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DE60226406D1 - Leiterplatte und verfahren zu ihrer herstellung - Google Patents

Leiterplatte und verfahren zu ihrer herstellung

Info

Publication number
DE60226406D1
DE60226406D1 DE60226406T DE60226406T DE60226406D1 DE 60226406 D1 DE60226406 D1 DE 60226406D1 DE 60226406 T DE60226406 T DE 60226406T DE 60226406 T DE60226406 T DE 60226406T DE 60226406 D1 DE60226406 D1 DE 60226406D1
Authority
DE
Germany
Prior art keywords
pcb
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60226406T
Other languages
English (en)
Inventor
Toshihiro Nishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60226406D1 publication Critical patent/DE60226406D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
DE60226406T 2001-01-16 2002-01-11 Leiterplatte und verfahren zu ihrer herstellung Expired - Lifetime DE60226406D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001007338A JP3760771B2 (ja) 2001-01-16 2001-01-16 回路形成基板および回路形成基板の製造方法
PCT/JP2002/000133 WO2002056655A1 (fr) 2001-01-16 2002-01-11 Carte de circuit imprime et son procede de fabrication

Publications (1)

Publication Number Publication Date
DE60226406D1 true DE60226406D1 (de) 2008-06-19

Family

ID=18875101

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60226406T Expired - Lifetime DE60226406D1 (de) 2001-01-16 2002-01-11 Leiterplatte und verfahren zu ihrer herstellung

Country Status (7)

Country Link
US (2) US20030113522A1 (de)
EP (1) EP1353541B1 (de)
JP (1) JP3760771B2 (de)
CN (1) CN100377630C (de)
DE (1) DE60226406D1 (de)
TW (1) TW517504B (de)
WO (1) WO2002056655A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050019214A (ko) * 2003-08-18 2005-03-03 한국과학기술원 내장형 커패시터용 폴리머/세라믹 복합 페이스트 및 이를이용한 커패시터 제조방법
TWI272887B (en) * 2005-12-09 2007-02-01 High Tech Comp Corp Printed circuit board and manufacturing method thereof
CN1993018A (zh) * 2005-12-26 2007-07-04 宏达国际电子股份有限公司 印刷电路板及其制造方法
US7523545B2 (en) * 2006-04-19 2009-04-28 Dynamic Details, Inc. Methods of manufacturing printed circuit boards with stacked micro vias
JP5109283B2 (ja) * 2006-04-20 2012-12-26 パナソニック株式会社 回路基板の製造方法
JP5302635B2 (ja) * 2008-11-13 2013-10-02 パナソニック株式会社 多層配線基板
JP4973796B1 (ja) * 2011-04-27 2012-07-11 パナソニック株式会社 配線基板の製造方法
JP5749235B2 (ja) * 2012-09-25 2015-07-15 パナソニック株式会社 回路部品内蔵基板の製造方法
JP5942261B2 (ja) * 2012-09-28 2016-06-29 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板、プリント配線板
KR20150025245A (ko) * 2013-08-28 2015-03-10 삼성전기주식회사 인쇄회로기판용 동박 적층판 및 그의 제조방법

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5698136A (en) * 1980-01-08 1981-08-07 Kanegafuchi Chem Ind Co Ltd Continuous manufacture of laminated substance
US4513055A (en) * 1981-11-30 1985-04-23 Trw Inc. Controlled thermal expansion composite and printed circuit board embodying same
US4501787A (en) * 1983-04-29 1985-02-26 Westinghouse Electric Corp. Flame retardant B-staged epoxy resin prepregs and laminates made therefrom
US4963425A (en) * 1985-03-05 1990-10-16 Unisys Corporation Printed wiring board substrate for surface mounted components
US4937132A (en) * 1987-12-23 1990-06-26 Mitsubishi Gas Chemical Company, Inc. Laminating material for printed circuit board of low dielectric constant
US5045381A (en) * 1988-09-30 1991-09-03 Hitachi, Ltd. Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board
JPH02197190A (ja) * 1989-01-26 1990-08-03 Shin Kobe Electric Mach Co Ltd 多層印刷配線板
JPH07120858B2 (ja) * 1990-03-30 1995-12-20 株式会社日立製作所 多層プリント回路板およびその製造方法
TW210422B (de) * 1991-06-04 1993-08-01 Akzo Nv
US5284548A (en) * 1993-03-03 1994-02-08 Microelectronics And Computer Technology Corporation Process for producing electrical circuits with precision surface features
EP0755979A3 (de) * 1993-04-02 1997-06-18 Hitachi Ltd Hitzehärtende Harzzusammensetzungen und ihre Verwendung von Dünnfilmleiterplatten
JP2587596B2 (ja) * 1993-09-21 1997-03-05 松下電器産業株式会社 回路基板接続材とそれを用いた多層回路基板の製造方法
DE69412952T2 (de) * 1993-09-21 1999-05-12 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka Verbindungsteil eines Schaltungssubstrats und Verfahren zur Herstellung mehrschichtiger Schaltungssubstrate unter Verwendung dieses Teils
JPH08111587A (ja) * 1994-10-11 1996-04-30 Fujitsu Ltd 配線板構造及びその製造方法並びに半導体装置
JPH08316598A (ja) * 1995-05-16 1996-11-29 Matsushita Electric Ind Co Ltd プリント配線板およびその製造方法
JP3084352B2 (ja) * 1995-08-28 2000-09-04 太陽インキ製造株式会社 銅箔ラミネート方式ビルドアップ用絶縁樹脂組成物とこれを用いた多層プリント配線板の製造方法
JP3197213B2 (ja) * 1996-05-29 2001-08-13 松下電器産業株式会社 プリント配線板およびその製造方法
CN1267989C (zh) * 1996-09-12 2006-08-02 揖斐电株式会社 电路部件搭载用基板
TW410534B (en) * 1997-07-16 2000-11-01 Matsushita Electric Ind Co Ltd Wiring board and production process for the same
US6376049B1 (en) * 1997-10-14 2002-04-23 Ibiden Co., Ltd. Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
US6224965B1 (en) * 1999-06-25 2001-05-01 Honeywell International Inc. Microfiber dielectrics which facilitate laser via drilling

Also Published As

Publication number Publication date
WO2002056655A1 (fr) 2002-07-18
US20060210780A1 (en) 2006-09-21
US20030113522A1 (en) 2003-06-19
CN1456035A (zh) 2003-11-12
EP1353541A4 (de) 2005-07-20
TW517504B (en) 2003-01-11
EP1353541A1 (de) 2003-10-15
JP3760771B2 (ja) 2006-03-29
CN100377630C (zh) 2008-03-26
EP1353541B1 (de) 2008-05-07
JP2002217546A (ja) 2002-08-02

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8364 No opposition during term of opposition