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DE69405818D1 - Integrierte lineare optische Kupplung und Herstellungsverfahren - Google Patents

Integrierte lineare optische Kupplung und Herstellungsverfahren

Info

Publication number
DE69405818D1
DE69405818D1 DE69405818T DE69405818T DE69405818D1 DE 69405818 D1 DE69405818 D1 DE 69405818D1 DE 69405818 T DE69405818 T DE 69405818T DE 69405818 T DE69405818 T DE 69405818T DE 69405818 D1 DE69405818 D1 DE 69405818D1
Authority
DE
Germany
Prior art keywords
manufacturing process
optical coupling
linear optical
integrated linear
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69405818T
Other languages
English (en)
Other versions
DE69405818T2 (de
Inventor
Horst A Gempe
Gary W Hoshizaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE69405818D1 publication Critical patent/DE69405818D1/de
Application granted granted Critical
Publication of DE69405818T2 publication Critical patent/DE69405818T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
    • H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
    • H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • H10F55/255—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices formed in, or on, a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
DE69405818T 1993-06-07 1994-06-06 Integrierte lineare optische Kupplung und Herstellungsverfahren Expired - Fee Related DE69405818T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7201693A 1993-06-07 1993-06-07

Publications (2)

Publication Number Publication Date
DE69405818D1 true DE69405818D1 (de) 1997-10-30
DE69405818T2 DE69405818T2 (de) 1998-04-02

Family

ID=22105038

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69405818T Expired - Fee Related DE69405818T2 (de) 1993-06-07 1994-06-06 Integrierte lineare optische Kupplung und Herstellungsverfahren

Country Status (4)

Country Link
US (1) US6031251A (de)
EP (1) EP0632509B1 (de)
JP (1) JPH0715030A (de)
DE (1) DE69405818T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5903016A (en) * 1995-06-30 1999-05-11 Siemens Components, Inc. Monolithic linear optocoupler
EP1020933B1 (de) * 1999-01-13 2003-05-02 Sharp Kabushiki Kaisha Fotokoppler
DE60136964D1 (de) * 2001-01-30 2009-01-22 Infineon Technologies Ag Anschlusskamm für einen optokoppler
ITRM20010222A1 (it) * 2001-04-24 2002-10-24 Paolo Agostinelli Dispositivo di alimentazione a celle solari, funzionanti con sorgentiluminose artificiali, per apparecchiature elettroniche.
US7021839B2 (en) * 2002-10-29 2006-04-04 Dominique Ho Low profile optocouplers
US7748912B2 (en) * 2002-10-29 2010-07-06 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Double mold optocouplers
JP4282392B2 (ja) * 2003-07-11 2009-06-17 株式会社東芝 光半導体装置及びその製造方法
US8395324B2 (en) * 2009-04-20 2013-03-12 Sensor Electronic Technology, Inc. Light emitting system with dual use light element
JP2011181647A (ja) * 2010-03-01 2011-09-15 Omron Corp 光結合装置及びその製造方法
DE102010034665B4 (de) * 2010-08-18 2024-10-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip und Verfahren zur Herstellung von optoelektronischen Halbleiterchips
US8587501B2 (en) * 2011-02-17 2013-11-19 Global Oled Technology Llc Electroluminescent display device with optically communicating chiplets
EP2515453B1 (de) * 2011-04-19 2015-08-05 ABB Research Ltd. Kommunikationssystem für elektronische Stromwandler
CN102914832A (zh) * 2011-08-05 2013-02-06 快捷半导体(苏州)有限公司 晶片级成型的光耦合器
US11211305B2 (en) 2016-04-01 2021-12-28 Texas Instruments Incorporated Apparatus and method to support thermal management of semiconductor-based components
US10861796B2 (en) 2016-05-10 2020-12-08 Texas Instruments Incorporated Floating die package
US10179730B2 (en) 2016-12-08 2019-01-15 Texas Instruments Incorporated Electronic sensors with sensor die in package structure cavity
US10411150B2 (en) 2016-12-30 2019-09-10 Texas Instruments Incorporated Optical isolation systems and circuits and photon detectors with extended lateral P-N junctions
US9929110B1 (en) 2016-12-30 2018-03-27 Texas Instruments Incorporated Integrated circuit wave device and method
US10074639B2 (en) 2016-12-30 2018-09-11 Texas Instruments Incorporated Isolator integrated circuits with package structure cavity and fabrication methods
US10121847B2 (en) 2017-03-17 2018-11-06 Texas Instruments Incorporated Galvanic isolation device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3229104A (en) * 1962-12-24 1966-01-11 Ibm Four terminal electro-optical semiconductor device using light coupling
US3560750A (en) * 1966-10-31 1971-02-02 Hitachi Ltd Optoelectronic amplifier
US3881113A (en) * 1973-12-26 1975-04-29 Ibm Integrated optically coupled light emitter and sensor
US4297653A (en) * 1979-04-30 1981-10-27 Xerox Corporation Hybrid semiconductor laser/detectors
JPS57139976A (en) * 1981-02-23 1982-08-30 Omron Tateisi Electronics Co Light emitting/receiving device
JPS5848481A (ja) * 1981-09-17 1983-03-22 Nec Corp モニタ−用光検出器内蔵面発光型発光ダイオ−ド
US4477721A (en) * 1982-01-22 1984-10-16 International Business Machines Corporation Electro-optic signal conversion
US4675518A (en) * 1982-03-05 1987-06-23 Omron Tateisi Electronics Co. Optical bistable device
JPS59222973A (ja) * 1983-06-01 1984-12-14 Nec Corp 半導体光結合装置
JPS6136981A (ja) * 1984-07-30 1986-02-21 Toshiba Corp リニヤフオトカプラ
JPH0797656B2 (ja) * 1986-06-05 1995-10-18 京セラ株式会社 フオトカプラ−
SE461491B (sv) * 1987-12-02 1990-02-19 Asea Ab Monolitisk optokopplare

Also Published As

Publication number Publication date
EP0632509A3 (de) 1995-02-15
US6031251A (en) 2000-02-29
DE69405818T2 (de) 1998-04-02
EP0632509B1 (de) 1997-09-24
EP0632509A2 (de) 1995-01-04
JPH0715030A (ja) 1995-01-17

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Legal Events

Date Code Title Description
8320 Willingness to grant licences declared (paragraph 23)
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: FREESCALE SEMICONDUCTOR, INC. (N.D.GES.D. STAATES

8339 Ceased/non-payment of the annual fee