[go: up one dir, main page]

DE60300669D1 - Bleifreie Weichlötlegierung - Google Patents

Bleifreie Weichlötlegierung

Info

Publication number
DE60300669D1
DE60300669D1 DE60300669T DE60300669T DE60300669D1 DE 60300669 D1 DE60300669 D1 DE 60300669D1 DE 60300669 T DE60300669 T DE 60300669T DE 60300669 T DE60300669 T DE 60300669T DE 60300669 D1 DE60300669 D1 DE 60300669D1
Authority
DE
Germany
Prior art keywords
lead
free soldering
soldering alloy
alloy
free
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60300669T
Other languages
English (en)
Other versions
DE60300669T2 (de
Inventor
Masazumi Amagai
Masako Watanabe
Kensho Murata
Osamu Munekata
Yoshitaka Toyoda
Minoru Ueshima
Tsukasa Ohnishi
Hiroshi Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002199666A external-priority patent/JP3852377B2/ja
Priority claimed from JP2002217925A external-priority patent/JP2004058085A/ja
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of DE60300669D1 publication Critical patent/DE60300669D1/de
Application granted granted Critical
Publication of DE60300669T2 publication Critical patent/DE60300669T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
DE60300669T 2002-07-09 2003-07-09 Bleifreie Weichlötlegierung Expired - Lifetime DE60300669T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002199666A JP3852377B2 (ja) 2002-07-09 2002-07-09 鉛フリーはんだ合金
JP2002199666 2002-07-09
JP2002217925A JP2004058085A (ja) 2002-07-26 2002-07-26 鉛フリーはんだ合金
JP2002217925 2002-07-26

Publications (2)

Publication Number Publication Date
DE60300669D1 true DE60300669D1 (de) 2005-06-23
DE60300669T2 DE60300669T2 (de) 2006-04-27

Family

ID=29782040

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60300669T Expired - Lifetime DE60300669T2 (de) 2002-07-09 2003-07-09 Bleifreie Weichlötlegierung

Country Status (3)

Country Link
US (1) US7029542B2 (de)
EP (1) EP1382413B1 (de)
DE (1) DE60300669T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006129713A1 (ja) * 2005-06-03 2006-12-07 Senju Metal Industry Co., Ltd. 鉛フリーはんだ合金
WO2006131979A1 (ja) * 2005-06-10 2006-12-14 Senju Metal Industry Co., Ltd. 無電解Ｎiめっき部のはんだ付け方法
TWI465312B (zh) * 2005-07-19 2014-12-21 Nihon Superior Co Ltd 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
US20070023910A1 (en) * 2005-07-29 2007-02-01 Texas Instruments Incorporated Dual BGA alloy structure for improved board-level reliability performance
JP5376553B2 (ja) * 2006-06-26 2013-12-25 日立金属株式会社 配線用導体及び端末接続部
CZ302231B6 (cs) * 2006-10-19 2011-01-05 Ceské vysoké ucení technické v Praze Fakulta elektrotechnická Zarízení pro simulaci vlivu rozdílných soucinitelu teplotní roztažnosti desky plošného spoje a pripojené bezvývodové soucástky na vlastnosti pájených a lepených spoju
US20080187391A1 (en) * 2007-02-01 2008-08-07 Applied Materials, Inc. Automation adjustment utilizing low melting point alloys
US20090123656A1 (en) * 2007-11-13 2009-05-14 Ernest Long Composition and method for controlling galvanic corrosion in printed circuit boards
US8975757B2 (en) * 2008-03-05 2015-03-10 Senju Metal Industry Co., Ltd. Lead-free solder connection structure and solder ball
US8012866B2 (en) * 2008-05-30 2011-09-06 Asm Assembly Automation Ltd Method of bonding semiconductor devices utilizing solder balls
CN107427968B (zh) * 2015-09-17 2020-11-24 富士电机株式会社 半导体装置用软钎焊材料
JP6374424B2 (ja) * 2016-03-08 2018-08-15 千住金属工業株式会社 はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手
EP3492217B1 (de) 2017-03-17 2021-03-03 Fuji Electric Co., Ltd. Lotmaterial
JP6349615B1 (ja) * 2017-10-03 2018-07-04 株式会社弘輝 はんだ合金、はんだ接合材料及び電子回路基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5520752A (en) 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
WO1997009455A1 (en) 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
US5863493A (en) 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
JP3575311B2 (ja) * 1998-01-28 2004-10-13 株式会社村田製作所 Ｐｂフリー半田および半田付け物品
JP2000015476A (ja) * 1998-06-29 2000-01-18 Ishikawa Kinzoku Kk 無鉛はんだ
WO2000076717A1 (fr) * 1999-06-11 2000-12-21 Nippon Sheet Glass Co., Ltd. Soudure sans plomb
JP3599101B2 (ja) 2000-12-11 2004-12-08 株式会社トッパンＮｅｃサーキットソリューションズ はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法
TW592872B (en) * 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy

Also Published As

Publication number Publication date
US20050036902A1 (en) 2005-02-17
EP1382413A1 (de) 2004-01-21
US7029542B2 (en) 2006-04-18
DE60300669T2 (de) 2006-04-27
EP1382413B1 (de) 2005-05-18

Similar Documents

Publication Publication Date Title
DE50309710D1 (de) Metallelektrode
GB2421030B (en) Solder alloy
DE10308779B8 (de) Bleifreie Kupferlegierung und deren Verwendung
DE60225282D1 (de) Lotzusammensetzung
DE60239180D1 (de) Weichlötpaste
EP1507879A4 (de) Nickelbasislegierung
GB2380964B (en) Lead-free solder paste
DE60221247D1 (de) Schweisshemmende oder deodorierende zusammensetzungen
AU2003209129A8 (en) Lead-free tin-silver-copper alloy solder composition
GB2406578B (en) Al-Cu alloy with high toughness
ATE479518T1 (de) Widerstandsschweissverfahren
EP1548143A4 (de) AMORPHE LEGIERUNG AUF Cu-BASIS
DE60217199D1 (de) Bleifreies Weichlot und Weichlotverbindung
EP1642670A4 (de) Lötpaste
MX259572B (es) Componente de metal plano.
GB2433944B (en) Solder alloy
EP1772225A4 (de) Bleifreie lötlegierung
EP1825011A4 (de) Bleifreie lötlegierung
DE60300669D1 (de) Bleifreie Weichlötlegierung
EP1576903A4 (de) Metallelement für regalbrettaufnahme
DE60213699D1 (de) Bleifreies Gleitlager
NO20040352L (no) Forfalskningssikker metallfolie
EP1824638A4 (de) Bleifreie lotlegierung
AU2003291473A1 (en) Lead-free copper alloys
EP1495830A4 (de) Lötlegierung und lötverbindung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition