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DE69329611D1 - Verfahren zur Registrierung mittels eines projizierenden optischen System, Belichtungsapparat zu dessen Durchführung und sowie Halbleiter-Herstellungsverfahren das diesen Belichtungsapparat verwendet - Google Patents

Verfahren zur Registrierung mittels eines projizierenden optischen System, Belichtungsapparat zu dessen Durchführung und sowie Halbleiter-Herstellungsverfahren das diesen Belichtungsapparat verwendet

Info

Publication number
DE69329611D1
DE69329611D1 DE69329611T DE69329611T DE69329611D1 DE 69329611 D1 DE69329611 D1 DE 69329611D1 DE 69329611 T DE69329611 T DE 69329611T DE 69329611 T DE69329611 T DE 69329611T DE 69329611 D1 DE69329611 D1 DE 69329611D1
Authority
DE
Germany
Prior art keywords
exposure apparatus
registration
implementation
optical system
semiconductor manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69329611T
Other languages
English (en)
Other versions
DE69329611T2 (de
Inventor
Haruna Kawashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69329611D1 publication Critical patent/DE69329611D1/de
Application granted granted Critical
Publication of DE69329611T2 publication Critical patent/DE69329611T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034—Leveling
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE69329611T 1992-08-19 1993-08-18 Verfahren zur Registrierung mittels eines projizierenden optischen System, Belichtungsapparat zu dessen Durchführung und sowie Halbleiter-Herstellungsverfahren das diesen Belichtungsapparat verwendet Expired - Lifetime DE69329611T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24426792 1992-08-19
JP35596592 1992-12-18

Publications (2)

Publication Number Publication Date
DE69329611D1 true DE69329611D1 (de) 2000-12-07
DE69329611T2 DE69329611T2 (de) 2001-05-03

Family

ID=26536654

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69329611T Expired - Lifetime DE69329611T2 (de) 1992-08-19 1993-08-18 Verfahren zur Registrierung mittels eines projizierenden optischen System, Belichtungsapparat zu dessen Durchführung und sowie Halbleiter-Herstellungsverfahren das diesen Belichtungsapparat verwendet

Country Status (3)

Country Link
US (1) US5602400A (de)
EP (1) EP0585041B1 (de)
DE (1) DE69329611T2 (de)

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JP3372728B2 (ja) * 1995-10-18 2003-02-04 キヤノン株式会社 面位置検出装置
US5920398A (en) * 1996-03-01 1999-07-06 Canon Kabushiki Kaisha Surface position detecting method and scanning exposure method using the same
US6172757B1 (en) * 1996-09-25 2001-01-09 Vanguard International Semiconductor Corporation Lever sensor for stepper field-by-field focus and leveling system
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
WO1999039374A1 (fr) * 1998-01-29 1999-08-05 Nikon Corporation Procede d'exposition et dispositif associe
JP3335126B2 (ja) * 1998-07-06 2002-10-15 キヤノン株式会社 面位置検出装置及びそれを用いた走査型投影露光装置
US6208411B1 (en) 1998-09-28 2001-03-27 Kla-Tencor Corporation Massively parallel inspection and imaging system
JP2000124122A (ja) * 1998-10-19 2000-04-28 Canon Inc 半導体露光装置および同装置を用いるデバイス製造方法
US6867406B1 (en) * 1999-03-23 2005-03-15 Kla-Tencor Corporation Confocal wafer inspection method and apparatus using fly lens arrangement
JP2001075294A (ja) * 1999-07-08 2001-03-23 Nikon Corp 面位置検出方法及び装置、並びに露光方法及び装置、露光装置の製造方法、半導体デバイス製造方法
US6879390B1 (en) * 2000-08-10 2005-04-12 Kla-Tencor Technologies Corporation Multiple beam inspection apparatus and method
US6636301B1 (en) * 2000-08-10 2003-10-21 Kla-Tencor Corporation Multiple beam inspection apparatus and method
US6562528B2 (en) 2001-06-20 2003-05-13 Nikon Corporation Method for determining and calibrating image plane tilt and substrate plane tilt in photolithography
US6683315B2 (en) 2001-06-29 2004-01-27 Eastman Kodak Company Storage phosphor cassette
US6777691B2 (en) 2001-06-29 2004-08-17 Eastman Kodak Company Storage phosphor cassette
EP1276014A1 (de) * 2001-07-11 2003-01-15 Infineon Technologies AG Verfahren zur Detektion eines erhöhten Bereiches einer Halbleiterplatte
WO2004047156A1 (ja) * 2002-11-20 2004-06-03 Nikon Corporation 位置計測方法、位置計測装置及び露光方法並びに露光装置
US7196801B1 (en) * 2004-02-03 2007-03-27 Kla-Tencor Technologies Corporation Patterned substrate surface mapping
US7113256B2 (en) * 2004-02-18 2006-09-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method with feed-forward focus control
US7489393B2 (en) * 2005-03-02 2009-02-10 Kla-Tencor Technologies Corporation Enhanced simultaneous multi-spot inspection and imaging
US7330238B2 (en) 2005-03-28 2008-02-12 Asml Netherlands, B.V. Lithographic apparatus, immersion projection apparatus and device manufacturing method
JP4426519B2 (ja) * 2005-11-11 2010-03-03 株式会社日立ハイテクノロジーズ 光学的高さ検出方法、電子線測定装置および電子線検査装置
US20070287073A1 (en) * 2006-06-07 2007-12-13 Francis Goodwin Lithography systems and methods
US20080119060A1 (en) * 2006-11-17 2008-05-22 Francis Goodwin Inspection systems and methods
JP2008171960A (ja) * 2007-01-10 2008-07-24 Canon Inc 位置検出装置及び露光装置
NL1036559A1 (nl) * 2008-03-12 2009-09-15 Asml Netherlands Bv Lithographic Apparatus and Method.
JP5264406B2 (ja) * 2008-10-22 2013-08-14 キヤノン株式会社 露光装置、露光方法およびデバイスの製造方法
NL2005821A (en) * 2009-12-23 2011-06-27 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and method of applying a pattern to a substrate.
CN103091992B (zh) * 2011-11-02 2015-02-11 上海微电子装备有限公司 一种工件位置校正装置及其校正方法
CN103163740B (zh) * 2011-12-14 2015-01-21 上海微电子装备有限公司 一种倾斜物体位置测量装置
CN103676487B (zh) * 2012-09-07 2016-02-03 上海微电子装备有限公司 一种工件高度测量装置及其校正方法
CN103676494B (zh) * 2012-09-25 2015-11-18 上海微电子装备有限公司 用于扫描光刻机的逐场调焦调平方法
JP6150490B2 (ja) * 2012-10-19 2017-06-21 キヤノン株式会社 検出装置、露光装置、それを用いたデバイスの製造方法
US10495982B2 (en) * 2013-10-28 2019-12-03 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for real-time overlay error reduction
CN104677299A (zh) * 2013-11-29 2015-06-03 上海微电子装备有限公司 一种薄膜检测装置和方法
CN104749901B (zh) * 2013-12-31 2017-08-29 上海微电子装备有限公司 一种调焦调平装置
US9546962B2 (en) 2014-02-12 2017-01-17 Kla-Tencor Corporation Multi-spot scanning collection optics
US9587929B2 (en) * 2014-07-15 2017-03-07 Taiwan Semiconductor Manufacturing Co., Ltd. Focus metrology method and photolithography method and system
CN108121179A (zh) * 2016-11-30 2018-06-05 上海微电子装备（集团）股份有限公司 一种调焦调平装置
US10969680B2 (en) 2016-11-30 2021-04-06 Canon Kabushiki Kaisha System and method for adjusting a position of a template
DE102021127226B3 (de) 2021-10-20 2022-12-22 Jenaer Antriebstechnik Gmbh Vorrichtung mit einem beweglichen Tischsystem sowie Verfahren zu dessen Kalibrierung und Betrieb

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JPS58113706A (ja) * 1981-12-26 1983-07-06 Nippon Kogaku Kk <Nikon> 水平位置検出装置
JPH0721586B2 (ja) * 1985-09-30 1995-03-08 株式会社ニコン 像形成光学装置
US4780616A (en) * 1986-09-25 1988-10-25 Nippon Kogaku K. K. Projection optical apparatus for mask to substrate alignment
US4952815A (en) * 1988-04-14 1990-08-28 Nikon Corporation Focusing device for projection exposure apparatus
JPH0652707B2 (ja) * 1988-10-11 1994-07-06 キヤノン株式会社 面位置検出方法
US5124562A (en) * 1989-01-27 1992-06-23 Canon Kabushiki Kaisha Surface position detecting method at a predetermined and plurality of adjacent points
JP2705778B2 (ja) * 1989-01-27 1998-01-28 キヤノン株式会社 投影露光装置
JP2886957B2 (ja) * 1990-09-06 1999-04-26 キヤノン株式会社 自動焦点合せ装置
US5241188A (en) * 1991-02-01 1993-08-31 Nikon Corporation Apparatus for detecting a focussing position
NL9100410A (nl) * 1991-03-07 1992-10-01 Asm Lithography Bv Afbeeldingsapparaat voorzien van een focusfout- en/of scheefstandsdetectie-inrichting.

Also Published As

Publication number Publication date
EP0585041A1 (de) 1994-03-02
US5602400A (en) 1997-02-11
DE69329611T2 (de) 2001-05-03
EP0585041B1 (de) 2000-11-02

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