DE60236563D1 - Eckige Substrate - Google Patents
Eckige SubstrateInfo
- Publication number
- DE60236563D1 DE60236563D1 DE60236563T DE60236563T DE60236563D1 DE 60236563 D1 DE60236563 D1 DE 60236563D1 DE 60236563 T DE60236563 T DE 60236563T DE 60236563 T DE60236563 T DE 60236563T DE 60236563 D1 DE60236563 D1 DE 60236563D1
- Authority
- DE
- Germany
- Prior art keywords
- substrates
- angular
- angular substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/60—Substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02035—Shaping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Magnetic Heads (AREA)
- Structure Of Printed Boards (AREA)
- Magnetic Record Carriers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001240028A JP4561950B2 (ja) | 2001-08-08 | 2001-08-08 | 角形基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60236563D1 true DE60236563D1 (de) | 2010-07-15 |
Family
ID=19070697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60236563T Expired - Lifetime DE60236563D1 (de) | 2001-08-08 | 2002-08-08 | Eckige Substrate |
Country Status (4)
Country | Link |
---|---|
US (1) | US7122280B2 (de) |
EP (1) | EP1283551B1 (de) |
JP (1) | JP4561950B2 (de) |
DE (1) | DE60236563D1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4561950B2 (ja) * | 2001-08-08 | 2010-10-13 | 信越化学工業株式会社 | 角形基板 |
DE10302611B4 (de) * | 2003-01-23 | 2011-07-07 | Siltronic AG, 81737 | Polierte Halbleiterscheibe und Verfahren zu deren Herstellung und Anordnung bestehend aus einer Halbleiterscheibe und einem Schild |
CN100545748C (zh) | 2003-03-20 | 2009-09-30 | Hoya株式会社 | 中间掩模用基板及其制造方法和光刻掩模板及其制造方法 |
JP4206850B2 (ja) * | 2003-07-18 | 2009-01-14 | 信越化学工業株式会社 | 露光用大型合成石英ガラス基板の製造方法 |
JP2005043836A (ja) * | 2003-07-25 | 2005-02-17 | Shin Etsu Chem Co Ltd | フォトマスクブランク用基板の選定方法 |
TWI329779B (en) | 2003-07-25 | 2010-09-01 | Shinetsu Chemical Co | Photomask blank substrate, photomask blank and photomask |
JP4786899B2 (ja) * | 2004-12-20 | 2011-10-05 | Hoya株式会社 | マスクブランクス用ガラス基板の製造方法,マスクブランクスの製造方法、反射型マスクブランクスの製造方法、露光用マスクの製造方法、反射型マスクの製造方法、及び半導体装置の製造方法 |
JP4731191B2 (ja) * | 2005-03-28 | 2011-07-20 | 富士通セミコンダクター株式会社 | 半導体装置及び半導体装置の製造方法 |
WO2016098452A1 (ja) * | 2014-12-19 | 2016-06-23 | Hoya株式会社 | マスクブランク用基板、マスクブランク及びこれらの製造方法、転写用マスクの製造方法並びに半導体デバイスの製造方法 |
JP2020163529A (ja) * | 2019-03-29 | 2020-10-08 | 株式会社荏原製作所 | 基板を保持するための研磨ヘッドおよび基板処理装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL256387A (de) | 1960-09-29 | |||
JPS6130374A (ja) * | 1984-07-23 | 1986-02-12 | Furukawa Electric Co Ltd:The | 板材表面の鏡面研摩法 |
JPS62213960A (ja) * | 1986-03-14 | 1987-09-19 | Hitachi Ltd | ラツピング治具 |
KR0174531B1 (ko) * | 1989-11-20 | 1999-04-01 | 이우에 사또시 | 마이크로 스트립 라인을 이용한 대역 필터 및 필터 특성 조정 방법 |
JP3134719B2 (ja) | 1995-06-23 | 2001-02-13 | 信越半導体株式会社 | 半導体ウェーハ研磨用研磨剤及び研磨方法 |
JP3534213B2 (ja) | 1995-09-30 | 2004-06-07 | コマツ電子金属株式会社 | 半導体ウェハの製造方法 |
CN1148727C (zh) * | 1996-09-30 | 2004-05-05 | Hoya株式会社 | 玻璃衬底、磁性载体以及磁性载体的制造方法 |
TW432518B (en) | 1997-04-03 | 2001-05-01 | Memc Electronic Materials Spa | Flattening process for semiconductor wafers |
US6049124A (en) | 1997-12-10 | 2000-04-11 | Intel Corporation | Semiconductor package |
JPH11204493A (ja) * | 1998-01-09 | 1999-07-30 | Komatsu Electron Metals Co Ltd | 半導体ウェハの製造方法 |
JP3039507B2 (ja) * | 1998-03-06 | 2000-05-08 | 日本電気株式会社 | 液晶表示装置及びその製造方法 |
JP2000186000A (ja) * | 1998-12-22 | 2000-07-04 | Speedfam-Ipec Co Ltd | シリコンウェーハ加工方法およびその装置 |
JP2000218481A (ja) * | 1999-01-27 | 2000-08-08 | Nippon Sheet Glass Co Ltd | ガラス板表面の筋状凹凸の除去方法および筋状凹凸を減じたガラス板 |
JP4025960B2 (ja) * | 2001-08-08 | 2007-12-26 | 信越化学工業株式会社 | 角形ホトマスク基板の研磨方法、角形ホトマスク基板、ホトマスクブランクス及びホトマスク |
JP4561950B2 (ja) * | 2001-08-08 | 2010-10-13 | 信越化学工業株式会社 | 角形基板 |
EP2317384B1 (de) * | 2002-04-11 | 2016-11-09 | Hoya Corporation | Reflektiver Maskenrohling, reflektive Maske und Verfahren zur Herstellung des Maskenrohlings und der Maske |
-
2001
- 2001-08-08 JP JP2001240028A patent/JP4561950B2/ja not_active Expired - Fee Related
-
2002
- 2002-08-08 US US10/214,113 patent/US7122280B2/en not_active Expired - Lifetime
- 2002-08-08 DE DE60236563T patent/DE60236563D1/de not_active Expired - Lifetime
- 2002-08-08 EP EP02255564A patent/EP1283551B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1283551A2 (de) | 2003-02-12 |
EP1283551B1 (de) | 2010-06-02 |
JP4561950B2 (ja) | 2010-10-13 |
US7122280B2 (en) | 2006-10-17 |
JP2003051472A (ja) | 2003-02-21 |
EP1283551A3 (de) | 2004-07-28 |
US20030031890A1 (en) | 2003-02-13 |
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