[go: up one dir, main page]

DE69228441D1 - Behandlungsvorrichtung. - Google Patents

Behandlungsvorrichtung.

Info

Publication number
DE69228441D1
DE69228441D1 DE69228441T DE69228441T DE69228441D1 DE 69228441 D1 DE69228441 D1 DE 69228441D1 DE 69228441 T DE69228441 T DE 69228441T DE 69228441 T DE69228441 T DE 69228441T DE 69228441 D1 DE69228441 D1 DE 69228441D1
Authority
DE
Germany
Prior art keywords
enclosure parts
workpiece
treatment device
enclosed
vacuum chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69228441T
Other languages
English (en)
Other versions
DE69228441T2 (de
Inventor
Andrew Jeffryes
Gordon Green
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aviza Europe Ltd
Original Assignee
Electrotech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrotech Ltd filed Critical Electrotech Ltd
Application granted granted Critical
Publication of DE69228441D1 publication Critical patent/DE69228441D1/de
Publication of DE69228441T2 publication Critical patent/DE69228441T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Pressure Vessels And Lids Thereof (AREA)
  • Press Drives And Press Lines (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Polarising Elements (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Electron Beam Exposure (AREA)
DE69228441T 1991-10-25 1992-10-22 Behandlungsvorrichtung. Expired - Lifetime DE69228441T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB919122676A GB9122676D0 (en) 1991-10-25 1991-10-25 Processing system
PCT/GB1992/001940 WO1993008591A1 (en) 1991-10-25 1992-10-22 Processing system

Publications (2)

Publication Number Publication Date
DE69228441D1 true DE69228441D1 (de) 1999-03-25
DE69228441T2 DE69228441T2 (de) 2000-08-03

Family

ID=10703527

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69228441T Expired - Lifetime DE69228441T2 (de) 1991-10-25 1992-10-22 Behandlungsvorrichtung.

Country Status (8)

Country Link
US (2) US5518771A (de)
EP (2) EP0764973A3 (de)
JP (2) JP2879833B2 (de)
KR (2) KR100209182B1 (de)
AT (1) ATE176835T1 (de)
DE (1) DE69228441T2 (de)
GB (1) GB9122676D0 (de)
WO (1) WO1993008591A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9324002D0 (en) * 1993-11-22 1994-01-12 Electrotech Ltd Processing system
KR960026249A (ko) * 1994-12-12 1996-07-22 윌리엄 이. 힐러 고압, 저온 반도체 갭 충진 프로세스
US5857368A (en) * 1995-10-06 1999-01-12 Applied Materials, Inc. Apparatus and method for fabricating metal paths in semiconductor substrates through high pressure extrusion
JP3955340B2 (ja) * 1996-04-26 2007-08-08 株式会社神戸製鋼所 高温高圧ガス処理装置
GB9616214D0 (en) * 1996-08-01 1996-09-11 Electrotech Ltd A high pressure seal
GB2333136B (en) * 1996-08-01 2001-01-17 Trikon Equip Ltd A high pressure seal
JP4246804B2 (ja) * 1997-03-26 2009-04-02 株式会社神戸製鋼所 加熱・加圧処理装置
US6140235A (en) * 1997-12-05 2000-10-31 Applied Materials, Inc. High pressure copper fill at low temperature
TW489827U (en) 1998-04-09 2002-06-01 Kobe Steel Ltd Apparatus for high-temperature and high-pressure treatment of semiconductor substrates
US6642140B1 (en) * 1998-09-03 2003-11-04 Micron Technology, Inc. System for filling openings in semiconductor products
WO2002005332A2 (en) * 2000-07-07 2002-01-17 Applied Materials, Inc. Loadlock chamber
US20040096300A1 (en) * 2001-06-30 2004-05-20 Ilya Perlov Loadlock chamber
US20030026677A1 (en) * 2001-08-03 2003-02-06 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd) High-pressure process apparatus
US20080264443A1 (en) * 2002-02-05 2008-10-30 Novellus Systems, Inc. Apparatus and methods for increasing the rate of solute concentration evolution in a supercritical process chamber
US6848458B1 (en) 2002-02-05 2005-02-01 Novellus Systems, Inc. Apparatus and methods for processing semiconductor substrates using supercritical fluids
JP3836765B2 (ja) 2002-08-02 2006-10-25 株式会社神戸製鋼所 高圧処理装置
US7153388B2 (en) * 2003-03-31 2006-12-26 Lam Research Corporation Chamber for high-pressure wafer processing and method for making the same
DE102004020915B4 (de) * 2004-04-28 2008-12-11 Centrotherm Photovoltaics Ag Druckmessvorrichtung für Vakuumanlagen

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3599601A (en) * 1968-05-28 1971-08-17 Nippon Carbon Co Ltd Internally heated autoclave for metal impregnation
SE399527B (sv) * 1974-05-06 1978-02-20 Arvidsson K E Metod att temporert eller permanent fylla halrum i ett material, vars skrymdensitet er legre en dess materialdensitet, med ett lettflyktigt kolvete samt ett mindre lettflyktigt kolvete, sasom fotogen eller tjera
US4534816A (en) * 1984-06-22 1985-08-13 International Business Machines Corporation Single wafer plasma etch reactor
US5194406A (en) * 1988-12-01 1993-03-16 Edward Bok Installation for transport and processing under a pulsating double-floating condition
WO1990006590A1 (en) * 1988-12-01 1990-06-14 Edward Bok Improved installation for transport and processing under a pulsating double-floating condition
NL8900003A (nl) * 1989-01-02 1990-08-01 Imec Inter Uni Micro Electr Inrichting en werkwijze voor het behandelen van een of meer plakken materiaal.
US5182424A (en) * 1989-10-31 1993-01-26 Vlastimil Frank Module encapsulation by induction heating

Also Published As

Publication number Publication date
GB9122676D0 (en) 1991-12-11
JPH11246970A (ja) 1999-09-14
EP0609327A1 (de) 1994-08-10
ATE176835T1 (de) 1999-03-15
KR940703075A (ko) 1994-09-17
DE69228441T2 (de) 2000-08-03
JPH07502376A (ja) 1995-03-09
EP0764973A2 (de) 1997-03-26
US5575850A (en) 1996-11-19
EP0764973A3 (de) 1998-05-20
EP0609327B1 (de) 1999-02-17
KR100209182B1 (ko) 1999-07-15
KR100248460B1 (en) 2000-03-15
WO1993008591A1 (en) 1993-04-29
JP2879833B2 (ja) 1999-04-05
US5518771A (en) 1996-05-21

Similar Documents

Publication Publication Date Title
ATE176835T1 (de) Behandlungsvorrichtung.
EP0736223A1 (de) Apparat und herstellungsverfahren von halbleitern, wie z.b.siliziumchips
EP0459650A3 (en) Semiconductor laser pump source
EP0367488A3 (de) Plattenmontierung für eine Vakuumverarbeitungsanlage
KR900008635A (ko) 반도체 웨이퍼의 흐림 방지장치
ATE86364T1 (de) Zweistufige trockenprimaerpumpe.
FR2485678B1 (de)
MY131253A (en) Semiconductor device and process for fabrication thereof
DE59205305D1 (de) Hochdruck-reiniger
IT9048246A0 (it) Procedimento per la lucidatura chimica meccanica bilaterale di fette di semiconduttori, nonche' dispositivo per la sua esecuzione, e fette di semiconduttori ottenibili con questo.
SE9203293L (sv) Högtryckspress med tryckavlastad cylindervägg
SE9000245L (sv) Halvledarkomponent och foerfarande foer dess framstaellning
NO177878C (no) Vakuumbryteranordning
ITMI932601A0 (it) Dispositivo per la stabilizzazione del vuoto e metodo per la sua produzione.
JPS5318967A (en) Wafer sucking jig
MY111308A (en) Molding machine for semiconductor package.
IT1257426B (it) Procedimento per il recupero di perossidasi di semi di soia.
EP0614080A3 (de) Gerät zur Erkennung der Form einer Halbleiterscheibe.
NO170936C (no) Analogifremgangsmaate til fremstilling av terapeutisk aktive, substituerte vinylcefalosporiner
JPS5377178A (en) Chuking device of semiconductor element substrate
KR940021331U (ko) 반도체 제조용 진공장비의 챔버 벤트장치
RU1779510C (ru) Манипул тор
FR2664593B1 (fr) Procede de preparation de la dimethyl-2,5 hydroxy-4 (2h) furanone-3.
JPS5383471A (en) Semiconductor switching device
JPS5718335A (en) Semiconductor wafer transfer apparatus

Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication related to discontinuation of the patent is to be deleted
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: TRIKON TECHNOLOGIES LTD., THORNBURY, BRISTOL, GB

8328 Change in the person/name/address of the agent

Representative=s name: ZEITLER, VOLPERT, KANDLBINDER, 80539 MUENCHEN

R071 Expiry of right

Ref document number: 609327

Country of ref document: EP