DE69029174D1 - Leitfähige Heizungseinheit - Google Patents
Leitfähige HeizungseinheitInfo
- Publication number
- DE69029174D1 DE69029174D1 DE69029174T DE69029174T DE69029174D1 DE 69029174 D1 DE69029174 D1 DE 69029174D1 DE 69029174 T DE69029174 T DE 69029174T DE 69029174 T DE69029174 T DE 69029174T DE 69029174 D1 DE69029174 D1 DE 69029174D1
- Authority
- DE
- Germany
- Prior art keywords
- heating unit
- conductive heating
- conductive
- unit
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
- H05B3/36—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs heating conductor embedded in insulating material
- H05B3/38—Powder conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/06—Treatment with inorganic compounds
- C09C3/066—Treatment or coating resulting in a free metal containing surface-region
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/30—Particle morphology extending in three dimensions
- C01P2004/32—Spheres
- C01P2004/34—Spheres hollow
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/80—Particles consisting of a mixture of two or more inorganic phases
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/10—Solid density
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/11—Powder tap density
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Nanotechnology (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Composite Materials (AREA)
- Inorganic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Resistance Heating (AREA)
- Paints Or Removers (AREA)
- Surface Heating Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Secondary Cells (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1182419A JP2849405B2 (ja) | 1989-07-17 | 1989-07-17 | 導電性発熱体 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69029174D1 true DE69029174D1 (de) | 1997-01-02 |
DE69029174T2 DE69029174T2 (de) | 1997-06-12 |
Family
ID=16117957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69029174T Expired - Fee Related DE69029174T2 (de) | 1989-07-17 | 1990-07-13 | Leitfähige Heizungseinheit |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0409099B1 (de) |
JP (1) | JP2849405B2 (de) |
KR (1) | KR0181499B1 (de) |
CA (1) | CA2021291C (de) |
DE (1) | DE69029174T2 (de) |
NO (1) | NO303160B1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2811611B2 (ja) * | 1990-08-09 | 1998-10-15 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | フルオロカーボン塗料組成物 |
US5762830A (en) * | 1995-10-23 | 1998-06-09 | Hoechst Celanese Corporation | Electronically and thermally conducting compositions for actuators |
US6209457B1 (en) | 1998-08-13 | 2001-04-03 | Technology Commercialization Corp. | Method and preformed composition for controlled localized heating of a base material using an exothermic reaction |
KR20010016784A (ko) * | 1999-08-03 | 2001-03-05 | 최병대 | 광택 및 반사 특성이 우수한 도금 미소 유리구슬, 그 제조방법 |
EP1284278B1 (de) | 2001-08-14 | 2013-01-23 | Benecke-Kaliko AG | Wässrige Beschichtungszusammensetzung für die Herstellung elektrisch leitfähiger Beschichtungen auf Textilien |
EP1544258A1 (de) * | 2003-12-17 | 2005-06-22 | Tarkett SAS | Elektrisch leitfähige Fussbodenbeläge |
US7476339B2 (en) | 2006-08-18 | 2009-01-13 | Saint-Gobain Ceramics & Plastics, Inc. | Highly filled thermoplastic composites |
JP5215950B2 (ja) * | 2009-06-26 | 2013-06-19 | 日本オクラロ株式会社 | 電子機器および電気的接続方法 |
DE102010060904A1 (de) | 2010-11-30 | 2012-05-31 | Benecke-Kaliko Ag | Polymermischung |
JP6639823B2 (ja) * | 2015-01-13 | 2020-02-05 | 三菱マテリアル電子化成株式会社 | 銀被覆樹脂粒子及びその製造方法並びにそれを用いた導電性ペースト |
DE102015207814A1 (de) | 2015-04-28 | 2016-11-03 | Benecke-Kaliko Ag | Elektrisch leitfähige Materialzusammensetzung |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6096548A (ja) * | 1983-10-31 | 1985-05-30 | Nippon Chem Ind Co Ltd:The | 導電性材料 |
US4624865A (en) * | 1984-05-21 | 1986-11-25 | Carolina Solvents, Inc. | Electrically conductive microballoons and compositions incorporating same |
JPS61152775A (ja) * | 1984-12-27 | 1986-07-11 | Toshiba Corp | 導電性塗料 |
JPS62153146A (ja) * | 1985-12-26 | 1987-07-08 | Asaoka Kk | 金属被膜を有するシラスバル−ンの製造方法 |
DE3606653A1 (de) * | 1986-02-28 | 1987-09-03 | Mankiewicz Gebr & Co | Zielobjekt |
-
1989
- 1989-07-17 JP JP1182419A patent/JP2849405B2/ja not_active Expired - Fee Related
-
1990
- 1990-07-13 DE DE69029174T patent/DE69029174T2/de not_active Expired - Fee Related
- 1990-07-13 NO NO903151A patent/NO303160B1/no not_active IP Right Cessation
- 1990-07-13 EP EP90113429A patent/EP0409099B1/de not_active Expired - Lifetime
- 1990-07-16 KR KR1019900010799A patent/KR0181499B1/ko not_active IP Right Cessation
- 1990-07-16 CA CA002021291A patent/CA2021291C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2849405B2 (ja) | 1999-01-20 |
KR0181499B1 (ko) | 1999-05-15 |
EP0409099A3 (en) | 1991-06-05 |
NO903151L (no) | 1991-01-18 |
CA2021291A1 (en) | 1991-01-18 |
NO903151D0 (no) | 1990-07-13 |
EP0409099A2 (de) | 1991-01-23 |
CA2021291C (en) | 2000-02-01 |
DE69029174T2 (de) | 1997-06-12 |
JPH0347878A (ja) | 1991-02-28 |
NO303160B1 (no) | 1998-06-02 |
EP0409099B1 (de) | 1996-11-20 |
KR910004064A (ko) | 1991-02-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |