DE60204745D1 - Verbindungseinrichtung zwischen Leiterplatten - Google Patents

Verbindungseinrichtung zwischen Leiterplatten

Info

Publication number: DE60204745D1
Authority: DE; Germany
Prior art keywords: printed circuit; circuit boards; connecting device; boards; printed
Prior art date: 2001-10-16
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE60204745T

Other languages

English (en)

Other versions

DE60204745T2 (de

Inventor

Toyota Kazuma

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Molex LLC

Original Assignee

Molex LLC

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-10-16

Filing date

2002-10-15

Publication date

2005-07-28

2002-10-15 Application filed by Molex LLC filed Critical Molex LLC

2005-07-28 Application granted granted Critical

2005-07-28 Publication of DE60204745D1 publication Critical patent/DE60204745D1/de

2006-05-18 Publication of DE60204745T2 publication Critical patent/DE60204745T2/de

2022-10-16 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board

DE60204745T 2001-10-16 2002-10-15 Verbindungseinrichtung zwischen Leiterplatten Expired - Fee Related DE60204745T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2001318086A JP3925147B2 (ja)	2001-10-16	2001-10-16	回路基板間の接続装置
JP2001318086		2001-10-16

Publications (2)

Publication Number	Publication Date
DE60204745D1 true DE60204745D1 (de)	2005-07-28
DE60204745T2 DE60204745T2 (de)	2006-05-18

Family

ID=19135858

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60204745T Expired - Fee Related DE60204745T2 (de)	2001-10-16	2002-10-15	Verbindungseinrichtung zwischen Leiterplatten

Country Status (5)

Country	Link
US (1)	US6739880B2 (de)
EP (1)	EP1303006B1 (de)
JP (1)	JP3925147B2 (de)
CN (1)	CN1412894A (de)
DE (1)	DE60204745T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4177215B2 (ja) *	2003-09-11	2008-11-05	矢崎総業株式会社	易解体取付構造およびそれを備えた電気接続箱
US6997736B2 (en) *	2004-03-26	2006-02-14	Tyco Electronics Corporation	Guide receptacle with tandem mounting features
US20060214284A1 (en) *	2005-03-24	2006-09-28	Stuart Haden	Apparatus and method for data capture
JP2006311723A (ja) *	2005-04-28	2006-11-09	Yazaki Corp	取付ブラケット構造
JP4556214B2 (ja) *	2006-07-07	2010-10-06	Ｓｍｋ株式会社	表面実装用ラグ端子のプリント基板への取り付け構造及びその取り付け方法
US7907419B2 (en) *	2007-10-17	2011-03-15	Tyco Electronics Corporation	Guide receptacle for tandem circuit board mating
US8572841B2 (en)	2008-03-19	2013-11-05	Harris Corporation	Printed wiring board assembly and related methods
US8044861B2 (en) *	2008-06-30	2011-10-25	Harris Corporation	Electronic device with edge surface antenna elements and related methods
TWI387426B (zh) *	2009-01-09	2013-02-21	Asustek Comp Inc	電子裝置
CN102290651A (zh) *	2011-07-26	2011-12-21	苏州洽成电子有限公司	一种pcb板信号连接结构
US9525224B1 (en) *	2015-08-03	2016-12-20	Hon Hai Precision Industry Co., Ltd.	Electrical connector and electronic system
US10167891B1 (en) *	2018-03-08	2019-01-01	International Business Machines Corporation	Self-reporting, grounded nut-clip

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS59230741A (ja) *	1983-06-15	1984-12-25	株式会社日立製作所	形状記憶複合材料
US5281149A (en) *	1992-07-06	1994-01-25	Petri Hector D	Grounding circuit board standoff
US6089882A (en) *	1996-11-27	2000-07-18	The Whitaker Corporation	Memory card connector with grounding clip
JP3269794B2 (ja) *	1997-08-08	2002-04-02	タイコエレクトロニクスアンプ株式会社	回路基板相互間の接続装置
TW394465U (en) *	1998-12-28	2000-06-11	Hon Hai Prec Ind Co Ltd	Electronic card connector
US6038140A (en) *	1998-12-31	2000-03-14	Petri; Hector D.	Grounding circuit board standoff
TW462545U (en) *	2000-12-15	2001-11-01	Hon Hai Prec Ind Co Ltd	Electronic card connector

2001
- 2001-10-16 JP JP2001318086A patent/JP3925147B2/ja not_active Expired - Fee Related
2002
- 2002-10-08 US US10/266,721 patent/US6739880B2/en not_active Expired - Fee Related
- 2002-10-12 CN CN02152907.8A patent/CN1412894A/zh active Pending
- 2002-10-15 DE DE60204745T patent/DE60204745T2/de not_active Expired - Fee Related
- 2002-10-15 EP EP02023122A patent/EP1303006B1/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
DE60204745T2 (de)	2006-05-18
JP3925147B2 (ja)	2007-06-06
US20030082935A1 (en)	2003-05-01
EP1303006A3 (de)	2004-07-14
EP1303006B1 (de)	2005-06-22
US6739880B2 (en)	2004-05-25
CN1412894A (zh)	2003-04-23
EP1303006A2 (de)	2003-04-16
JP2003123875A (ja)	2003-04-25

Publication	Publication Date	Title
DE60232383D1 (de)	2009-06-25	Mehrschichtige Leiterplatte
FI20022140A (fi)	2003-06-11	Joustava painettu piirilevy
FR2828587B1 (fr)	2004-12-31	Connecteur de carte de circuit imprime
DE60045566D1 (de)	2011-03-03	Mehrschicht-Leiterplatte
DE60218101D1 (de)	2007-03-29	Hochfrequenzschaltungsmodul
DE60232945D1 (de)	2009-08-27	Elektronisches Gerät
DE60135963D1 (de)	2008-11-13	Mehrschichtelektronikbauteil
SG107605A1 (en)	2004-12-29	Wired circuit board
DE69942711D1 (de)	2010-10-07	Mehrschichtige gedruckte Leiterplatte
DE60125269D1 (de)	2007-02-01	Steckverbinder für flexible Leiterplatten
DE60039569D1 (de)	2008-09-04	Gedruckte Leiterplatte
DE10291003D2 (de)	2004-04-15	Mehrschichtige Leiterplatte
DE60131485D1 (de)	2008-01-03	Leiterplatte
DE60143235D1 (de)	2010-11-25	Mehrschichtige Leiterplatte
TW487272U (en)	2002-05-11	Multilayer circuit boards
DE60119194D1 (de)	2006-06-08	Leiterplattenanordnung
DE60204745D1 (de)	2005-07-28	Verbindungseinrichtung zwischen Leiterplatten
DE60203191D1 (de)	2005-04-14	Verbindungsschaltkreis
DE60137310D1 (de)	2009-02-26	Leiterplatte
DE69939157D1 (de)	2008-09-04	Gedruckte Leiterplatte
DE60219262D1 (de)	2007-05-16	Verbindungsanordnung für eine flexibele Leiterplatte
GB0227525D0 (en)	2002-12-31	Printed circuit board with test points
DE60020193D1 (de)	2005-06-23	Mehrschichtige Leiterplatte
DE69938982D1 (de)	2008-08-07	Mehrlagen Gedruckteschaltungsplatte
GB2371411B (en)	2003-03-05	Circuit board mount

Legal Events

Date	Code	Title	Description
2006-07-20	8364	No opposition during term of opposition
2006-08-17	8339	Ceased/non-payment of the annual fee