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DE69106177D1 - Optischer Modul mit einer Umhüllung und Verfahren zur Herstellung derselben. - Google Patents

Optischer Modul mit einer Umhüllung und Verfahren zur Herstellung derselben.

Info

Publication number
DE69106177D1
DE69106177D1 DE69106177T DE69106177T DE69106177D1 DE 69106177 D1 DE69106177 D1 DE 69106177D1 DE 69106177 T DE69106177 T DE 69106177T DE 69106177 T DE69106177 T DE 69106177T DE 69106177 D1 DE69106177 D1 DE 69106177D1
Authority
DE
Germany
Prior art keywords
cladding
producing
same
optical module
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69106177T
Other languages
English (en)
Other versions
DE69106177T2 (de
Inventor
Hisao Go
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of DE69106177D1 publication Critical patent/DE69106177D1/de
Publication of DE69106177T2 publication Critical patent/DE69106177T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE69106177T 1990-03-13 1991-02-27 Optischer Modul mit einer Umhüllung und Verfahren zur Herstellung derselben. Expired - Fee Related DE69106177T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6192090 1990-03-13
JP6192190 1990-03-13

Publications (2)

Publication Number Publication Date
DE69106177D1 true DE69106177D1 (de) 1995-02-09
DE69106177T2 DE69106177T2 (de) 1995-05-11

Family

ID=26403011

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69106177T Expired - Fee Related DE69106177T2 (de) 1990-03-13 1991-02-27 Optischer Modul mit einer Umhüllung und Verfahren zur Herstellung derselben.

Country Status (5)

Country Link
US (1) US5127071A (de)
EP (1) EP0446711B1 (de)
AU (1) AU637205B2 (de)
CA (1) CA2036727C (de)
DE (1) DE69106177T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03116107A (ja) * 1989-09-29 1991-05-17 Sumitomo Electric Ind Ltd 光通信器
EP0446410B1 (de) * 1990-03-13 1999-12-22 Sumitomo Electric Industries, Ltd. Optisches Modul und Verfahren zu seiner Herstellung
US5275765A (en) * 1991-01-23 1994-01-04 Sumitomo Electric Industries, Ltd. Method of manufacturing an optical module using a mold die
US5416871A (en) * 1993-04-09 1995-05-16 Sumitomo Electric Industries, Ltd. Molded optical connector module
US5546489A (en) * 1993-08-02 1996-08-13 Sumitomo Electric Industries, Ltd. Optical link apparatus
SE9402082L (sv) * 1994-06-14 1995-12-15 Ericsson Telefon Ab L M Optisk miniatyrkapsel
US6220878B1 (en) 1995-10-04 2001-04-24 Methode Electronics, Inc. Optoelectronic module with grounding means
US5717533A (en) 1995-01-13 1998-02-10 Methode Electronics Inc. Removable optoelectronic module
US6095974A (en) * 1995-07-21 2000-08-01 Respironics, Inc. Disposable fiber optic probe
DE69635228T2 (de) * 1995-07-21 2006-05-18 Respironics, Inc. Vorrichtung für die pulsoximetrie durch laserdiode mittels multifaser optischen kabeln und wegwerf faseroptischen sonden
US6354747B1 (en) 1996-08-26 2002-03-12 Sumitomo Electric Industries, Ltd. Optical module
EP0826997B1 (de) * 1996-08-26 2003-07-23 Sumitomo Electric Industries, Ltd. Optoelektronisches Modul und Verfahren zu dessen Herstellung
SG71172A1 (en) * 1997-12-03 2000-03-21 Sumitomo Electric Industries Optical data link
US6239427B1 (en) * 1998-01-14 2001-05-29 Sumitomo Electric Industries, Ltd. Optical data link
US6901221B1 (en) 1999-05-27 2005-05-31 Jds Uniphase Corporation Method and apparatus for improved optical elements for vertical PCB fiber optic modules
US6213651B1 (en) 1999-05-26 2001-04-10 E20 Communications, Inc. Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers
US6220873B1 (en) 1999-08-10 2001-04-24 Stratos Lightwave, Inc. Modified contact traces for interface converter
WO2008111524A1 (ja) * 2007-03-09 2008-09-18 Omron Corporation パッケージの製造方法、パッケージ、光モジュール、及び一体成型用金型
DE102020123465B4 (de) * 2020-09-09 2022-03-17 HARTING Electronics GmbH Optoelektronisches Modul, optoelektronischer Steckverbinder und optoelektronische Unterverteilung
JP2023085745A (ja) * 2021-12-09 2023-06-21 日本航空電子工業株式会社 電子部品の製造方法及び電子部品

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4116532A (en) * 1977-01-05 1978-09-26 Bell Telephone Laboratories, Incorporated Fiber positioning and connection method and apparatus
US4149072A (en) * 1977-08-05 1979-04-10 Minnesota Mining And Manufacturing Company System for flat ribbon optical fiber data communications link
US4136357A (en) * 1977-10-03 1979-01-23 National Semiconductor Corporation Integrated circuit package with optical input coupler
DE3172553D1 (en) * 1980-11-28 1985-11-07 Toshiba Kk Method for manufacturing a module for a fiber optic link
JPS584952A (ja) * 1981-07-01 1983-01-12 Toshiba Corp 半導体装置
GB2126795B (en) * 1982-09-09 1986-12-03 Plessey Co Plc Optical device
JPS59119774A (ja) * 1982-12-25 1984-07-11 Toshiba Corp 光結合半導体装置
JPS59205775A (ja) * 1983-05-10 1984-11-21 Sumitomo Electric Ind Ltd 光モジユ−ル
IT1169922B (it) * 1983-11-04 1987-06-03 Telettra Lab Telefon Sistema e dispositivi per la connessione di fotorivelatori e di fibra ottica
FR2562271B1 (fr) * 1984-03-29 1986-07-18 Telecommunications Sa Connecteur d'une fibre optique et d'un photo-element, recepteur ou emetteur, et procede de positionnement de ceux-ci
US4730198A (en) * 1984-11-26 1988-03-08 American Telephone And Telegraph Company, At&T Bell Laboratories Aligning arrays of optoelectronic devices to arrays of optical fibers
US4803361A (en) * 1986-05-26 1989-02-07 Hitachi, Ltd. Photoelectric device with optical fiber and laser emitting chip
US4827118A (en) * 1986-07-10 1989-05-02 Minolta Camera Kabushiki Kaisha Light-sensitive device having color filter and manufacturing method thereof
EP0273364B1 (de) * 1986-12-26 1992-03-25 Idec Izumi Corporation Trägerband für elektronische Bauteile und Herstellungsverfahren
US4820013A (en) * 1987-01-06 1989-04-11 Alps Electric Co., Ltd. LED array head
JPH0719898B2 (ja) * 1987-01-30 1995-03-06 日本電気株式会社 光電気集積回路
GB8714396D0 (en) * 1987-06-19 1987-07-22 Amp Holland Fiber optic connector
JPH073907B2 (ja) * 1987-07-03 1995-01-18 株式会社日立製作所 デュアルインラインパッケ−ジ形半導体レ−ザモジュ−ル
JPH0828455B2 (ja) * 1988-02-24 1996-03-21 富士通株式会社 リードフレーム及びそれを用いた電子部品の製造方法
GB8816603D0 (en) * 1988-07-13 1988-08-17 Bt & D Technologies Ltd Optical components
US5011256A (en) * 1988-10-28 1991-04-30 E. I. Du Pont De Nemours And Company Package for an opto-electronic component
US4961107A (en) * 1989-04-03 1990-10-02 Motorola Inc. Electrically isolated heatsink for single-in-line package

Also Published As

Publication number Publication date
EP0446711B1 (de) 1994-12-28
US5127071A (en) 1992-06-30
AU637205B2 (en) 1993-05-20
AU7283991A (en) 1991-09-19
DE69106177T2 (de) 1995-05-11
CA2036727C (en) 1998-12-22
EP0446711A1 (de) 1991-09-18
CA2036727A1 (en) 1991-09-14

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Legal Events

Date Code Title Description
8320 Willingness to grant licences declared (paragraph 23)
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee