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DE60308705D1 - Plattierungsprozess - Google Patents

Plattierungsprozess

Info

Publication number
DE60308705D1
DE60308705D1 DE60308705T DE60308705T DE60308705D1 DE 60308705 D1 DE60308705 D1 DE 60308705D1 DE 60308705 T DE60308705 T DE 60308705T DE 60308705 T DE60308705 T DE 60308705T DE 60308705 D1 DE60308705 D1 DE 60308705D1
Authority
DE
Germany
Prior art keywords
parts
ink
resistant
plate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60308705T
Other languages
English (en)
Other versions
DE60308705T2 (de
Inventor
Alan John Hopper
Mark Robert James
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Imaging Colorants Ltd
Original Assignee
Fujifilm Imaging Colorants Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Imaging Colorants Ltd filed Critical Fujifilm Imaging Colorants Ltd
Application granted granted Critical
Publication of DE60308705D1 publication Critical patent/DE60308705D1/de
Publication of DE60308705T2 publication Critical patent/DE60308705T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Glass Compositions (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
  • Chemically Coating (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60308705T 2002-09-20 2003-08-22 Plattierungsprozess Expired - Lifetime DE60308705T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0221891 2002-09-20
GBGB0221891.5A GB0221891D0 (en) 2002-09-20 2002-09-20 Process
PCT/GB2003/003679 WO2004028224A1 (en) 2002-09-20 2003-08-22 Plating process

Publications (2)

Publication Number Publication Date
DE60308705D1 true DE60308705D1 (de) 2006-11-09
DE60308705T2 DE60308705T2 (de) 2007-08-16

Family

ID=9944477

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60308705T Expired - Lifetime DE60308705T2 (de) 2002-09-20 2003-08-22 Plattierungsprozess

Country Status (11)

Country Link
US (1) US7314573B2 (de)
EP (1) EP1543703B1 (de)
JP (1) JP4392350B2 (de)
KR (1) KR100961713B1 (de)
CN (1) CN1695406A (de)
AT (1) ATE341187T1 (de)
AU (1) AU2003260730A1 (de)
DE (1) DE60308705T2 (de)
GB (1) GB0221891D0 (de)
TW (1) TWI317251B (de)
WO (1) WO2004028224A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE412714T1 (de) * 2003-05-30 2008-11-15 Fujifilm Imaging Colorants Ltd Verfahren zum ätzen einer metall- oder metalllegierung oberfläche
GB0324947D0 (en) * 2003-10-25 2003-11-26 Avecia Ltd Process
EP2915856B1 (de) * 2014-03-03 2019-10-16 Agfa-Gevaert Ätzfeste Tintenstrahltinten zur Herstellung von leitfähigen Strukturen
CN104494310B (zh) * 2014-09-16 2017-04-12 苏州锐发打印技术有限公司 用于太阳能电池网格导线制作的3d打印系统及控制方法
KR20250043600A (ko) * 2015-06-04 2025-03-28 카티바, 인크. 금속 표면 상에서 에치 레지스트 패턴의 제조 방법
US10806035B2 (en) 2015-08-13 2020-10-13 Kateeva, Inc. Methods for producing an etch resist pattern on a metallic surface
US10398034B2 (en) 2016-12-12 2019-08-27 Kateeva, Inc. Methods of etching conductive features, and related devices and systems
EP3786239B1 (de) * 2019-08-26 2023-11-15 Agfa-Gevaert Nv Strahlungshärtbare zusammensetzung für plattierungsanwendungen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4315985A (en) * 1972-11-30 1982-02-16 International Business Machines Corporation Fine-line circuit fabrication and photoresist application therefor
US4270985A (en) * 1978-07-21 1981-06-02 Dynachem Corporation Screen printing of photopolymerizable inks
US5270368A (en) * 1992-07-15 1993-12-14 Videojet Systems International, Inc. Etch-resistant jet ink and process
US5721007A (en) * 1994-09-08 1998-02-24 The Whitaker Corporation Process for low density additive flexible circuits and harnesses
JPH10282662A (ja) 1997-04-07 1998-10-23 Nippon Kayaku Co Ltd 液状フォトレジストインク組成物及びその硬化物

Also Published As

Publication number Publication date
EP1543703B1 (de) 2006-09-27
US20060049129A1 (en) 2006-03-09
EP1543703A1 (de) 2005-06-22
TWI317251B (en) 2009-11-11
TW200421952A (en) 2004-10-16
WO2004028224A1 (en) 2004-04-01
JP2005539389A (ja) 2005-12-22
US7314573B2 (en) 2008-01-01
CN1695406A (zh) 2005-11-09
AU2003260730A1 (en) 2004-04-08
KR20050071496A (ko) 2005-07-07
KR100961713B1 (ko) 2010-06-10
JP4392350B2 (ja) 2009-12-24
DE60308705T2 (de) 2007-08-16
GB0221891D0 (en) 2002-10-30
ATE341187T1 (de) 2006-10-15

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