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DE68916989D1 - Gerät zur Kantenbearbeitung von Platten. - Google Patents

Gerät zur Kantenbearbeitung von Platten.

Info

Publication number
DE68916989D1
DE68916989D1 DE68916989T DE68916989T DE68916989D1 DE 68916989 D1 DE68916989 D1 DE 68916989D1 DE 68916989 T DE68916989 T DE 68916989T DE 68916989 T DE68916989 T DE 68916989T DE 68916989 D1 DE68916989 D1 DE 68916989D1
Authority
DE
Germany
Prior art keywords
panels
edge processing
edge
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE68916989T
Other languages
English (en)
Inventor
Kameharu Seki
Isamu Kubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
Original Assignee
Nippon CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp filed Critical Nippon CMK Corp
Application granted granted Critical
Publication of DE68916989D1 publication Critical patent/DE68916989D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C3/00—Milling particular work; Special milling operations; Machines therefor
    • B23C3/12—Trimming or finishing edges, e.g. deburring welded corners
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/303752—Process
    • Y10T409/303808—Process including infeeding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/304144—Means to trim edge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/306664—Milling including means to infeed rotary cutter toward work
    • Y10T409/307224—Milling including means to infeed rotary cutter toward work with infeed control means energized in response to activator stimulated by condition sensor
    • Y10T409/307336—In response to work condition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/50—Planing
    • Y10T409/50246—Means for trimming edge [e.g., chamfering, scarfing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0259—Edge trimming [e.g., chamfering, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Milling Processes (AREA)
  • Milling, Broaching, Filing, Reaming, And Others (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
DE68916989T 1988-03-23 1989-01-25 Gerät zur Kantenbearbeitung von Platten. Expired - Lifetime DE68916989D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6867788A JPH0818172B2 (ja) 1988-03-23 1988-03-23 平板面取り方法と装置

Publications (1)

Publication Number Publication Date
DE68916989D1 true DE68916989D1 (de) 1994-09-01

Family

ID=13380588

Family Applications (2)

Application Number Title Priority Date Filing Date
DE68916989T Expired - Lifetime DE68916989D1 (de) 1988-03-23 1989-01-25 Gerät zur Kantenbearbeitung von Platten.
DE68918481T Expired - Lifetime DE68918481D1 (de) 1988-03-23 1989-01-25 Kantenbearbeitungsmethode für Platten.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE68918481T Expired - Lifetime DE68918481D1 (de) 1988-03-23 1989-01-25 Kantenbearbeitungsmethode für Platten.

Country Status (4)

Country Link
US (2) US4976573A (de)
EP (2) EP0333994B1 (de)
JP (1) JPH0818172B2 (de)
DE (2) DE68916989D1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE204528T1 (de) * 1995-06-10 2001-09-15 Rigips Gmbh Verfahren zum abfasen von gipskartonplatten
US5823694A (en) * 1995-11-10 1998-10-20 Seiko Epson Corporation Cutting device for cutting tape material and printing apparatus incorporating the cutting device
JPH09193086A (ja) * 1995-11-10 1997-07-29 Seiko Epson Corp テープ状部材の切断装置およびこれを備えた印刷装置
US5871313A (en) * 1996-10-01 1999-02-16 International Business Machines Corporation Precise self-aligning chamfer method and apparatus
US6517298B1 (en) * 1999-05-24 2003-02-11 Gerber Scientific Products, Inc. Method for selectively relieving sharp edges in tools used in die cutting sheet-type work material
DE10000469C2 (de) * 2000-01-07 2003-07-03 Schott Spezialglas Gmbh Verfahren zum fortlaufenden Ablängen von Zuschnitten aus einem kontinuierlich bewegten Endlosmaterial und zugehörige Vorrichtung
US20020084300A1 (en) * 2000-12-29 2002-07-04 Charles Elkins Apparatus and method for separating circuit boards
JP5475614B2 (ja) * 2010-10-28 2014-04-16 株式会社ノリタケカンパニーリミテド 鋼片の面取り研削方法および鋼片の面取り研削装置
WO2012077645A1 (ja) * 2010-12-08 2012-06-14 電気化学工業株式会社 硬質基板積層体の加工方法及び板状製品の製造方法
US9138814B2 (en) * 2012-07-05 2015-09-22 Apple Inc. Method for machining and related machining tool, machining apparatus, and computer code
WO2014040597A1 (de) * 2012-09-17 2014-03-20 Schaeffler Technologies AG & Co. KG Verfahren und anlage zum einbringen von vertiefungen in zu bearbeitende werkstückflächen mit hilfe mindestens einer werkzeugeinrichtung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2703511A (en) * 1948-03-18 1955-03-08 Thompson Prod Inc Machine for manufacturing impeller wheels
US3749625A (en) * 1971-08-12 1973-07-31 Gen Motors Corp Machining process
US4462147A (en) * 1978-04-20 1984-07-31 Trumpf America, Inc. Method for simultaneous machining of a stack of plate-like workpieces
JPS55157417A (en) * 1979-05-22 1980-12-08 Toshiba Corp Method, jig and tool for chamfering workpiece
US4718202A (en) * 1980-01-31 1988-01-12 Pacific Western Systems, Inc. Method and apparatus for rounding the edges of semiconductive wafers
JPS60191710A (ja) * 1983-12-19 1985-09-30 Nippon Shii M K Kk 印刷配線板の端子部面取方法
FR2561161B1 (fr) * 1984-03-14 1990-05-11 Rosa Sa Fermeture Procede de fabrication de lames rainurees ou moulurees telles que lames de volets, moulures de menuiserie ou de batiment et dispositif pour la mise en oeuvre de ce procede
SU1271678A1 (ru) * 1985-04-24 1986-11-23 Предприятие П/Я Р-6758 Способ обработки фасок

Also Published As

Publication number Publication date
EP0333995A2 (de) 1989-09-27
US4925347A (en) 1990-05-15
JPH0818172B2 (ja) 1996-02-28
EP0333994A2 (de) 1989-09-27
EP0333994A3 (en) 1990-08-22
EP0333994B1 (de) 1994-09-28
JPH01240213A (ja) 1989-09-25
EP0333995A3 (en) 1990-08-22
DE68918481D1 (de) 1994-11-03
US4976573A (en) 1990-12-11
EP0333995B1 (de) 1994-07-27

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Legal Events

Date Code Title Description
8332 No legal effect for de