DE69400209D1 - Automatische Einrichtung für den Zusammenbau von elektronischen Teilen - Google Patents

Automatische Einrichtung für den Zusammenbau von elektronischen Teilen

Info

Publication number: DE69400209D1
Authority: DE; Germany
Prior art keywords: electronic parts; automatic device; assembling electronic; assembling; automatic
Prior art date: 1993-01-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE69400209T

Other languages

English (en)

Other versions

DE69400209T2 (de

Inventor

Kazuhiro Hineno

Masao Okado

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Hitachi High Tech Corp

Original Assignee

Sanyo Electric Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1993-01-18

Filing date

1994-01-18

Publication date

1996-07-04

1994-01-18 Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd

1996-07-04 Application granted granted Critical

1996-07-04 Publication of DE69400209D1 publication Critical patent/DE69400209D1/de

1996-10-17 Publication of DE69400209T2 publication Critical patent/DE69400209T2/de

2014-01-19 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/028—Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Supply And Installment Of Electrical Components (AREA)

DE69400209T 1993-01-18 1994-01-18 Automatische Einrichtung für den Zusammenbau von elektronischen Teilen Expired - Lifetime DE69400209T2 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP05006204A JP3081400B2 (ja)	1993-01-18	1993-01-18	電子部品自動装着装置

Publications (2)

Publication Number	Publication Date
DE69400209D1 true DE69400209D1 (de)	1996-07-04
DE69400209T2 DE69400209T2 (de)	1996-10-17

Family

ID=11632011

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69400209T Expired - Lifetime DE69400209T2 (de)	1993-01-18	1994-01-18	Automatische Einrichtung für den Zusammenbau von elektronischen Teilen

Country Status (5)

Country	Link
US (1)	US5582493A (de)
EP (1)	EP0607927B1 (de)
JP (1)	JP3081400B2 (de)
KR (1)	KR0174578B1 (de)
DE (1)	DE69400209T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5853108A (en) *	1995-08-21	1998-12-29	Matsushita Electric Industrial Co., Ltd.	Parts feed apparatus and parts feed method
AUPP108197A0 (en)	1997-12-22	1998-01-22	Dow Corning Australia Pty Ltd	Stable emulsions
US6547097B1 (en) *	1999-05-27	2003-04-15	The Knight Group Llc	Dispensing apparatus and method
JP3498692B2 (ja) *	1999-10-18	2004-02-16	株式会社村田製作所	チップ部品の供給装置
CN103607876B (zh) *	2013-11-21	2016-02-10	方小刚	一种齿轮驱动的在压板空腔中设弹性材料的芯片安装装置
CN103561560B (zh) *	2013-11-21	2016-01-27	吴琼	一种螺杆驱动的压板空腔中设弹性材料的芯片安装装置
CN103561559B (zh) *	2013-11-21	2016-04-06	何丽进	一种齿轮驱动的竖直部分具有弹性材料的芯片安装装置
CN103561558B (zh) *	2013-11-21	2016-02-24	吴琼	一种由螺杆驱动的带锁止销的芯片安装装置
CN103561561B (zh) *	2013-11-21	2016-04-13	徐萍	一种由滑块驱动的带锁止销的芯片安装装置
CN103732050B (zh) *	2014-01-03	2016-03-23	浙江师范大学	一种齿轮驱动的带有限位凸出的芯片安装装置
CN113543511B (zh) *	2021-08-11	2023-08-18	常州冯卡斯登智能科技有限公司	一种具有自动疏通功能的贴片机进料装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3993359A (en) *	1975-04-21	1976-11-23	Continental Oil Company	Hydraulic solids handling system
US4033031A (en) *	1976-04-22	1977-07-05	Augat, Inc.	Method and machine for inserting electrical contacts into electrical interconnection boards
DE2816370A1 (de) *	1977-04-19	1978-11-02	Gantofine Ltd	Mit druckluft betriebene ausgabevorrichtung zum trennen und ausgeben von kleineren, insbesondere laenglichen werkstuecken
US4459743A (en) *	1980-12-05	1984-07-17	J. Osawa Camera Sales Co., Ltd.	Automatic mounting apparatus for chip components
US4801044A (en) *	1986-05-27	1989-01-31	Nitto Kogyo Kabushiki Kaisha	Chip separation and alignment apparatus
US4759124A (en) *	1987-04-28	1988-07-26	Universal Instruments Corp.	Method and apparatus for controlling component pickup and placement pressures
US5075961A (en) *	1989-10-12	1991-12-31	Dynapert Inc.	Radial component insertion machine
JPH03145799A (ja) *	1989-10-31	1991-06-20	Hitachi Ltd	チップ電子部品供給装置
GB2262736B (en) *	1991-12-18	1995-06-21	Tdk Corp	Electronic component packaging means,and supply mechanism for and method of supplying electronic components by using the electronic component packaging means

1993
- 1993-01-18 JP JP05006204A patent/JP3081400B2/ja not_active Expired - Fee Related
1994
- 1994-01-17 KR KR1019940000690A patent/KR0174578B1/ko not_active IP Right Cessation
- 1994-01-18 EP EP94100662A patent/EP0607927B1/de not_active Expired - Lifetime
- 1994-01-18 DE DE69400209T patent/DE69400209T2/de not_active Expired - Lifetime
- 1994-01-18 US US08/182,960 patent/US5582493A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
DE69400209T2 (de)	1996-10-17
US5582493A (en)	1996-12-10
JPH06216582A (ja)	1994-08-05
KR0174578B1 (ko)	1999-05-01
EP0607927A1 (de)	1994-07-27
KR940018161A (ko)	1994-08-16
JP3081400B2 (ja)	2000-08-28
EP0607927B1 (de)	1996-05-29

Publication	Publication Date	Title
DE69524273D1 (de)	2002-01-17	Automatisierte Analysator
DE69706515D1 (de)	2001-10-11	Vorrichtung zum Montieren von elektronischen Bauteilen
DE69526783D1 (de)	2002-06-27	Abgeschirmter leiterplattenverbindungsmodul
DE69218467D1 (de)	1997-04-30	Verbindungselement für Bauteile
FI964394L (fi)	1996-10-31	Elektronisten komponenttien kotelo
DE69032671D1 (de)	1998-10-29	Lötanordnung für Komponenten
DE69401622D1 (de)	1997-03-13	Automatische Bestückungseintichtung für elektronische Teile
DE69402227D1 (de)	1997-04-30	Leiterplattenanordnung
DE59510572D1 (de)	2003-04-10	Elektronikmodul
DE69427425D1 (de)	2001-07-19	Automatische Entwicklungsgeräte
DE69302994D1 (de)	1996-07-11	Verzorgungsvorrichtung von Bauelement für integrierte Schaltung
DE69422968D1 (de)	2000-03-16	Montageanordnung für elektronisches Bauteil
DE69400209D1 (de)	1996-07-04	Automatische Einrichtung für den Zusammenbau von elektronischen Teilen
DE69427614D1 (de)	2001-08-09	Automatische Entwicklungsgeräte
DE69427429D1 (de)	2001-07-19	Automatische Entwicklungsgeräte
DE69421984D1 (de)	2000-01-13	Elektronisches Gerät
DE69418417D1 (de)	1999-06-17	Leiterplattenbefestigung
DE69331949D1 (de)	2002-06-27	Elektronisches bauelement
ATA70592A (de)	1996-02-15	Positioniereinrichtung bei der bestückung von leiterplatten
DE69427426D1 (de)	2001-07-19	Automatische Entwicklungsgeräte
DE69429367D1 (de)	2002-01-17	Elektronisches gerät für reflexotherapie
FR2725557B1 (fr)	1996-12-13	Dispositif electronique de commutation-disjonction
DE59406298D1 (de)	1998-07-30	Einpress-Befestigung für Bauteile in Leiterplattenbohrungen
KR940027889U (ko)	1994-12-10	전자부품조립장치
KR940023807U (ko)	1994-10-22	자동 삽입용 전자부품

Legal Events

Date	Code	Title	Description
1997-06-26	8364	No opposition during term of opposition
2004-02-12	8327	Change in the person/name/address of the patent owner	Owner name: HITACHI HIGH-TECH INSTRUMENTS CO., LTD., GUNMA, JP