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DE68923305D1 - Elektrische Leitungen für elektronische Bauelemente. - Google Patents

Elektrische Leitungen für elektronische Bauelemente.

Info

Publication number
DE68923305D1
DE68923305D1 DE68923305T DE68923305T DE68923305D1 DE 68923305 D1 DE68923305 D1 DE 68923305D1 DE 68923305 T DE68923305 T DE 68923305T DE 68923305 T DE68923305 T DE 68923305T DE 68923305 D1 DE68923305 D1 DE 68923305D1
Authority
DE
Germany
Prior art keywords
electronic components
electric cables
cables
electric
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68923305T
Other languages
English (en)
Other versions
DE68923305T2 (de
Inventor
Laarhoven Josephus Martinu Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics NV filed Critical Philips Electronics NV
Application granted granted Critical
Publication of DE68923305D1 publication Critical patent/DE68923305D1/de
Publication of DE68923305T2 publication Critical patent/DE68923305T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76819—Smoothing of the dielectric

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drying Of Semiconductors (AREA)
DE68923305T 1988-03-30 1989-03-24 Elektrische Leitungen für elektronische Bauelemente. Expired - Fee Related DE68923305T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8807579A GB2216336A (en) 1988-03-30 1988-03-30 Forming insulating layers on substrates

Publications (2)

Publication Number Publication Date
DE68923305D1 true DE68923305D1 (de) 1995-08-10
DE68923305T2 DE68923305T2 (de) 1996-03-07

Family

ID=10634361

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68923305T Expired - Fee Related DE68923305T2 (de) 1988-03-30 1989-03-24 Elektrische Leitungen für elektronische Bauelemente.

Country Status (6)

Country Link
US (1) US4946550A (de)
EP (1) EP0335459B1 (de)
JP (1) JPH0210838A (de)
KR (1) KR890015376A (de)
DE (1) DE68923305T2 (de)
GB (1) GB2216336A (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2650472A1 (fr) * 1989-07-27 1991-02-01 Bull Sa Procede de depot d'une couche isolante sur une couche conductrice du reseau multicouche d'une carte de connexion de circuit integre de haute densite, et carte en resultant
US5166771A (en) * 1990-01-12 1992-11-24 Paradigm Technology, Inc. Self-aligning contact and interconnect structure
US5483104A (en) * 1990-01-12 1996-01-09 Paradigm Technology, Inc. Self-aligning contact and interconnect structure
US5290396A (en) * 1991-06-06 1994-03-01 Lsi Logic Corporation Trench planarization techniques
US5413966A (en) * 1990-12-20 1995-05-09 Lsi Logic Corporation Shallow trench etch
JPH0645327A (ja) * 1991-01-09 1994-02-18 Nec Corp 半導体装置の製造方法
US5248625A (en) * 1991-06-06 1993-09-28 Lsi Logic Corporation Techniques for forming isolation structures
US5225358A (en) * 1991-06-06 1993-07-06 Lsi Logic Corporation Method of forming late isolation with polishing
US5217926A (en) * 1992-01-23 1993-06-08 Micron Technology, Inc. Method of passivating a semiconductor wafer
US5384483A (en) * 1992-02-28 1995-01-24 Sgs-Thomson Microelectronics, Inc. Planarizing glass layer spaced from via holes
JP3060714B2 (ja) * 1992-04-15 2000-07-10 日本電気株式会社 半導体集積回路の製造方法
US6258497B1 (en) 1992-07-29 2001-07-10 International Business Machines Corporation Precise endpoint detection for etching processes
US5639688A (en) * 1993-05-21 1997-06-17 Harris Corporation Method of making integrated circuit structure with narrow line widths
US5846880A (en) * 1995-04-28 1998-12-08 Vanguard International Semiconductor Corporation Process for removing titanium nitride layer in an integrated circuit
WO1996038859A1 (en) * 1995-06-02 1996-12-05 Advanced Micro Devices, Inc. Surface conditioning insulating layer for fine line conductive pattern
US6004875A (en) 1995-11-15 1999-12-21 Micron Technology, Inc. Etch stop for use in etching of silicon oxide
US5792705A (en) * 1996-06-28 1998-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Optimized planarization process for SOG filled vias
US6127262A (en) * 1996-06-28 2000-10-03 Applied Materials, Inc. Method and apparatus for depositing an etch stop layer
US6083852A (en) * 1997-05-07 2000-07-04 Applied Materials, Inc. Method for applying films using reduced deposition rates
US5882535A (en) * 1997-02-04 1999-03-16 Micron Technology, Inc. Method for forming a hole in a semiconductor device
US5985768A (en) * 1997-04-30 1999-11-16 International Business Machines Corporation Method of forming a semiconductor
KR100240879B1 (ko) * 1997-05-17 2000-01-15 윤종용 반도체 장치의 평탄화 방법
US6048803A (en) * 1997-08-19 2000-04-11 Advanced Microdevices, Inc. Method of fabricating a semiconductor device having fluorine bearing oxide between conductive lines
US6265315B1 (en) * 1998-06-24 2001-07-24 Taiwan Semiconductor Manufacturing Company Method for improving chemical/mechanical polish uniformity over rough topography for semiconductor integrated circuits
US6566757B1 (en) * 1998-11-30 2003-05-20 Intel Corporation Stabilization of low dielectric constant film with in situ capping layer
KR100352909B1 (ko) * 2000-03-17 2002-09-16 삼성전자 주식회사 반도체소자의 자기정렬 콘택 구조체 형성방법 및 그에의해 형성된 자기정렬 콘택 구조체
US6612901B1 (en) 2000-06-07 2003-09-02 Micron Technology, Inc. Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6609947B1 (en) * 2000-08-30 2003-08-26 Micron Technology, Inc. Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates
US6908807B2 (en) 2002-03-26 2005-06-21 Micron Technology, Inc. Methods of forming semiconductor constructions
US7341502B2 (en) 2002-07-18 2008-03-11 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
JP2004006958A (ja) * 2003-07-17 2004-01-08 Sharp Corp Ｍｉｍキャパシタ及び高周波集積回路
US11621164B2 (en) * 2020-09-08 2023-04-04 Tokyo Electron Limited Method for critical dimension (CD) trim of an organic pattern used for multi-patterning purposes

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4299862A (en) * 1979-11-28 1981-11-10 General Motors Corporation Etching windows in thick dielectric coatings overlying semiconductor device surfaces
US4654113A (en) * 1984-02-10 1987-03-31 Fujitsu Limited Process for fabricating a semiconductor device
US4545852A (en) * 1984-06-20 1985-10-08 Hewlett-Packard Company Planarization of dielectric films on integrated circuits
JPH0642482B2 (ja) * 1984-11-15 1994-06-01 株式会社東芝 半導体装置の製造方法
US4605470A (en) * 1985-06-10 1986-08-12 Advanced Micro Devices, Inc. Method for interconnecting conducting layers of an integrated circuit device
JPS62200746A (ja) * 1986-02-28 1987-09-04 Nec Corp 半導体装置
JPS62247549A (ja) * 1986-04-18 1987-10-28 Mitsubishi Electric Corp 半導体装置の製造方法
JPH0828357B2 (ja) * 1986-04-28 1996-03-21 キヤノン株式会社 多層構造の形成方法

Also Published As

Publication number Publication date
DE68923305T2 (de) 1996-03-07
EP0335459A3 (de) 1991-02-06
GB8807579D0 (en) 1988-05-05
EP0335459A2 (de) 1989-10-04
KR890015376A (ko) 1989-10-30
EP0335459B1 (de) 1995-07-05
JPH0210838A (ja) 1990-01-16
US4946550A (en) 1990-08-07
GB2216336A (en) 1989-10-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee