DE69623549D1 - Analyse von Klebeverbindungen - Google Patents
Analyse von KlebeverbindungenInfo
- Publication number
- DE69623549D1 DE69623549D1 DE69623549T DE69623549T DE69623549D1 DE 69623549 D1 DE69623549 D1 DE 69623549D1 DE 69623549 T DE69623549 T DE 69623549T DE 69623549 T DE69623549 T DE 69623549T DE 69623549 D1 DE69623549 D1 DE 69623549D1
- Authority
- DE
- Germany
- Prior art keywords
- analysis
- adhesive bonds
- bonds
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/08—Testing mechanical properties
- G01M11/083—Testing mechanical properties by using an optical fiber in contact with the device under test [DUT]
- G01M11/086—Details about the embedment of the optical fiber within the DUT
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0025—Shearing
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9513928.3A GB9513928D0 (en) | 1995-07-07 | 1995-07-07 | Bonded joint analysis |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69623549D1 true DE69623549D1 (de) | 2002-10-17 |
DE69623549T2 DE69623549T2 (de) | 2003-01-09 |
Family
ID=10777324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69623549T Expired - Fee Related DE69623549T2 (de) | 1995-07-07 | 1996-07-03 | Analyse von Klebeverbindungen |
Country Status (6)
Country | Link |
---|---|
US (1) | US5841034A (de) |
EP (1) | EP0757238B1 (de) |
JP (1) | JPH09101255A (de) |
DE (1) | DE69623549T2 (de) |
ES (1) | ES2179163T3 (de) |
GB (1) | GB9513928D0 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3340313B2 (ja) * | 1996-05-17 | 2002-11-05 | セントラル硝子株式会社 | 接着強度試験治具 |
US6600149B2 (en) * | 1999-12-27 | 2003-07-29 | Whitten L. Schulz | Fiber grating environmental sensing system |
US7069792B2 (en) * | 2001-08-08 | 2006-07-04 | Casad Donald F | Joint sealant adhesion indicator |
US6776049B2 (en) | 2001-12-07 | 2004-08-17 | Alliant Techsystems Inc. | System and method for measuring stress at an interface |
US7167009B2 (en) * | 2002-04-16 | 2007-01-23 | Mide Technology Corporation | Method and apparatus for determining electrical properties of structures |
JP4027258B2 (ja) | 2003-04-18 | 2007-12-26 | 本田技研工業株式会社 | 接着部の剥離検査方法 |
JP4054815B2 (ja) * | 2004-06-09 | 2008-03-05 | キヤノン株式会社 | 部材の密着性評価方法及び密着性評価装置 |
DE102004063098B4 (de) * | 2004-12-22 | 2008-09-04 | Airbus Deutschland Gmbh | Klebeverbindung zum Verbinden von Bauteilen von Verkehrsmitteln sowie Verfahren zur Ermittlung eines in einer Klebeverbindung herrschenden mechanischen Belastungszustandes |
JP4721435B2 (ja) * | 2006-04-06 | 2011-07-13 | 本田技研工業株式会社 | 接着部の剥離検査方法 |
US8596135B2 (en) * | 2006-12-07 | 2013-12-03 | Technion Research and Dvelopment Foundation Ltd. | System and method for monitoring health of structural joints |
JP4878013B2 (ja) * | 2007-08-27 | 2012-02-15 | 国立大学法人 東京大学 | 亀裂発生位置の検出方法 |
US8147135B2 (en) * | 2008-03-12 | 2012-04-03 | Alliant Techsystems Inc. | Methods and systems for verifying sensor bond integrity |
US8708555B2 (en) * | 2008-03-12 | 2014-04-29 | Alliant Techsystems Inc. | Methods and systems for verifying sensor bond integrity and structures employing such systems |
US8250928B2 (en) * | 2008-07-09 | 2012-08-28 | The Boeing Company | Measurement of strain in an adhesively bonded joint including magnetostrictive material |
US8641845B2 (en) * | 2011-01-13 | 2014-02-04 | Siemens Energy, Inc. | Method of determining bond coverage in a joint |
CN102207449A (zh) * | 2011-03-16 | 2011-10-05 | 东南大学 | 纤维复合增强筋与混凝土间粘结应力测试方法 |
DE102011082425A1 (de) * | 2011-09-09 | 2013-03-14 | Hochschule für Nachhaltige Entwicklung Eberswalde | Vorrichtung und Verfahren zur permanenten Prüfung von Klebeverbindungen |
DE102011084579B4 (de) * | 2011-10-14 | 2013-11-07 | Bauhaus Universität Weimar | Vorrichtung und Verfahren zur Überwachung des Zustands einer Klebverbindung |
JP6016589B2 (ja) * | 2012-11-20 | 2016-10-26 | 三菱重工業株式会社 | 構造体及び構造体の剥離検出方法 |
US9261444B1 (en) * | 2013-07-30 | 2016-02-16 | The Boeing Company | Apparatus, system, and method for in situ strength testing of a bonded joint |
GB2521421A (en) * | 2013-12-19 | 2015-06-24 | Bae Systems Plc | Assessing Integrity of Bonded Joints |
WO2015091390A1 (en) | 2013-12-19 | 2015-06-25 | Bae Systems Plc | Assessing integrity of bonded joints |
US9336588B2 (en) * | 2014-10-01 | 2016-05-10 | The Boeing Company | Joint assemblies and method of inspecting thereof |
ES2574443B2 (es) * | 2014-12-17 | 2017-03-17 | Universidad Rey Juan Carlos | Adhesivo tipo film, dispositivo y método para evaluar la integridad estructural de uniones pegadas |
JP6663781B2 (ja) * | 2016-04-18 | 2020-03-13 | 三菱重工業株式会社 | はく離検出方法及びはく離検出装置 |
CN105890994B (zh) * | 2016-06-22 | 2018-10-02 | 重庆大学 | 一种层状金属复合材料界面结合强度评价方法 |
IL247408B (en) * | 2016-08-21 | 2018-03-29 | Elbit Systems Ltd | A system and method for identifying weaknesses in the adhesion between structural elements |
WO2018053317A1 (en) * | 2016-09-15 | 2018-03-22 | University Of Tennessee Research Foundation | Smart joint for similar and dissimilar materials including polymers, fiber reinforced composites, metals, concrete, wood based products, and other structural materials |
US10605631B2 (en) * | 2017-08-03 | 2020-03-31 | Sikorsky Aircraft Corporation | Structural pi joint with integrated fiber optic sensing |
US10823655B2 (en) * | 2018-10-10 | 2020-11-03 | Deere & Company | Method and apparatus to measure strains in adhesives of joints |
US11448080B2 (en) * | 2020-02-13 | 2022-09-20 | Raytheon Technologies Corporation | Guide vane for a gas turbine engine and method for testing a bond seal of a guide vane for a gas turbine engine |
DE102022208239A1 (de) * | 2022-08-08 | 2024-02-08 | Carl Zeiss Smt Gmbh | Vorrichtung und Verfahren zur Sensorischen Messung Chemischer und/oder Physikalischer Eigenschaften einer Klebeschicht und/oder eines die Klebeschicht Kontaktierenden Mediums, sowie Verfahren zur Herstellung einer entsprechenden Vorrichtung und Verfahren zur Sensorischen Messung |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4461536A (en) * | 1981-09-10 | 1984-07-24 | Board Of Trustees Of Leland Stanford Jr. University | Fiber coupler displacement transducer |
US4538462A (en) * | 1983-12-12 | 1985-09-03 | Lockheed Corporation | Adhesive bond integrity evaluation method |
US4789236A (en) * | 1986-08-07 | 1988-12-06 | Lockheed Missiles & Space Company, Inc. | Stress sensor |
US5250802A (en) * | 1991-11-04 | 1993-10-05 | Teledyne Ryan Aeronautical, Division Of Teledyne Industries, Inc. | Fiber optic stress sensor for structural joints |
US5245293A (en) * | 1991-12-23 | 1993-09-14 | Teledyne Ryan Aeronautical, Division Of Teledyne Industries, Inc. | Adhesive bond degradation monitor |
US5265475A (en) * | 1992-05-08 | 1993-11-30 | Rockwell International Corporation | Fiber optic joint sensor |
-
1995
- 1995-07-07 GB GBGB9513928.3A patent/GB9513928D0/en active Pending
-
1996
- 1996-07-03 EP EP96304907A patent/EP0757238B1/de not_active Expired - Lifetime
- 1996-07-03 DE DE69623549T patent/DE69623549T2/de not_active Expired - Fee Related
- 1996-07-03 ES ES96304907T patent/ES2179163T3/es not_active Expired - Lifetime
- 1996-07-05 JP JP8176619A patent/JPH09101255A/ja active Pending
-
1997
- 1997-06-23 US US08/880,725 patent/US5841034A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH09101255A (ja) | 1997-04-15 |
US5841034A (en) | 1998-11-24 |
DE69623549T2 (de) | 2003-01-09 |
EP0757238B1 (de) | 2002-09-11 |
EP0757238A1 (de) | 1997-02-05 |
ES2179163T3 (es) | 2003-01-16 |
GB9513928D0 (en) | 1995-09-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |