DE60142600D1 - Entwicklungsverfahren und -vorrichtung - Google Patents

Entwicklungsverfahren und -vorrichtung

Info

Publication number: DE60142600D1
Authority: DE; Germany
Prior art keywords: development process; development
Prior art date: 2000-06-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60142600T

Other languages

English (en)

Inventor

Akira Nishiya

Kazuo Sakamoto

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Tokyo Electron Ltd

Original Assignee

Tokyo Electron Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-06-13

Filing date

2001-06-12

Publication date

2010-09-02

2001-06-12 Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd

2010-09-02 Application granted granted Critical

2010-09-02 Publication of DE60142600D1 publication Critical patent/DE60142600D1/de

2021-06-13 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
- G03F7/3028—Imagewise removal using liquid means from a wafer supported on a rotating chuck characterised by means for on-wafer monitoring of the processing

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Photosensitive Polymer And Photoresist Processing (AREA)
Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

DE60142600T 2000-06-13 2001-06-12 Entwicklungsverfahren und -vorrichtung Expired - Lifetime DE60142600D1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2000176777		2000-06-13

Publications (1)

Publication Number	Publication Date
DE60142600D1 true DE60142600D1 (de)	2010-09-02

Family

ID=18678464

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60142600T Expired - Lifetime DE60142600D1 (de)	2000-06-13	2001-06-12	Entwicklungsverfahren und -vorrichtung

Country Status (6)

Country	Link
US (1)	US6706321B2 (de)
EP (1)	EP1164438B1 (de)
KR (1)	KR100873720B1 (de)
DE (1)	DE60142600D1 (de)
SG (1)	SG103292A1 (de)
TW (1)	TW505957B (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4464763B2 (ja) *	2004-08-20	2010-05-19	東京エレクトロン株式会社	現像装置及び現像方法
US7651306B2 (en)	2004-12-22	2010-01-26	Applied Materials, Inc.	Cartesian robot cluster tool architecture
US7396412B2 (en)	2004-12-22	2008-07-08	Sokudo Co., Ltd.	Coat/develop module with shared dispense
US7819079B2 (en)	2004-12-22	2010-10-26	Applied Materials, Inc.	Cartesian cluster tool configuration for lithography type processes
US7798764B2 (en)	2005-12-22	2010-09-21	Applied Materials, Inc.	Substrate processing sequence in a cartesian robot cluster tool
US7699021B2 (en)	2004-12-22	2010-04-20	Sokudo Co., Ltd.	Cluster tool substrate throughput optimization
US7662436B1 (en) *	2005-05-27	2010-02-16	Infineon Technologies Ag	Method of spin coating a film of non-uniform thickness
KR100757882B1 (ko) *	2006-01-13	2007-09-11	세메스 주식회사	기판의 감광막 제거 방법
TWI359456B (en) *	2006-12-15	2012-03-01	Lam Res Ag	Device and method for wet treating plate-like arti
JP5096849B2 (ja) *	2007-09-13	2012-12-12	株式会社Ｓｏｋｕｄｏ	基板処理装置および基板処理方法
JP4893799B2 (ja) *	2009-10-23	2012-03-07	東京エレクトロン株式会社	現像装置、現像方法及び記憶媒体
KR101337368B1 (ko)	2010-10-27	2013-12-05	엘지디스플레이 주식회사	코팅장치 및 이를 이용한 코팅막 형성방법
JP5789546B2 (ja) *	2011-04-26	2015-10-07	東京エレクトロン株式会社	塗布処理装置、塗布現像処理システム、並びに塗布処理方法及びその塗布処理方法を実行させるためのプログラムを記録した記録媒体
JP5845633B2 (ja) *	2011-05-26	2016-01-20	セイコーエプソン株式会社	液滴吐出装置
JP5940022B2 (ja) *	2013-06-13	2016-06-29	三菱電機株式会社	半導体装置の製造方法
CN105204300A (zh) *	2015-09-01	2015-12-30	湘能华磊光电股份有限公司	用于制作发光二极管的光刻显影方法
CN105116694B (zh) *	2015-09-25	2017-12-22	京东方科技集团股份有限公司	一种掩膜版、曝光装置及曝光方法
JP6672967B2 (ja) *	2016-04-01	2020-03-25	東京エレクトロン株式会社	現像方法、現像装置及び記憶媒体
KR102768118B1 (ko) *	2021-12-27	2025-02-13	세메스 주식회사	기판 처리 장치 및 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2704403B2 (ja) *	1986-11-21	1998-01-26	セイコーインスツルメンツ株式会社	半導体薄膜の製造方法
US5689749A (en) *	1994-08-31	1997-11-18	Tokyo Electron Limited	Apparatus for developing a resist-coated substrate
JP2874155B2 (ja)	1994-11-02	1999-03-24	株式会社フロンテック	レジスト現像装置
US5821035A (en)	1996-03-06	1998-10-13	Sony Corporation	Resist developing apparatus and resist developing method
TW359854B (en)	1996-06-21	1999-06-01	Tokyo Electron Ltd	Processing apparatus and processing method
KR100283442B1 (ko)	1996-12-26	2001-04-02	이시다 아키라	현상장치및현상방법
US5962070A (en)	1997-09-25	1999-10-05	Dainippon Screen Mfg. Co., Ltd.	Substrate treating method and apparatus
KR100537040B1 (ko) *	1998-08-19	2005-12-16	동경 엘렉트론 주식회사	현상장치
US6248175B1 (en) *	1999-10-29	2001-06-19	Advanced Micro Devices, Inc.	Nozzle arm movement for resist development
US6270579B1 (en) *	1999-10-29	2001-08-07	Advanced Micro Devices, Inc.	Nozzle arm movement for resist development

2001
- 2001-05-31 US US09/867,688 patent/US6706321B2/en not_active Expired - Fee Related
- 2001-06-04 TW TW090113473A patent/TW505957B/zh not_active IP Right Cessation
- 2001-06-04 SG SG200103332A patent/SG103292A1/en unknown
- 2001-06-11 KR KR1020010032415A patent/KR100873720B1/ko not_active IP Right Cessation
- 2001-06-12 DE DE60142600T patent/DE60142600D1/de not_active Expired - Lifetime
- 2001-06-12 EP EP01113532A patent/EP1164438B1/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
KR100873720B1 (ko)	2008-12-12
EP1164438A1 (de)	2001-12-19
KR20010112595A (ko)	2001-12-20
EP1164438B1 (de)	2010-07-21
SG103292A1 (en)	2004-04-29
US6706321B2 (en)	2004-03-16
US20010050050A1 (en)	2001-12-13
TW505957B (en)	2002-10-11

Publication	Publication Date	Title
DE60139045D1 (de)	2009-08-06	Kommunikationsvorrichtung und Kommunikationsverfahren
DE60044764D1 (de)	2010-09-16	Durchgangs -Vorrichtung und -Verfahren
DE60004573D1 (de)	2003-09-25	Zeicheneingabevorrichtung und -methoden
DE60133359D1 (de)	2008-05-08	Informationsverarbeitungsvorrichtung und verarbeitungsverfahren
DE60130178D1 (de)	2007-10-11	Programmentwicklungsunterstützungsgerät
DE60109616D1 (de)	2005-04-28	Immunoassay und immunoassayvorrichtung
PT1340062E (pt)	2013-01-25	Método e dispositivo de armazenamento criogénico
DE50112910D1 (de)	2007-10-04	Navigationsverfahren und -vorrichtung
DE60226533D1 (de)	2008-06-26	Verbessertes Druckverfahren und -gerät
DE60143999D1 (de)	2011-03-24	Druckvorrichtung und Druckverfahren
DE60142600D1 (de)	2010-09-02	Entwicklungsverfahren und -vorrichtung
DE60104583D1 (de)	2004-09-09	Bördelvorrichtung und Bördelverfahren
DE60126075D1 (de)	2007-03-08	Auftragsvorrichtung
DE60229938D1 (de)	2009-01-02	ENTWICKLUNGSEINRICHTUNG UND BILDformungsgerät
DE60132528D1 (de)	2008-03-13	Microlötverfahren und -vorrichtung
DE60127017D1 (de)	2007-04-19	Aufschlämmungsrückfluss-Vorrichtung
DE50112616D1 (de)	2007-07-26	Faltverfahren und -vorrichtung
NO20005524L (no)	2001-08-29	Ror-i-roranordning
DE60044426D1 (de)	2010-07-01	Weiterleitungsvorrichtung und -Verfahren
DE60118450D1 (de)	2006-05-18	Kommunikationsverfahren und Kommunikationsgerät
DE60139736D1 (de)	2009-10-15	Kommunikationsverfahren und Gerät
DE60141890D1 (de)	2010-06-02	Biegeverfahren und biegevorrichtung
DE60026363D1 (de)	2006-04-27	Elektroforetische trennungsvorrichtung und zugehöriges verwendungsverfahren
DE60043876D1 (de)	2010-04-08	Kommunikationsentwicklungs -Verfahren und -Vorrichtung
DE60134222D1 (de)	2008-07-10	Biegeverfahren und Biegevorrichtung