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DE68908488D1 - Verfahren zur vorbereitung von polymeroberflaechen fuer eine nachfolgende plattierung, und daraus hergestellte metallplattierte kunststoffartikel. - Google Patents

Verfahren zur vorbereitung von polymeroberflaechen fuer eine nachfolgende plattierung, und daraus hergestellte metallplattierte kunststoffartikel.

Info

Publication number
DE68908488D1
DE68908488D1 DE8989109276T DE68908488T DE68908488D1 DE 68908488 D1 DE68908488 D1 DE 68908488D1 DE 8989109276 T DE8989109276 T DE 8989109276T DE 68908488 T DE68908488 T DE 68908488T DE 68908488 D1 DE68908488 D1 DE 68908488D1
Authority
DE
Germany
Prior art keywords
metal
polymer surfaces
preparing polymer
subsequent plating
plated plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8989109276T
Other languages
English (en)
Other versions
DE68908488T2 (de
Inventor
Donald Franklin Foust
Edward John Lamby
Bradley Ross Karas
William Vincent Dumas
Elihu Calvin Jerabek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Application granted granted Critical
Publication of DE68908488D1 publication Critical patent/DE68908488D1/de
Publication of DE68908488T2 publication Critical patent/DE68908488T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/924—Electrolytic coating substrate predominantly comprised of specified synthetic resin
    • Y10S205/926—Polyamide or polyimide, e.g. nylon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12389—All metal or with adjacent metals having variation in thickness
    • Y10T428/12396—Discontinuous surface component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
DE89109276T 1988-06-16 1989-05-23 Verfahren zur Vorbereitung von Polymeroberflächen für eine nachfolgende Plattierung, und daraus hergestellte metallplattierte Kunststoffartikel. Expired - Fee Related DE68908488T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/207,462 US4873136A (en) 1988-06-16 1988-06-16 Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom

Publications (2)

Publication Number Publication Date
DE68908488D1 true DE68908488D1 (de) 1993-09-23
DE68908488T2 DE68908488T2 (de) 1994-04-14

Family

ID=22770650

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89109276T Expired - Fee Related DE68908488T2 (de) 1988-06-16 1989-05-23 Verfahren zur Vorbereitung von Polymeroberflächen für eine nachfolgende Plattierung, und daraus hergestellte metallplattierte Kunststoffartikel.

Country Status (5)

Country Link
US (1) US4873136A (de)
EP (1) EP0346655B1 (de)
JP (1) JPH0243370A (de)
CA (1) CA1331542C (de)
DE (1) DE68908488T2 (de)

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Publication number Priority date Publication date Assignee Title
US5015329A (en) * 1988-11-07 1991-05-14 Jp Laboratories, Inc. Pre-swelling and etching of plastics for plating
US5049230A (en) * 1988-11-07 1991-09-17 Jp Laboratories, Inc. Single step pre-swelling and etching of plastics for plating
JPH0653261B2 (ja) * 1988-12-13 1994-07-20 日本ジーイープラスチックス株式会社 耐低温衝撃性を有する塗装された樹脂成形品及びそのような樹脂成形品の塗装方法
US4999251A (en) * 1989-04-03 1991-03-12 General Electric Company Method for treating polyetherimide substrates and articles obtained therefrom
US5108786A (en) * 1989-05-01 1992-04-28 Enthone-Omi, Inc. Method of making printed circuit boards
FR2646583B1 (fr) * 1989-05-01 1992-01-24 Enthone Corp Procede pour fabriquer des plaquettes a circuits imprimes
EP0419845A3 (en) * 1989-09-05 1991-11-13 General Electric Company Method for preparing metallized polyimide composites
NL8902886A (nl) * 1989-11-22 1991-06-17 Akzo Nv Laminaat ten behoeve van stroomloze metallisering alsmede een daarvan voorziene gedrukte schakeling en een werkwijze ter vervaardiging van een dergelijk laminaat.
US4959121A (en) * 1990-01-05 1990-09-25 General Electric Company Method for treating a polyimide surface for subsequent plating thereon
US5183534A (en) * 1990-03-09 1993-02-02 Amoco Corporation Wet-etch process and composition
US5213840A (en) * 1990-05-01 1993-05-25 Macdermid, Incorporated Method for improving adhesion to polymide surfaces
US5187241A (en) * 1990-05-15 1993-02-16 International Business Machines Corporation Isoimide modifications of a polyimide and reaction thereof with nucleophiles
US5133840A (en) * 1990-05-15 1992-07-28 International Business Machines Corporation Surface midification of a polyimide
US5441770A (en) * 1990-05-18 1995-08-15 Shipley Company Inc. Conditioning process for electroless plating of polyetherimides
US5279771A (en) * 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
US6121217A (en) 1990-11-05 2000-09-19 Ekc Technology, Inc. Alkanolamine semiconductor process residue removal composition and process
US7205265B2 (en) * 1990-11-05 2007-04-17 Ekc Technology, Inc. Cleaning compositions and methods of use thereof
US6242400B1 (en) 1990-11-05 2001-06-05 Ekc Technology, Inc. Method of stripping resists from substrates using hydroxylamine and alkanolamine
US6110881A (en) * 1990-11-05 2000-08-29 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
US20040018949A1 (en) * 1990-11-05 2004-01-29 Wai Mun Lee Semiconductor process residue removal composition and process
US6000411A (en) * 1990-11-05 1999-12-14 Ekc Technology, Inc. Cleaning compositions for removing etching residue and method of using
DE4205190C2 (de) * 1992-02-20 1994-07-14 Blasberg Oberflaechentech Verfahren und Mittel zur Konditionierung von Substraten oder Basismaterialien für die nachfolgende Metallisierung
US5264248A (en) * 1992-08-03 1993-11-23 General Electric Company Adhesion of metal coatings of polypyromellitimides
JP3286744B2 (ja) * 1993-05-24 2002-05-27 奥野製薬工業株式会社 非導電性材料表面に電気めっき層を直接形成する方法
US7144849B2 (en) * 1993-06-21 2006-12-05 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
KR100269830B1 (ko) * 1996-04-18 2000-10-16 포만 제프리 엘 구리표면 보호용 유기금속계 복합 피복물
ATE266107T1 (de) * 1998-11-13 2004-05-15 Lpw Chemie Gmbh Verfahren zur metallisierung einer kunststoffoberfläche
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
US6444140B2 (en) 1999-03-17 2002-09-03 Morton International Inc. Micro-etch solution for producing metal surface topography
US20040099637A1 (en) * 2000-06-16 2004-05-27 Shipley Company, L.L.C. Composition for producing metal surface topography
US20030178391A1 (en) * 2000-06-16 2003-09-25 Shipley Company, L.L.C. Composition for producing metal surface topography
US6569517B1 (en) 2000-11-17 2003-05-27 3M Innovative Properties Company Color tailorable pigmented optical bodies with surface metalization
DE102004047423C5 (de) * 2004-09-28 2011-04-21 AHC-Oberflächentechnik GmbH & Co. OHG Außenstromlos aufgebrachte Nickellegierung und ihre Verwendung
US7393461B2 (en) * 2005-08-23 2008-07-01 Kesheng Feng Microetching solution
EP1959029A4 (de) * 2005-12-06 2013-07-17 Ebara Udylite Kk Palladiumkomplex und katalysatorabgebende behandlungslösung damit
US8298620B2 (en) * 2008-05-13 2012-10-30 North Carolina Agricultural And Technical State University Methods of preparing thin films by electroless plating
KR20120027474A (ko) * 2009-06-08 2012-03-21 바스프 에스이 금속 피복을 위한 플라스틱 표면의 전처리를 위한 이온성 액체의 용도
US9765288B2 (en) * 2012-12-05 2017-09-19 Entegris, Inc. Compositions for cleaning III-V semiconductor materials and methods of using same
US20140227446A1 (en) * 2013-02-13 2014-08-14 Seiren Co., Ltd. Surface modifier for polyimide resin and surface-modifying method for polyimide resin
JP2018104740A (ja) * 2016-12-22 2018-07-05 ローム・アンド・ハース電子材料株式会社 無電解めっき方法
US20210102296A1 (en) * 2019-10-07 2021-04-08 State Research Institute Center For Physical Sciences And Technology Method for increasing surface adhesion in polyetherimide substrates
CN117878196A (zh) * 2024-03-12 2024-04-12 深圳市松柏科工股份有限公司 一种光伏太阳能n型氧化物半导体ito化学镀铜制作工艺

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DE3149919A1 (de) * 1981-12-11 1983-06-23 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zum haftfesten metallisieren von polyimid
DE3323476A1 (de) * 1982-07-01 1984-01-05 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen
US4425380A (en) * 1982-11-19 1984-01-10 Kollmorgen Technologies Corporation Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions
US4528245A (en) * 1984-02-27 1985-07-09 Allied Corporation Pretreatment of plastic materials for metal plating
US4790912A (en) * 1985-06-06 1988-12-13 Techno-Instruments Investments Ltd. Selective plating process for the electrolytic coating of circuit boards without an electroless metal coating
JPS621877A (ja) * 1985-06-27 1987-01-07 Agency Of Ind Science & Technol ポリエチレンテレフタレ−ト成形体の金属めつき方法
DE3612822A1 (de) * 1986-04-14 1987-10-15 Schering Ag Verfahren zur haftfesten metallisierung von polyetherimid
US4775449A (en) * 1986-12-29 1988-10-04 General Electric Company Treatment of a polyimide surface to improve the adhesion of metal deposited thereon

Also Published As

Publication number Publication date
CA1331542C (en) 1994-08-23
US4873136A (en) 1989-10-10
JPH0243370A (ja) 1990-02-13
DE68908488T2 (de) 1994-04-14
EP0346655A1 (de) 1989-12-20
EP0346655B1 (de) 1993-08-18

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Legal Events

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8339 Ceased/non-payment of the annual fee