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DE69009815D1 - Mehrschichtkondensator für die Oberflächenmontagetechnik sowie gedruckte Schaltung mit solchen Mehrschichtkondensatoren. - Google Patents

Mehrschichtkondensator für die Oberflächenmontagetechnik sowie gedruckte Schaltung mit solchen Mehrschichtkondensatoren.

Info

Publication number
DE69009815D1
DE69009815D1 DE69009815T DE69009815T DE69009815D1 DE 69009815 D1 DE69009815 D1 DE 69009815D1 DE 69009815 T DE69009815 T DE 69009815T DE 69009815 T DE69009815 T DE 69009815T DE 69009815 D1 DE69009815 D1 DE 69009815D1
Authority
DE
Germany
Prior art keywords
layer
printed circuit
surface mounting
mounting technology
layer capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69009815T
Other languages
English (en)
Other versions
DE69009815T2 (de
Inventor
Johannus Wilhelmus Weekamp
Pieter Kats
Luc Achille Germain Jacques
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Phycomp Holding BV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of DE69009815D1 publication Critical patent/DE69009815D1/de
Publication of DE69009815T2 publication Critical patent/DE69009815T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE69009815T 1989-03-13 1990-03-07 Mehrschichtkondensator für die Oberflächenmontagetechnik sowie gedruckte Schaltung mit solchen Mehrschichtkondensatoren. Expired - Fee Related DE69009815T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8900594 1989-03-13
NL8901244 1989-05-19

Publications (2)

Publication Number Publication Date
DE69009815D1 true DE69009815D1 (de) 1994-07-21
DE69009815T2 DE69009815T2 (de) 1995-02-23

Family

ID=26646499

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69009815T Expired - Fee Related DE69009815T2 (de) 1989-03-13 1990-03-07 Mehrschichtkondensator für die Oberflächenmontagetechnik sowie gedruckte Schaltung mit solchen Mehrschichtkondensatoren.

Country Status (5)

Country Link
US (1) US5053916A (de)
EP (1) EP0389020B1 (de)
JP (1) JPH02273911A (de)
KR (1) KR0163426B1 (de)
DE (1) DE69009815T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3667354B2 (ja) 1992-11-27 2005-07-06 富士通株式会社 ヘッドスライダ支持体
US5627720A (en) * 1995-08-11 1997-05-06 Lewis; Keith A. Power distribution box with surge suppressor
DE19540604A1 (de) * 1995-10-31 1997-05-07 Siemens Matsushita Components Überstromsicherung
US5731948A (en) * 1996-04-04 1998-03-24 Sigma Labs Inc. High energy density capacitor
TW335595B (en) * 1996-09-09 1998-07-01 Philips Electronics Nv Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturiing such components
JPH1083935A (ja) * 1996-09-09 1998-03-31 Taiyo Yuden Co Ltd コンデンサとその製造方法
US5912796A (en) * 1996-11-15 1999-06-15 Illinois Tool Works, Inc. Metallized film capacitor and manufacturing process
EP0951724A2 (de) * 1997-04-25 1999-10-27 Koninklijke Philips Electronics N.V. Herstellungsverfahren von einem umhüllten vielschichtkondensator und so hergestellter umhüllter vielschichtkondensator
JP3412521B2 (ja) * 1998-07-10 2003-06-03 株式会社村田製作所 電子部品
DE19903500A1 (de) * 1999-01-29 2000-08-03 Philips Corp Intellectual Pty Dünnschichtschaltkreis mit Bauteil
AU1198700A (en) * 1999-03-16 2000-10-04 Maxwell Energy Products Low inductance four terminal capacitor lead frame
DE10026259A1 (de) * 2000-05-26 2001-12-06 Epcos Ag Kondensator und Verfahren zur Herstellung des Kondensators
US7967184B2 (en) * 2005-11-16 2011-06-28 Sandisk Corporation Padless substrate for surface mounted components
US8169014B2 (en) 2006-01-09 2012-05-01 Taiwan Semiconductor Manufacturing Co., Ltd. Interdigitated capacitive structure for an integrated circuit
US20090032941A1 (en) * 2007-08-01 2009-02-05 Mclellan Neil Under Bump Routing Layer Method and Apparatus
US7906424B2 (en) 2007-08-01 2011-03-15 Advanced Micro Devices, Inc. Conductor bump method and apparatus
US8072773B2 (en) 2008-04-04 2011-12-06 John Mruz Ultra-wideband assembly system and method
US8314474B2 (en) * 2008-07-25 2012-11-20 Ati Technologies Ulc Under bump metallization for on-die capacitor
US9831035B2 (en) 2014-10-31 2017-11-28 Deere & Company Capacitor with improved heat dissipation
US9439278B2 (en) 2014-12-12 2016-09-06 Deere & Company Film capacitor having a package for heat transfer
KR102632357B1 (ko) * 2018-12-21 2024-02-02 삼성전기주식회사 커패시터 부품
US20240203911A1 (en) * 2022-12-16 2024-06-20 Nxp Usa, Inc. Interposer with integrative passive components

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2442810A (en) * 1943-04-13 1948-06-08 Western Electric Co Dielectric materials
US2820934A (en) * 1954-08-18 1958-01-21 Acf Ind Inc Capacitor assembly
US3244953A (en) * 1965-02-08 1966-04-05 Erie Technological Prod Inc Wound capacitor having hermetically sealed terminals
US3513369A (en) * 1968-04-08 1970-05-19 Sprague Electric Co Extended foil capacitor
DE3120298C2 (de) * 1981-05-21 1983-07-07 Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut Kondensator in Chip-Bauweise
FR2561034B1 (fr) * 1984-03-09 1987-04-24 Reybel Liliane Condensateur a dielectrique film plastique comportant deux electrodes de sortie pourvues de conducteurs aptes a etre soudes sur circuit imprime
US4613518A (en) * 1984-04-16 1986-09-23 Sfe Technologies Monolithic capacitor edge termination
JPH0656826B2 (ja) * 1984-06-04 1994-07-27 東レ株式会社 コンデンサ
DE3425727A1 (de) * 1984-07-12 1986-01-23 Siemens AG, 1000 Berlin und 8000 München Induktivitaetsarme verbindung zwischen einem elektrischen kondensator und einer metallgehaeusewandung, insbesondere eines entstoerfilters
DE3435166A1 (de) * 1984-09-25 1986-04-03 Siemens AG, 1000 Berlin und 8000 München Elektrischer kondensator mit gewickelten oder insbesondere geschichteten dielektrikumslagen und verfahren zu seiner herstellung
DE3612519A1 (de) * 1986-04-14 1987-10-15 Siemens Ag Umhuellter regenerierfaehiger elektrischer schichtkondensator
JPS6477910A (en) * 1987-09-18 1989-03-23 Matsushita Electric Ind Co Ltd Capacitor

Also Published As

Publication number Publication date
EP0389020B1 (de) 1994-06-15
JPH02273911A (ja) 1990-11-08
DE69009815T2 (de) 1995-02-23
US5053916A (en) 1991-10-01
KR0163426B1 (en) 1998-12-15
KR900015194A (ko) 1990-10-26
EP0389020A1 (de) 1990-09-26

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N

8327 Change in the person/name/address of the patent owner

Owner name: PHYCOMP HOLDING B.V., ROERMOND, NL

8339 Ceased/non-payment of the annual fee