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DE69300724D1 - Kompakter Hochleistungspersonalcomputer mit verbessertem Luftkühlsystem. - Google Patents

Kompakter Hochleistungspersonalcomputer mit verbessertem Luftkühlsystem.

Info

Publication number
DE69300724D1
DE69300724D1 DE69300724T DE69300724T DE69300724D1 DE 69300724 D1 DE69300724 D1 DE 69300724D1 DE 69300724 T DE69300724 T DE 69300724T DE 69300724 T DE69300724 T DE 69300724T DE 69300724 D1 DE69300724 D1 DE 69300724D1
Authority
DE
Germany
Prior art keywords
personal computer
cooling system
high performance
air cooling
improved air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69300724T
Other languages
English (en)
Other versions
DE69300724T2 (de
Inventor
Duy Quoc Huhnh
Prabhakara Rao Vadapalli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE69300724D1 publication Critical patent/DE69300724D1/de
Application granted granted Critical
Publication of DE69300724T2 publication Critical patent/DE69300724T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69300724T 1992-07-10 1993-06-16 Kompakter Hochleistungspersonalcomputer mit verbessertem Luftkühlsystem. Expired - Fee Related DE69300724T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/911,598 US5218514A (en) 1992-07-10 1992-07-10 Compact high power personal computer with improved air cooling system

Publications (2)

Publication Number Publication Date
DE69300724D1 true DE69300724D1 (de) 1995-12-07
DE69300724T2 DE69300724T2 (de) 1996-05-30

Family

ID=25430537

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69300724T Expired - Fee Related DE69300724T2 (de) 1992-07-10 1993-06-16 Kompakter Hochleistungspersonalcomputer mit verbessertem Luftkühlsystem.

Country Status (4)

Country Link
US (1) US5218514A (de)
EP (1) EP0578394B1 (de)
JP (1) JPH081573B2 (de)
DE (1) DE69300724T2 (de)

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US5440632A (en) * 1992-12-02 1995-08-08 Scientific-Atlanta, Inc. Reprogrammable subscriber terminal
US5513329A (en) * 1993-07-15 1996-04-30 Dell Usa, L.P. Modular host local expansion upgrade
US5505533A (en) * 1994-01-10 1996-04-09 Artecon Rackmount for computer and mass storage enclosure
US5559673A (en) * 1994-09-01 1996-09-24 Gagnon; Kevin M. Dual filtered airflow systems for cooling computer components, with optimally placed air vents and switchboard control panel
US5822188A (en) * 1996-04-10 1998-10-13 Intergraph Corporation Removable circuit board with ducted cooling
WO1997046066A1 (en) * 1996-05-31 1997-12-04 Intergraph Corporation Apparatus and method for improved airflow through a chassis
US5835346A (en) * 1996-06-27 1998-11-10 Digital Equipment Corporation Low profile desk top computer
AU720452B2 (en) * 1996-08-15 2000-06-01 Xybernaut Corporation Mobile computer
US5719743A (en) * 1996-08-15 1998-02-17 Xybernaut Corporation Torso worn computer which can stand alone
US5948087A (en) * 1996-12-16 1999-09-07 Nexar Technologies, Inc. Computer architecture having platform-dependent and platform-independent boards forming the motherboard
US5813243A (en) * 1997-04-04 1998-09-29 Micron Electronics, Inc. Chambered forced cooling system
GR1003844B (el) * 1997-08-08 2002-03-19 ����������� ����� ��������� (����) Απλοποιημενο μετρητικο συστημα (αμς) για συλλογη και διαχειριση δεδομενων σε στολους ηλεκτρικων/υβριδικων οχηματων
US6069792A (en) * 1997-09-16 2000-05-30 Nelik; Jacob Computer component cooling assembly
US5986882A (en) * 1997-10-16 1999-11-16 Compaq Computer Corporation Electronic apparatus having removable processor/heat pipe cooling device modules therein
JPH11195282A (ja) * 1997-11-07 1999-07-21 Hitachi Ltd 磁気ディスク装置及び磁気ディスク装置システム
US6198633B1 (en) 1998-04-01 2001-03-06 International Business Machines Corporation Computer system and enclosure thereof
JP3412516B2 (ja) * 1998-06-29 2003-06-03 株式会社日立製作所 情報処理装置、その部品配置方法及びヒートシンク
US6144553A (en) * 1998-09-09 2000-11-07 Sun Microsystems, Inc. Refrigeration cooled disk storage assembly
US6198628B1 (en) 1998-11-24 2001-03-06 Unisys Corporation Parallel cooling of high power devices in a serially cooled evironment
US6198629B1 (en) * 1999-03-31 2001-03-06 International Business Machines Corporation Circuit board and computer system for enhanced cooling
US6130820A (en) * 1999-05-04 2000-10-10 Intel Corporation Memory card cooling device
ATE248396T1 (de) * 1999-06-28 2003-09-15 Sun Microsystems Inc Konfiguration eines rechnersystems
US6373697B1 (en) 1999-06-28 2002-04-16 Sun Microsystems, Inc. Computer system housing and configuration
US6650535B1 (en) * 1999-07-23 2003-11-18 Dell Products L.P. Fanless power supply
US6249437B1 (en) * 1999-10-15 2001-06-19 Tyco Electronics Logistics Ag Heat sink with offset fin profile
US6529374B2 (en) * 2001-02-26 2003-03-04 Teac Corporation Electronic apparatus
EP1256869A1 (de) 2001-05-10 2002-11-13 Hewlett Packard Company, a Delaware Corporation Montage von elektronischen Geräten
US6912128B2 (en) * 2001-08-09 2005-06-28 Celestica International Inc. Electronics cooling subassembly
EP1417708A2 (de) * 2001-08-09 2004-05-12 Celestica International Inc. Kühlungssystem
US20030066626A1 (en) * 2001-10-04 2003-04-10 John Bird Cooling system having independent fan location
US6958906B2 (en) * 2003-04-11 2005-10-25 Shan Ping Wu Method and apparatus for cooling a modular computer system with dual path airflow
US6967837B2 (en) * 2003-06-17 2005-11-22 Evserv Tech Corporation Computer apparatus assembled wirelessly
JP4340193B2 (ja) * 2004-05-28 2009-10-07 京セラミタ株式会社 シールドボックス
US7061760B2 (en) * 2004-07-19 2006-06-13 Tyco Electronics Corporation Memory cooler
US20060294317A1 (en) * 2005-06-22 2006-12-28 Berke Stuart A Symmetric multiprocessor architecture with interchangeable processor and IO modules
US20070000008A1 (en) * 2005-06-29 2007-01-04 Jack Sawicki Personal air-cooled garment apparatus
GB0516813D0 (en) * 2005-08-17 2005-09-21 Pace Micro Tech Plc Electronics cooling apparatus
US20070230118A1 (en) * 2006-03-31 2007-10-04 Javier Leija Circuit board including components aligned with a predominant air flow path through a chassis
US7623343B2 (en) * 2007-04-16 2009-11-24 Inventec Corporation Physical configuration of computer system
US7760506B1 (en) * 2007-06-06 2010-07-20 Hewlett-Packard Development Company, L.P. Electronic components, systems and apparatus with air flow devices
US8144458B2 (en) * 2007-06-13 2012-03-27 Hewlett-Packard Development Company, L.P. Component layout in an enclosure
US7599180B2 (en) * 2007-12-03 2009-10-06 Sun Microsystems, Inc. Air baffle with integrated tool-less expansion card attachment
JP5086047B2 (ja) * 2007-12-07 2012-11-28 株式会社日立製作所 受信装置
US7768781B2 (en) * 2007-12-18 2010-08-03 Lenovo Singapore Pte. Ltd Computer with improved cooling features
CN201562214U (zh) * 2009-10-14 2010-08-25 鸿富锦精密工业（深圳）有限公司 电子装置壳体
US8717759B2 (en) * 2010-02-01 2014-05-06 Thomson Licensing Apparatus and method for transforming a consumer device enclosure
JP2012069685A (ja) * 2010-09-22 2012-04-05 Panasonic Corp 電子機器
US8848364B2 (en) 2012-04-05 2014-09-30 Hewlett-Packard Development Company, L.P. Daughterboard having airflow path
KR101474616B1 (ko) * 2012-11-02 2014-12-18 삼성전기주식회사 전력반도체장치의 방열시스템
JP6272748B2 (ja) * 2014-12-15 2018-01-31 株式会社クボタ 粉粒体供給装置
DE102017126897A1 (de) * 2017-11-15 2019-05-16 Fujitsu Client Computing Limited Computeranordnung mit Luftleitelement und Luftleitelement
CN108563310A (zh) * 2018-04-23 2018-09-21 郑州云海信息技术有限公司 一种支持半长半高高功耗外接卡散热的导风罩

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4479198A (en) * 1983-02-23 1984-10-23 Honeywell Information Systems Inc. Modular computer system
US4644443A (en) * 1985-09-27 1987-02-17 Texas Instruments Incorporated Computer cooling system using recycled coolant
JP2577731B2 (ja) * 1987-01-13 1997-02-05 株式会社日立製作所 パ−ソナルコンピユ−タ
US4702154A (en) * 1987-01-28 1987-10-27 Dodson Douglas A Cooling system for personal computer
US4977532A (en) * 1988-04-06 1990-12-11 Xycom, Inc. Industrial computer system with removable equipment drawer
US5006959A (en) * 1989-09-22 1991-04-09 Unisys Corp. Cooling of circuit boards
US5101320A (en) * 1991-01-22 1992-03-31 Hayes Microcomputer Products, Inc. Apparatus for rack mounting multiple circuit boards
US5136468A (en) * 1991-03-15 1992-08-04 Amkly Systems, Inc. Modular computer chassis

Also Published As

Publication number Publication date
US5218514A (en) 1993-06-08
JPH0667754A (ja) 1994-03-11
DE69300724T2 (de) 1996-05-30
JPH081573B2 (ja) 1996-01-10
EP0578394A2 (de) 1994-01-12
EP0578394A3 (en) 1994-07-06
EP0578394B1 (de) 1995-11-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee