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DE69004452D1 - Nitroverbindungen als Insektizide. - Google Patents

Nitroverbindungen als Insektizide.

Info

Publication number
DE69004452D1
DE69004452D1 DE90101858T DE69004452T DE69004452D1 DE 69004452 D1 DE69004452 D1 DE 69004452D1 DE 90101858 T DE90101858 T DE 90101858T DE 69004452 T DE69004452 T DE 69004452T DE 69004452 D1 DE69004452 D1 DE 69004452D1
Authority
DE
Germany
Prior art keywords
insecticides
nitro compounds
nitro
compounds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE90101858T
Other languages
English (en)
Other versions
DE69004452T2 (de
Inventor
Kozo Shiokawa
Shinichi Tsuboi
Koichi Moriya
Yumi Hattori
Ikuro Honda
Katsuhiko Shibuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer CropScience KK
Original Assignee
Nihon Bayer Agrochem KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Bayer Agrochem KK filed Critical Nihon Bayer Agrochem KK
Application granted granted Critical
Publication of DE69004452D1 publication Critical patent/DE69004452D1/de
Publication of DE69004452T2 publication Critical patent/DE69004452T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D277/00—Heterocyclic compounds containing 1,3-thiazole or hydrogenated 1,3-thiazole rings
    • C07D277/02—Heterocyclic compounds containing 1,3-thiazole or hydrogenated 1,3-thiazole rings not condensed with other rings
    • C07D277/20—Heterocyclic compounds containing 1,3-thiazole or hydrogenated 1,3-thiazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members
    • C07D277/32—Heterocyclic compounds containing 1,3-thiazole or hydrogenated 1,3-thiazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01N—PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF; BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES; PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS
    • A01N43/00—Biocides, pest repellants or attractants, or plant growth regulators containing heterocyclic compounds
    • A01N43/34—Biocides, pest repellants or attractants, or plant growth regulators containing heterocyclic compounds having rings with one nitrogen atom as the only ring hetero atom
    • A01N43/40—Biocides, pest repellants or attractants, or plant growth regulators containing heterocyclic compounds having rings with one nitrogen atom as the only ring hetero atom six-membered rings
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01N—PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF; BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES; PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS
    • A01N47/00—Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom not being member of a ring and having no bond to a carbon or hydrogen atom, e.g. derivatives of carbonic acid
    • A01N47/40—Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom not being member of a ring and having no bond to a carbon or hydrogen atom, e.g. derivatives of carbonic acid the carbon atom having a double or triple bond to nitrogen, e.g. cyanates, cyanamides
    • A01N47/42—Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom not being member of a ring and having no bond to a carbon or hydrogen atom, e.g. derivatives of carbonic acid the carbon atom having a double or triple bond to nitrogen, e.g. cyanates, cyanamides containing —N=CX2 groups, e.g. isothiourea
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01N—PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF; BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES; PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS
    • A01N47/00—Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom not being member of a ring and having no bond to a carbon or hydrogen atom, e.g. derivatives of carbonic acid
    • A01N47/40—Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom not being member of a ring and having no bond to a carbon or hydrogen atom, e.g. derivatives of carbonic acid the carbon atom having a double or triple bond to nitrogen, e.g. cyanates, cyanamides
    • A01N47/42—Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom not being member of a ring and having no bond to a carbon or hydrogen atom, e.g. derivatives of carbonic acid the carbon atom having a double or triple bond to nitrogen, e.g. cyanates, cyanamides containing —N=CX2 groups, e.g. isothiourea
    • A01N47/44—Guanidine; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D213/00—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members
    • C07D213/02—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members
    • C07D213/04—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen or carbon atoms directly attached to the ring nitrogen atom
    • C07D213/24—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen or carbon atoms directly attached to the ring nitrogen atom with substituted hydrocarbon radicals attached to ring carbon atoms
    • C07D213/36—Radicals substituted by singly-bound nitrogen atoms
    • C07D213/38—Radicals substituted by singly-bound nitrogen atoms having only hydrogen or hydrocarbon radicals attached to the substituent nitrogen atom
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D213/00—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members
    • C07D213/02—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members
    • C07D213/04—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen or carbon atoms directly attached to the ring nitrogen atom
    • C07D213/60—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen or carbon atoms directly attached to the ring nitrogen atom with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
    • C07D213/61—Halogen atoms or nitro radicals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Dentistry (AREA)
  • Wood Science & Technology (AREA)
  • Plant Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Agronomy & Crop Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Pest Control & Pesticides (AREA)
  • Zoology (AREA)
  • Environmental Sciences (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Pyridine Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Wire Bonding (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
DE90101858T 1989-02-13 1990-01-31 Nitroverbindungen als Insektizide. Expired - Fee Related DE69004452T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3114589 1989-02-13

Publications (2)

Publication Number Publication Date
DE69004452D1 true DE69004452D1 (de) 1993-12-16
DE69004452T2 DE69004452T2 (de) 1994-03-10

Family

ID=12323273

Family Applications (1)

Application Number Title Priority Date Filing Date
DE90101858T Expired - Fee Related DE69004452T2 (de) 1989-02-13 1990-01-31 Nitroverbindungen als Insektizide.

Country Status (13)

Country Link
US (2) US5084467A (de)
EP (1) EP0383091B1 (de)
KR (1) KR0156570B1 (de)
AU (1) AU623219B2 (de)
BR (1) BR9000631A (de)
CA (1) CA2009735C (de)
DE (1) DE69004452T2 (de)
DK (1) DK0383091T3 (de)
ES (1) ES2059841T3 (de)
HU (1) HU204787B (de)
PT (1) PT93063B (de)
TR (1) TR24175A (de)
ZA (1) ZA901028B (de)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2610988B2 (ja) 1989-03-09 1997-05-14 日本バイエルアグロケム 株式会社 新規ヘテロ環式化合物及び殺虫剤
US6232309B1 (en) 1989-03-09 2001-05-15 Nihon Bayer Agrochem K.K. Insecticidal heterocyclic compounds
JP3159697B2 (ja) * 1989-06-16 2001-04-23 日本バイエルアグロケム株式会社 シロアリ防除剤
IL99161A (en) * 1990-08-17 1996-11-14 Takeda Chemical Industries Ltd History of guanidine A process for their preparation and preparations from pesticides that contain them
TW198724B (de) * 1990-10-24 1993-01-21 Ciba Geigy Ag
IE70666B1 (en) * 1990-12-28 1996-12-11 Takeda Chemical Industries Ltd Stable agrochemical compositions
TW202434B (de) * 1991-04-04 1993-03-21 Ciba Geigy Ag
JP3068930B2 (ja) * 1991-12-19 2000-07-24 日本バイエルアグロケム株式会社 殺虫性グアニジン類
DK0616494T3 (da) * 1992-05-23 1999-06-21 Novartis Ag 1-[N-(halo-3-pyridylmethyl)]-N-methylamino-1-alkylamino-2-nitroethylenderivater til bekæmpelse af lopper på husdyr
DE4301109A1 (de) * 1993-01-18 1994-07-21 Bayer Ag Verfahren zur Herstellung von 6-Amino-nicotinsäurenitrilen
US5328079A (en) * 1993-03-19 1994-07-12 National Semiconductor Corporation Method of and arrangement for bond wire connecting together certain integrated circuit components
DE4417742A1 (de) 1994-05-20 1995-11-23 Bayer Ag Nicht-systemische Bekämpfung von Parasiten
DE4426753A1 (de) 1994-07-28 1996-02-01 Bayer Ag Mittel zur Bekämpfung von Pflanzenschädlingen
US6828275B2 (en) 1998-06-23 2004-12-07 Bayer Aktiengesellschaft Synergistic insecticide mixtures
DE19622355A1 (de) 1996-06-04 1997-12-11 Bayer Ag Formkörper die agrochemische Mittel freisetzen
DE19712411A1 (de) 1997-03-25 1998-10-01 Bayer Ag Verfahren zur Herstellung von 1,3-disubstituierten 2-Nitroguanidinen
JPH1140595A (ja) * 1997-07-16 1999-02-12 Mitsubishi Electric Corp ワイヤ配線方法、このワイヤ配線方法に使用する配線分岐パッド、および、ボンディング装置、並びに、ワイヤ配線方法をコンピュータに実行させるためのプログラムを記録したコンピュータ読み取り可能な記録媒体
KR20010023053A (ko) * 1997-08-20 2001-03-26 한스 루돌프 하우스, 헨리테 브룬너, 베아트리체 귄터 유기 화합물의 제조방법
DE19807633A1 (de) * 1998-02-23 1999-08-26 Bayer Ag Dermal applizierbare wasserhaltige Formulierungen von Parasitiziden
DE19807630A1 (de) 1998-02-23 1999-08-26 Bayer Ag Wasserhaltige Mittel zur Bekämpfung parasitierender Insekten und Milben an Menschen
DE19823396A1 (de) 1998-05-26 1999-12-02 Bayer Ag Synergistische insektizide Mischungen
US6149913A (en) * 1998-11-16 2000-11-21 Rhone-Poulenc Ag Company, Inc. Compositions and methods for controlling insects
CO5210925A1 (es) 1998-11-17 2002-10-30 Novartis Ag Derivados de diamino nitroguanidina tetrasustituidos
DE19913174A1 (de) 1999-03-24 2000-09-28 Bayer Ag Synergistische insektizide Mischungen
US6156703A (en) * 1999-05-21 2000-12-05 Ijo Products, Llc Method of inhibiting fruit set on fruit producing plants using an aqueous emulsion of eicosenyl eicosenoate and docosenyl eicosenoate
DE19948129A1 (de) * 1999-10-07 2001-04-12 Bayer Ag Wirkstoffkombinationen mit insektiziden und akariziden Eigenschaften
DE19961604A1 (de) 1999-12-21 2001-07-05 Bayer Ag Verfahren zur Herstellung von 1,3-disubstituierten 2-Nitroguanidinen
DE10024934A1 (de) 2000-05-19 2001-11-22 Bayer Ag Wirkstoffkombinationen mit insektiziden akariziden Eigenschaften
US20020103233A1 (en) 2000-11-30 2002-08-01 Arther Robert G. Compositions for enhanced acaricidal activity
DE10117676A1 (de) 2001-04-09 2002-10-10 Bayer Ag Dermal applizierbare flüssige Formulierungen zur Bekämpfung von parasitierenden Insekten an Tieren
DE10121652A1 (de) * 2001-05-03 2002-11-07 Bayer Ag Verfahren zur Herstellung von 1,3-disubstituierten 2-Nitroguanidinen
US7021520B2 (en) * 2001-12-05 2006-04-04 Micron Technology, Inc. Stacked chip connection using stand off stitch bonding
DE10203688A1 (de) * 2002-01-31 2003-08-07 Bayer Cropscience Ag Synergistische insektizide Mischungen
US8232261B2 (en) 2003-07-18 2012-07-31 Bayer Cropscience Lp Method of minimizing herbicidal injury
DE102004006075A1 (de) 2003-11-14 2005-06-16 Bayer Cropscience Ag Wirkstoffkombinationen mit insektiziden Eigenschaften
US7074705B2 (en) * 2004-02-25 2006-07-11 Agere Systems Inc. Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles
DE102004032418A1 (de) * 2004-04-07 2005-10-27 Bayer Cropscience Ag Wirkstoffkombinationen mit insektiziden Eigenschaften
EP1784078A2 (de) * 2004-08-25 2007-05-16 Bayer Cropscience LP Verfahren zur kontrolle von termiten
US9919979B2 (en) 2005-01-21 2018-03-20 Bayer Cropscience Lp Fertilizer-compatible composition
KR101232932B1 (ko) * 2008-02-29 2013-02-13 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 본딩 기계상에서의 본딩 지점 교수 방법과 와이어 루프 검사 방법, 및 이를 수행하는 장치들
US8302841B2 (en) * 2008-03-17 2012-11-06 Kulicke And Soffa Industries Wire payout measurement and calibration techniques for a wire bonding machine
SG175947A1 (en) * 2009-05-19 2011-12-29 Kulicke & Soffa Ind Inc Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
US8998063B2 (en) * 2012-02-07 2015-04-07 Orthodyne Electronics Corporation Wire loop forming systems and methods of using the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4226710A (en) * 1979-02-12 1980-10-07 Andco Industries, Inc. Process for purifying water containing fluoride ion
US4327860A (en) * 1980-01-03 1982-05-04 Kulicke And Soffa Ind. Inc. Method of making slack free wire interconnections
DE3232462A1 (de) * 1982-09-01 1984-03-01 Bayer Ag, 5090 Leverkusen 2-nitro-1,1-ethendiamine, verfahren zu ihrer herstellung sowie ihre verwendung als arzneimittel
US4499097A (en) * 1983-03-10 1985-02-12 American Cyanamid Company 2-(Pyridyl)imidazolyl ketones
FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif
ZW5085A1 (en) * 1984-04-13 1985-09-18 Nihon Tokushu Noyaku Seizo Kk Nitromethylene derivatives,intermediates thereof,processes for production thereof,and insecticides
JPS62234064A (ja) * 1986-04-02 1987-10-14 Morishita Seiyaku Kk Ｎ−シアノイソチオウレア誘導体
US4963574A (en) * 1987-02-24 1990-10-16 Ciba-Geigy Corporation N-cyanoisothiourea compounds useful in pest control
EP0509559B1 (de) * 1987-08-01 2001-10-04 Takeda Chemical Industries, Ltd. Alpha-ungesättigte Amine, ihre Herstellung und Verwendung
US4918086A (en) * 1987-08-07 1990-04-17 Ciba-Geigy Corporation 1-nitro-2,2-diaminoethylene derivatives
EP0303570A3 (de) * 1987-08-12 1990-11-07 Ciba-Geigy Ag Substituierte Isothioharnstoffe
US4925085A (en) * 1989-05-25 1990-05-15 Motorola Inc. Bonding means and method

Also Published As

Publication number Publication date
AU623219B2 (en) 1992-05-07
ES2059841T3 (es) 1994-11-16
HU900772D0 (en) 1990-04-28
BR9000631A (pt) 1991-01-15
DE69004452T2 (de) 1994-03-10
EP0383091B1 (de) 1993-11-10
HUT53873A (en) 1990-12-28
EP0383091A1 (de) 1990-08-22
PT93063B (pt) 1996-09-30
US5054194A (en) 1991-10-08
CA2009735C (en) 2001-07-10
US5084467A (en) 1992-01-28
KR900012887A (ko) 1990-09-03
TR24175A (tr) 1991-05-01
KR0156570B1 (ko) 1998-11-16
AU4939090A (en) 1990-08-16
CA2009735A1 (en) 1990-08-13
DK0383091T3 (da) 1994-02-07
ZA901028B (en) 1990-11-28
PT93063A (pt) 1990-08-31
HU204787B (en) 1992-02-28

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