DE69322494D1 - Integrierte Schaltungs-Verpackung - Google Patents
Integrierte Schaltungs-VerpackungInfo
- Publication number
- DE69322494D1 DE69322494D1 DE69322494T DE69322494T DE69322494D1 DE 69322494 D1 DE69322494 D1 DE 69322494D1 DE 69322494 T DE69322494 T DE 69322494T DE 69322494 T DE69322494 T DE 69322494T DE 69322494 D1 DE69322494 D1 DE 69322494D1
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- circuit packaging
- packaging
- integrated
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5060005A JP2938704B2 (ja) | 1993-03-19 | 1993-03-19 | 集積回路パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69322494D1 true DE69322494D1 (de) | 1999-01-21 |
| DE69322494T2 DE69322494T2 (de) | 1999-04-29 |
Family
ID=13129549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69322494T Expired - Fee Related DE69322494T2 (de) | 1993-03-19 | 1993-09-03 | Integrierte Schaltungs-Verpackung |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5629560A (de) |
| EP (1) | EP0620592B1 (de) |
| JP (1) | JP2938704B2 (de) |
| KR (1) | KR940022809A (de) |
| DE (1) | DE69322494T2 (de) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5484262A (en) * | 1992-10-23 | 1996-01-16 | Nidec Corporation | Low profile fan body with heat transfer characteristics |
| DE4427426A1 (de) * | 1993-11-05 | 1995-05-11 | Horng Ching Shen | Motor mit einer Anordnung zur Wärmeableitung |
| JP2978730B2 (ja) * | 1994-12-27 | 1999-11-15 | 日本電気株式会社 | 半導体装置用ヒートシンク装置 |
| GB2298520B (en) * | 1995-03-03 | 1999-09-08 | Hong Chen Fu In | Heat sink device for integrated circuit |
| JP3578825B2 (ja) * | 1995-03-17 | 2004-10-20 | 富士通株式会社 | ヒートシンク |
| DE29505830U1 (de) * | 1995-04-05 | 1996-08-08 | Papst-Motoren GmbH & Co KG, 78112 St Georgen | Anordnung zur Kühlung von elektronischen Bauteilen |
| JPH09149598A (ja) * | 1995-11-20 | 1997-06-06 | Seiko Epson Corp | 冷却ファンおよび冷却ファン組立体 |
| JPH09172113A (ja) * | 1995-12-18 | 1997-06-30 | Nec Corp | 半導体装置用ヒートシンク |
| US5785116A (en) * | 1996-02-01 | 1998-07-28 | Hewlett-Packard Company | Fan assisted heat sink device |
| US5690468A (en) * | 1996-06-19 | 1997-11-25 | Hong; Chen Fu-In | Fan assembly for an integrated circuit |
| JPH10224061A (ja) * | 1997-02-10 | 1998-08-21 | Matsushita Electric Ind Co Ltd | ヒートシンクユニット及び電子機器 |
| JP4290232B2 (ja) * | 1997-02-24 | 2009-07-01 | 富士通株式会社 | ヒートシンクとそれを使用する情報処理装置 |
| US6501652B2 (en) | 1997-02-24 | 2002-12-31 | Fujitsu Limited | Heat sink and information processor using it |
| US6176299B1 (en) | 1999-02-22 | 2001-01-23 | Agilent Technologies, Inc. | Cooling apparatus for electronic devices |
| JP2001118629A (ja) * | 1999-10-18 | 2001-04-27 | Jst Mfg Co Ltd | コネクタ及びコネクタに装着された電子モジュールの冷却方法 |
| US6702001B2 (en) * | 2001-08-21 | 2004-03-09 | Agilent Technologies, Inc. | Heat transfer apparatus and method of manufacturing an integrated circuit and heat sink assembly |
| US6664673B2 (en) * | 2001-08-27 | 2003-12-16 | Advanced Rotary Systems Llc | Cooler for electronic devices |
| US6739846B2 (en) * | 2002-07-24 | 2004-05-25 | Maxxan Systems, Inc. | Stacked redundant blowers |
| US7416388B2 (en) | 2003-07-02 | 2008-08-26 | Delta Electronics, Inc. | Fan |
| CN2757508Y (zh) * | 2004-12-04 | 2006-02-08 | 鸿富锦精密工业（深圳）有限公司 | 散热装置 |
| US7846579B2 (en) | 2005-03-25 | 2010-12-07 | Victor Krasnov | Thin film battery with protective packaging |
| US8679674B2 (en) * | 2005-03-25 | 2014-03-25 | Front Edge Technology, Inc. | Battery with protective packaging |
| CN100546019C (zh) | 2005-04-15 | 2009-09-30 | 富士通株式会社 | 散热器、电路基板、电子设备 |
| CN101008405B (zh) * | 2006-01-25 | 2010-08-11 | 建准电机工业股份有限公司 | 散热风扇 |
| US7345884B2 (en) * | 2006-03-14 | 2008-03-18 | Sunonwealth Electic Machine Industry Co., Ltd. | Heat-dissipating fan |
| JP2008140802A (ja) * | 2006-11-30 | 2008-06-19 | Fuji Electric Fa Components & Systems Co Ltd | ヒートシンク |
| JP2008140803A (ja) * | 2006-11-30 | 2008-06-19 | Fuji Electric Fa Components & Systems Co Ltd | ヒートシンク |
| US20090136839A1 (en) * | 2007-11-28 | 2009-05-28 | Front Edge Technology, Inc. | Thin film battery comprising stacked battery cells and method |
| JP2013526028A (ja) | 2010-04-23 | 2013-06-20 | ナパテック アクティーゼルスカブ | 熱制御式組立体 |
| US8488320B2 (en) * | 2010-05-26 | 2013-07-16 | Amtek Semiconductors Co., Ltd. | Semiconductor package having a cooling fan and method of fabricating the same |
| US8865340B2 (en) | 2011-10-20 | 2014-10-21 | Front Edge Technology Inc. | Thin film battery packaging formed by localized heating |
| KR101918261B1 (ko) * | 2011-11-28 | 2018-11-14 | 삼성전자주식회사 | 모바일 장치용 반도체 패키지 |
| US9887429B2 (en) | 2011-12-21 | 2018-02-06 | Front Edge Technology Inc. | Laminated lithium battery |
| US8864954B2 (en) | 2011-12-23 | 2014-10-21 | Front Edge Technology Inc. | Sputtering lithium-containing material with multiple targets |
| US9077000B2 (en) | 2012-03-29 | 2015-07-07 | Front Edge Technology, Inc. | Thin film battery and localized heat treatment |
| US9257695B2 (en) | 2012-03-29 | 2016-02-09 | Front Edge Technology, Inc. | Localized heat treatment of battery component films |
| US9159964B2 (en) | 2012-09-25 | 2015-10-13 | Front Edge Technology, Inc. | Solid state battery having mismatched battery cells |
| US8753724B2 (en) | 2012-09-26 | 2014-06-17 | Front Edge Technology Inc. | Plasma deposition on a partially formed battery through a mesh screen |
| US9356320B2 (en) | 2012-10-15 | 2016-05-31 | Front Edge Technology Inc. | Lithium battery having low leakage anode |
| US10008739B2 (en) | 2015-02-23 | 2018-06-26 | Front Edge Technology, Inc. | Solid-state lithium battery with electrolyte |
| US20160255746A1 (en) * | 2015-02-27 | 2016-09-01 | Laird Technologies, Inc. | Heat sinks including heat pipes and related methods |
| US10957886B2 (en) | 2018-03-14 | 2021-03-23 | Front Edge Technology, Inc. | Battery having multilayer protective casing |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2548124B2 (ja) * | 1985-08-29 | 1996-10-30 | 松下電器産業株式会社 | ヒ−トシンク装置 |
| US4768581A (en) * | 1987-04-06 | 1988-09-06 | International Business Machines Corporation | Cooling system for semiconductor modules |
| US4807441A (en) * | 1987-07-17 | 1989-02-28 | Allied-Signal Inc. | Cooling system for a sealed enclosure |
| US5132780A (en) * | 1988-01-07 | 1992-07-21 | Prime Computer, Inc. | Heat sink apparatus with an air deflection member |
| DE4121534C2 (de) * | 1990-06-30 | 1998-10-08 | Toshiba Kawasaki Kk | Kühlvorrichtung |
| JP2934493B2 (ja) * | 1990-10-24 | 1999-08-16 | 株式会社日立製作所 | 電子機器の冷却装置 |
| DE69329946T2 (de) * | 1992-08-06 | 2001-07-05 | Pfu Ltd., Ishikawa | Kühler für eine wärmeerzeugungsvorrichtung |
-
1993
- 1993-03-19 JP JP5060005A patent/JP2938704B2/ja not_active Expired - Fee Related
- 1993-09-03 DE DE69322494T patent/DE69322494T2/de not_active Expired - Fee Related
- 1993-09-03 EP EP93306980A patent/EP0620592B1/de not_active Expired - Lifetime
- 1993-09-13 KR KR1019930018331A patent/KR940022809A/ko not_active Application Discontinuation
-
1995
- 1995-06-06 US US08/468,187 patent/US5629560A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2938704B2 (ja) | 1999-08-25 |
| US5629560A (en) | 1997-05-13 |
| JPH06275750A (ja) | 1994-09-30 |
| EP0620592A1 (de) | 1994-10-19 |
| EP0620592B1 (de) | 1998-12-09 |
| DE69322494T2 (de) | 1999-04-29 |
| KR940022809A (ko) | 1994-10-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |