T2 (de) 2004-12-02
AU7262496A (en) 1997-04-30
JP3739691B2 (ja) 2006-01-25
EP0854759A4 (de) 2000-11-29
WO1997013586A1 (en) 1997-04-17
CA2489818C (en) 2007-07-24
CA2232973A1 (en) 1997-04-17
US5906682A (en) 1999-05-25
EP1256387A3 (de) 2006-03-22
JPH11513607A (ja) 1999-11-24
CA2232973C (en) 2006-01-10
US20030137080A1 (en) 2003-07-24
US6955946B2 (en) 2005-10-18
CA2489818A1 (en) 1997-04-17
US6541304B1 (en) 2003-04-01
EP1256387B1 (de) 2009-02-18
JP2002203867A (ja) 2002-07-19
JP3280385B2 (ja) 2002-05-13
EP0854759B1 (de) 2004-01-28

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