DE69625837D1 - Einrichtung für Leiterplattenzusammenbau - Google Patents
Einrichtung für LeiterplattenzusammenbauInfo
- Publication number
- DE69625837D1 DE69625837D1 DE69625837T DE69625837T DE69625837D1 DE 69625837 D1 DE69625837 D1 DE 69625837D1 DE 69625837 T DE69625837 T DE 69625837T DE 69625837 T DE69625837 T DE 69625837T DE 69625837 D1 DE69625837 D1 DE 69625837D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- board assembly
- assembly facility
- facility
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53048—Multiple station assembly or disassembly apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53048—Multiple station assembly or disassembly apparatus
- Y10T29/53052—Multiple station assembly or disassembly apparatus including position sensor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Control Of Conveyors (AREA)
- Automatic Assembly (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/398,267 US5628112A (en) | 1995-03-03 | 1995-03-03 | Circuit board assembly system and method |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69625837D1 true DE69625837D1 (de) | 2003-02-27 |
Family
ID=23574710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69625837T Expired - Lifetime DE69625837D1 (de) | 1995-03-03 | 1996-02-01 | Einrichtung für Leiterplattenzusammenbau |
Country Status (3)
Country | Link |
---|---|
US (1) | US5628112A (de) |
EP (1) | EP0730396B1 (de) |
DE (1) | DE69625837D1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3085451B2 (ja) * | 1996-04-22 | 2000-09-11 | 富士通株式会社 | 製造ラインおよびそれによって製造される多層プリント配線基板 |
FI105315B (fi) * | 1996-05-06 | 2000-07-14 | Pmj Automec Oyj | Laite piirilevyjen tai sen tapaisten levyjen valmistusvaiheiden automaattiseksi suorittamiseksi |
US6258859B1 (en) * | 1997-06-10 | 2001-07-10 | Rhodia, Inc. | Viscoelastic surfactant fluids and related methods of use |
DE19822757C2 (de) * | 1998-05-20 | 2000-04-13 | Siemens Ag | Vorrichtung zum Bearbeiten von elektrischen Bauelementeträgern |
DE50000486D1 (de) * | 1999-02-26 | 2002-10-17 | Siemens Ag | Vorrichtung zum bestücken von substraten mit elektrischen bauelementen |
US6618629B2 (en) * | 2002-01-15 | 2003-09-09 | Teradyne, Inc. | Communications interface for assembly-line monitoring and control |
US7402549B2 (en) * | 2004-01-21 | 2008-07-22 | Schlumberger Technology Corporation | Viscoelastic surfactant rheology modification |
US7387986B2 (en) * | 2004-01-21 | 2008-06-17 | Schlumberger Technology Corporation | Viscoelastic surfactant rheology modification |
JP4957226B2 (ja) * | 2005-12-15 | 2012-06-20 | 富士通セミコンダクター株式会社 | 製品製造に係る品質改善を支援する情報処理端末及び品質改善支援サーバ |
CN101835371A (zh) * | 2010-03-26 | 2010-09-15 | 东莞市正可电子科技有限公司 | 一种全自动插件机控制系统 |
JP5982167B2 (ja) * | 2012-04-23 | 2016-08-31 | ヤマハ発動機株式会社 | 基板搬送装置 |
CN118095324B (zh) * | 2024-04-19 | 2024-10-01 | 深圳市国电科技通信有限公司 | 双模通信模块的制造方法、装置、系统、电子设备和介质 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3600785A (en) * | 1969-10-16 | 1971-08-24 | Leslie J Cook | Circuit board assembly line |
JPH01185455A (ja) * | 1988-01-20 | 1989-07-25 | Nec Home Electron Ltd | 機能検査システム |
EP0350433B1 (de) * | 1988-07-08 | 1993-03-31 | MANNESMANN Aktiengesellschaft | Rollenbahn |
DE69124133T2 (de) * | 1990-05-11 | 1997-08-21 | Hitachi Keiyo Eng | Automatisierte Produktionsstrasse |
US5086910A (en) * | 1990-08-13 | 1992-02-11 | Giddings & Lewis, Inc. | Zone controlled conveyance system |
JPH04240031A (ja) * | 1991-01-24 | 1992-08-27 | Aisin Aw Co Ltd | 組立ラインの機種管理システム |
US5186308A (en) * | 1991-09-19 | 1993-02-16 | Munro Mark S | Electrical system for industrial conveyors |
US5228558A (en) * | 1991-12-23 | 1993-07-20 | Interroll Holding A.G. | Control system for an accumulating conveyor |
DE4218033A1 (de) * | 1992-06-02 | 1993-12-09 | Centrotherm Elektrische Anlage | Vorrichtung zum vorzugsweise geradlinigen Transport von Teilen, Werkstücken o. dgl. |
JPH066089A (ja) * | 1992-06-19 | 1994-01-14 | Tokico Ltd | 基板搬送装置 |
TW220028B (en) * | 1992-08-24 | 1994-02-01 | Ciba Geigy Ag | Method and apparatus for coating board-shaped articles, especially printed circuit boards |
US5318167A (en) * | 1993-03-12 | 1994-06-07 | Newcor, Inc. | Control system for power driven conveyor line |
-
1995
- 1995-03-03 US US08/398,267 patent/US5628112A/en not_active Expired - Fee Related
-
1996
- 1996-02-01 DE DE69625837T patent/DE69625837D1/de not_active Expired - Lifetime
- 1996-02-01 EP EP96300712A patent/EP0730396B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0730396B1 (de) | 2003-01-22 |
EP0730396A1 (de) | 1996-09-04 |
US5628112A (en) | 1997-05-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |